Abstract:
A bidirectional semiconductor switch is provided with improved dV/dt capability by electrically connecting two thyristors in reverse parallel. A blocking circuit comprising at least one acoustic surface wave device is provided for electrically isolating the thyristors from each other and from a control circuit producing the control or gating signals for the thyristors. Electrical means such as ohmic leads enable the control signals outputted from the surface wave device to be separately fed to gate the thyristors. Preferably, a single acoustic surface wave device is utilized having a transmitter transducer positioned intermediate of two receiver transducers and capable of transmitting an acoustic surface wave in opposite directions through an insulator base member to the receiver transducers.
Abstract:
A SYSTEM FOR FABRICATION OF PATTERNS IS SUBSTRATES SUCH AS INTERGRATED CIRCUITS ON SILICON WAFERS, EMPLOYS A SCANNING ELECTRON MICROSCOPE TO PRODUCE A PHOTOCATHODE HAVING THE DESIRED SURFACE PATTERN THEREIN AND THE PHOTCATHODE IS THEN EMPLOYED TO PRODUCE REPLICATE PATTERNS ON A PLURALITY OF SUBSTRATES. THE PHOTOCATHODE PRODUCES A PATTERNED ELECTRON BEAM WHICH IMPINGES ON AN ELECTRON RESIST ON A SUBSTRATE TO PROVIDE FOR DIFFERENTIAL SOLUBILITY BETWEEN THE ELECTRON BEAM TTREATED ZND UNTREATED RESIST AREAS. REMOVING THE MORE SOLUBLE PORTION OF THE ELECTRON RESIST AFTER TREATMENT BY THE PHOTOCATHODE, EXPOSES THE SUBSTRATE SURFACE WHICH IS THEN ALTERED EITHER PHYSICALLY OR CHEMICALLY. ONE OR MORE HIGHLY PRECISE PATTERNS BOTH IN THEIR LOCATION AND CONFIGURATION, MAY BE PRODUCED ON THE SURFACE OF A SUBSTRATE BY APPLYING A SERIES OF SUCCESSIVE ELECTRON RESISTS TO THE SUBSTRATE AND USING A PLURALITY OF PHOTOCATHODES.
Abstract:
A method and apparatus are provided for alignment of an electron beam with precisely located areas of a major surface of a member. Marks of predetermined shape are formed of cathodoluminescent material and are positioned adjacent the major surface of the member which is preferably substantially transparent to the cathodoluminescense generated by the marks. An electron beam to be aligned has at least one alignment beam portion of a predetermined cross-sectional shape and preferably corresponds in size to the alignment accuracy desired. The cathodoluminescence emissions detected by a detector means are preferably positioned adjacent the opposite surface of the member. The position of the electron beam is moved relative to the member while continuing said detection until the emissions detected indicate alignment of the alignment beam portion with a corresponding mark. Preferably, said alignment method is used in producing a very accurate component pattern in an electroresist layer supported by a member utilizing either a scanning electron beam or an electron image projection system for the electron radiation beam, and most preferably in the making of a novel photocathode source, which can itself be used in the alignment of a patterned electron beam with a member.
Abstract:
A micropattern is rapidly located and produced with precision on a major surface of a member with a scanning electron microscope. The major surface of the member is prepared with an electron resist layer. The electron beam of the scanning electron microscope is located at successive coordinate address positions at the major surface by address generator means and low speed deflection means for irradiation of a precision pattern in the electron resist layer by contiguous subscans. At each coordinate address, the electron beam is moved through a subpattern about the coordinate address position by a subscan generator means and high speed deflection means. Preferably, the electron beam is rapidly stabilized at each address position by generating compensating electrical signals related to transient errors from the low speed deflection means on inputting the address signals, and inputting the compensating electrical signals to the high speed deflection means.