Abstract:
A MASKED PHOTOCATHODE IS PROVIDED HAVING ON A RADIATION TRANSMISSIVE SUPPORT A MASK PATTERN OF A MATERIAL THAT ABSORBS OR REFLECTS SENSITIZING RADIATION PARTICULARLY IN THE ULTRAVIOLET. IN ONE FORM, THE MASK IS FORMED IN A PROCESS THAT INCLUDES AT LEAST PARTIAL OXIDATION OF A METAL LAYER PATTERN. ALTERNATIVELY, A MASK PATTERN THAT BLOCKS ALL RADIATION WITH HIGH REFLECTIVITY MAY BE FORMED BY EMPLOYING A METAL WITH A SUBSEQUENT INSULATING LAYER, SUCH AS OF AN OXIDE OF THE METAL OR A SEPARATELY DEPOSITED INSULATOR, FOR PROTECTION FROM THE PHOTOCATHODE. IN ANOTHER FORM THE PHTOEMISSIVE LAYER MAY BE DEPOSITED DIRECTLY ON THE TRANSMISSIVE SUPPORT AND HAVE ON ITS SURFACE A PATTERN OF ORGANIC MATERIAL TO PROVIDE THE MASK FOR ELECTRONS ON THE TARGET SIDE OF THE CATHODE AS WELL AS TO PREVENT ANY RADIATION REFLECTED FROM THE TARGET FROM IMPINGING ON AREAS FROM WHICH PHOTOEMISSION IS NOT DESIRED.
Abstract:
A SHADOW MASK PARTICULARLY FOR USE WITH ULTRAVIOLET SENSITIVE PHOTOCATHODES IS PROVIDED OF A MATERIAL THAT DOES NOT TRANSMIT ULTRAVIOLET RADIATION AND WHICH, FURTHERMORE, DOES NOT ABSORB OTHER WAVELENTH RADIATION, SUCH AS VISIBLE. THIS PERMITS THE PHOTOCATHODE TO BE IMMEDIATELY ADJACENT THE MASK BECAUSE WHEN EXPOSED BY A HIGH INTENSITY LIGHT SOURCE APPRECIABLE HEATING IN THE MASK MATERIAL THAT WOULD DAMAGE THE PHOTOCATHODE DOES NOT OCCUR. THE MASK MAY BE, FOR EXAMPLE, AN ULTRAVIOLET ABSORBER, SUCH AS TITANIUM IONS IN A TITANIUM OXIDE.
Abstract:
A micro-miniature electronic component and particularly an electromask of high resolution is made by first applying a metal layer, of a composition, such as titanium, capable of being etched by an etchant at a relatively high rate and capable of becoming relatively etchant resistant on oxidation, over a major surface of a substrate. A desired component pattern is then defined, preferably by selective exposure with an electron beam, in a resist layer directly overlaid on the metal layer by difference in solubility between exposed and unexposed portions of the resist. The desired component pattern is then transferred to the metal layer by (i) removing less soluble portions of the resist layer to expose first portions of the metal layer, (ii) applying over said exposed first portions and the remaining portions of resist layer an oxidation masking layer of a composition such as aluminum, being relatively oxidation resistant compared to the metal layer and being relatively etchable compared to the metal layer when oxidized, (iii) removing the remaining portions of the resist layer and overlying oxidation masking layer to expose second portions of the metal layer, (iv) selectively oxidizing the second portions of the metal layer to become relatively etchant resistant while said first portions of the metal layer are masked against oxidation by the masking layer, and (v) removing the remaining portions of the oxidation masking layer and underlying unoxidized first portions of the metal layer by etching.
