摘要:
A method of handling a wafer for through-wafer plasma etching includes lateral support provided between a handle wafer and a product wafer without wafer bonding or an adhesive film using mating mechanical structures. The product wafer is easily separated from the handle wafer following etching without stripping or cleaning. Because the connection between the wafers is mechanical, not from an adhesive layer/bonded layer, a wafer can be etched, inspected, and subsequently continue to be etched without the hindrance of repeated bonding, separation, and cleaning. A non-bonded support for released devices following a through-etch process is also provided.
摘要:
A microactuator is formed by defining stator and rotor regions on a wafer. Isolation barriers are formed in the stator and rotor regions to define a isolation regions. Conductive suspension beam are formed between the first and second isolation regions, and wafer material between the stator and rotor regions is removed to form a stator and a rotor. The microactuator is arranged to position a load device having an electrical component. The suspension beams support the rotor and load device and provide electrical connection between the stator and rotor for the microactuator and/or the load device.
摘要:
A slider for carrying and finely adjusting both a radial position and a flying height of a transducing head with respect to a track of a rotatable disc includes a stator portion carried by a support structure such as a flexure of a disc drive system. A plurality of springs extend from the stator portion and are flexible in a lateral direction (for radial positioning) and in a vertical direction (for flying height control). A rotor portion is connected to the stator portion by the plurality of springs. The rotor portion carries the transducing head. The stator portion includes a plurality of stator electrodes, and the rotor portion includes a plurality of rotor electrodes suspended between the stator electrodes. Selected voltages are applied to the stator electrodes and the rotor electrodes to create a selected force in the lateral and vertical directions for moving the rotor portion with respect to the stator portion to finely adjust the radial position and flying height of the transducing head.
摘要:
A method for fabricating an integrated coil-on-keeper assembly for use in a magnetic circuit to actuate a microactuator. The assembly is formed on a keeper substrate by patterning an insulator layer, plating at least one coil layer and patterning another insulator layer on top of each coil layer. The keeper substrate is etched to form the top keeper of the coil-on-keeper assembly.
摘要:
A microactuator is built at the slider level to achieve high resolution positioning of a transducing head with respect to a track of a rotatable disc having a plurality of concentric tracks in a disc drive system. The slider includes a main body carried by a flexure. A stator portion extends from the main body, and a plurality of beams extend from the stator portion, the beams being flexible in a lateral direction. A rotor portion is connected to the stator portion by the plurality of beams, forming a gap between the stator portion and the rotor portion. The rotor portion carries the transducing head. A plurality of stator electrodes are formed on the stator portion, and a plurality of rotor electrodes are formed on the rotor portion to confront the stator electrodes across the gap. Control circuitry applies selected voltages to the stator electrodes and the rotor electrodes to create a force in the lateral direction for moving the rotor portion with respect to the stator portion of the slider, thereby finely positioning the transducing head.
摘要:
A transducer assembly in which an electric current is passed through plating solution in recesses of a metal substrate to plate electrical contact bumps having bump fronts in the recesses and exposed bump backs. The transducer is partially formed on the substrate, sealing the exposed bump backs. One or more vacuum processes are performed to complete formation of the transducer. At least a portion of the metal substrate is etched away to expose the bump fronts of the electrical contact bumps.
摘要:
Utilizing reactive ion etching (RIE) lag, tethers are fabricated that reliably hold devices in place during processing and storage, yet are easily broken to remove the parts from the wafer as desired, without requiring excessive force that could damage the devices. The tethers are fabricated by slightly narrowing the periphery etch feature at several places. By adjusting the ratio of the main periphery width to the necked width at the tethers, the final thickness of the tether can be controlled to a small fraction of the wafer thickness, so that tethers defined by readily achievable feature sizes will reliably hold the parts in place until removal is desired. Since the tethers are now only a fraction of the wafer thickness, they will reliably break to release the part at a force level that will not damage the part.
摘要:
A slider assembly is operable to selectively alter a position of a transducing head with respect to a track of a rotatable disc having a plurality of concentric tracks. The slider assembly includes a slider wafer arranged to be supported by a disc drive support structure. A stator is bonded to the slider wafer, with the stator including at least one electrode. A rotor is bonded to the stator, with the rotor having a frame portion bonded to the stator and a head-carrying portion attached to the frame portion by a flexible beam structure. The head-carrying portion of the rotor carries the transducing head, supports at least one rotor electrode adjacent to the at least one stator electrode, and is movable with respect to the frame portion of the rotor in response to a voltage difference between the at least one rotor electrode and the at least one stator electrode.
摘要:
A method for filling a trench extending through a microelectromechanical system (MEMS) device patterned on a wafer is disclosed. The method involves simultaneously depositing a trench-fill layer of insulating material over a first side of the wafer, over a second side of the wafer, and into the trench extending from the first side to the second side. Further, the width of the trench at the first side of the wafer and/or the second side of the wafer is variable to adjust the rate at which the trench fills.
摘要:
An improved microactuator magnetic circuit having a simplified assembly, reduced field leakage, and improved passivation methods is disclosed. To simplify assembly, a single magnet is polarized in two magnetic regions so that the single magnet is functionally similar to two separate magnets. In addition, the magnetic circuit can be produced without a top keeper. Field leakage is reduced by expanding the bottom keeper. Finally, corrosion-resistant alloys with acceptable magnetic properties are used in forming the keeper.