Abstract:
A SYSTEM FOR FABRICATION OF PATTERNS IS SUBSTRATES SUCH AS INTERGRATED CIRCUITS ON SILICON WAFERS, EMPLOYS A SCANNING ELECTRON MICROSCOPE TO PRODUCE A PHOTOCATHODE HAVING THE DESIRED SURFACE PATTERN THEREIN AND THE PHOTCATHODE IS THEN EMPLOYED TO PRODUCE REPLICATE PATTERNS ON A PLURALITY OF SUBSTRATES. THE PHOTOCATHODE PRODUCES A PATTERNED ELECTRON BEAM WHICH IMPINGES ON AN ELECTRON RESIST ON A SUBSTRATE TO PROVIDE FOR DIFFERENTIAL SOLUBILITY BETWEEN THE ELECTRON BEAM TTREATED ZND UNTREATED RESIST AREAS. REMOVING THE MORE SOLUBLE PORTION OF THE ELECTRON RESIST AFTER TREATMENT BY THE PHOTOCATHODE, EXPOSES THE SUBSTRATE SURFACE WHICH IS THEN ALTERED EITHER PHYSICALLY OR CHEMICALLY. ONE OR MORE HIGHLY PRECISE PATTERNS BOTH IN THEIR LOCATION AND CONFIGURATION, MAY BE PRODUCED ON THE SURFACE OF A SUBSTRATE BY APPLYING A SERIES OF SUCCESSIVE ELECTRON RESISTS TO THE SUBSTRATE AND USING A PLURALITY OF PHOTOCATHODES.
Abstract:
A SHADOW MASK PARTICULARLY FOR USE WITH ULTRAVIOLET SENSITIVE PHOTOCATHODES IS PROVIDED OF A MATERIAL THAT DOES NOT TRANSMIT ULTRAVIOLET RADIATION AND WHICH, FURTHERMORE, DOES NOT ABSORBS OTHER WAVELENGTH RADIATION, SUCH AS VISIBLE. THIS PERMITS THE PHOTOCATHODE TO BE IMMEDIATELY ADJACENT THE MASK BECAUSE WHEN EXPOSED BY A HIGHLY INTENSITY LIGHT
SOURCE APPRECIABLE HEATING IN THE MASK MATERIAL THAT WOULD DAMAGE THE PHOTOCATHODE DOES NOT OCCUR. THE MASK MAY BE, FOR EXAMPLE, AN ULTRAVILET ABSORBER, SUCH AS TITANIUM IONS IN A TITANIUM OXIDE.
Abstract:
A process for the fabrication of semiconductor devices is described utilizing an insulating layer such as silicon dioxide for diffusion masks and contact mask wherein openings in the insulating layer are produced by etching following selective bombardment with particles such as electrons without the use of conventional etch-resistant materials such as photoresists.
Abstract:
IN SELECTIVE ETCHING BY THE BOMBARDMENT ENHANCE ETCHING RATE (BEER) EFFECT, A METAL LAYER ON THE BON BARDMENT INSULATOR IS USED TO PROVIDE INCREASED ETCH EN HANCEMENT. THE METAL LAYER ALSO MAY SERVE AS AN ELEC TRODE IN BIASING THE STRUCTURE TO PRODUCE A BEAM INDUCE CURRENT FROM WHICH THE APPLIED DOSE IS INDICATED.
Abstract:
A method and apparatus are provided for alignment of an electron beam with precisely located areas of a major surface of a member. Marks of predetermined shape are formed of cathodoluminescent material and are positioned adjacent the major surface of the member which is preferably substantially transparent to the cathodoluminescense generated by the marks. An electron beam to be aligned has at least one alignment beam portion of a predetermined cross-sectional shape and preferably corresponds in size to the alignment accuracy desired. The cathodoluminescence emissions detected by a detector means are preferably positioned adjacent the opposite surface of the member. The position of the electron beam is moved relative to the member while continuing said detection until the emissions detected indicate alignment of the alignment beam portion with a corresponding mark. Preferably, said alignment method is used in producing a very accurate component pattern in an electroresist layer supported by a member utilizing either a scanning electron beam or an electron image projection system for the electron radiation beam, and most preferably in the making of a novel photocathode source, which can itself be used in the alignment of a patterned electron beam with a member.
Abstract:
The invention is an array of condensing lense for use in image tube pattern fabricating applications to provide selective and intensive illuminations of individual electron emitting sources of a multiple electron beam photocathode source.