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1.发明授权Wafer testing system integrated with RFID techniques and thesting method thereof 有权与RFID技术相结合的晶圆测试系统及其方法公开(公告)号：US07609053B2
公开(公告)日：2009-10-27
申请号：US12061781
申请日：2008-04-03
申请人： Wen Cheng Hsu , Min Ming Lo , Chao Chien Wang , Yi Fang Cho
发明人： Wen Cheng Hsu , Min Ming Lo , Chao Chien Wang , Yi Fang Cho
CPC分类号： G01R31/01 , G01R31/2893
摘要： This invention provides a wafer testing system and testing method thereof. The wafer testing system comprises a wafer storage section, a prober, a tester, an RFID middleware unit, an EDA system and an MES system. The wafer storage section stores a multiplicity of carriers, each of which is provided with at least a RFID tag. The prober comprises a RFID reader to read a tag information. The tester sends a test signal to the prober for implementing the wafer test so as to generate a test result and calls an interface program to convert the test result into a file conformed with a specific data format. The RFID middleware unit receives the tag information and calls related applications to process the tag information so as to generate a wafer information. The EDA system receives the file of the specific data format converted from the interface program and calculates thereof to generate a wafer yield information after wafer test. The MES system integrates the wafer information from the RFID middleware unit with the yield information from the EDA system so as to allow monitoring the wafer manufacturing process and testing yield rate in a real-time manner.
摘要翻译： 本发明提供了一种晶片测试系统及其测试方法。 晶片测试系统包括晶片存储部分，探测器，测试器，RFID中间件单元，EDA系统和MES系统。 晶片存储部存储多个载体，每个载体至少设有RFID标签。 该探测器包括读取标签信息的RFID读取器。 测试仪将测试信号发送到探测器，以实现晶片测试，以产生测试结果，并调用接口程序将测试结果转换为符合特定数据格式的文件。 RFID中间件单元接收标签信息并调用相关应用程序来处理标签信息以产生晶片信息。 EDA系统接收从接口程序转换的特定数据格式的文件，并计算它们以在晶片测试之后生成晶片产量信息。 MES系统将RFID中间件单元的晶圆信息与EDA系统的产量信息相集成，以便实时监控晶圆制造过程和测试成品率。
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公开(公告)号：US20240170225A1
公开(公告)日：2024-05-23
申请号：US17992882
申请日：2022-11-22
申请人： Yu-Peng Chung , Chia-Wei Li , Wen Cheng Hsu , En-Ming Chen , Che-Chih Tsao
发明人： Yu-Peng Chung , Chia-Wei Li , Wen Cheng Hsu , En-Ming Chen , Che-Chih Tsao
CPC分类号： H01G9/151 , H01G9/0029 , H01G9/012 , H01G9/0425
摘要： This invention describes a packaging structure for roll-type (wound-type) aluminum conductive polymer capacitor element. Two protective substrates are applied to sandwich a roll-type capacitor element in between with an insulating material surrounding the capacitor element also in between the protective substrates. The protective substrates comprise electrically separated anodic conductive pad and cathodic conductive pad on their surfaces and through holes that pass through the conductive pads. The capacitor element is oriented with its axis perpendicular to the two substrates. The anodic and cathodic leads of the capacitor element pass through the through holes. An anodic external terminal is plated over the anodic conductive pad and a cathodic external terminal is plated over the cathodic conductive pad so that the anodic external terminal is electrically connected to the anodic lead and the cathodic external terminal is electrically connected to the cathodic lead.
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公开(公告)号：US12057275B2
公开(公告)日：2024-08-06
申请号：US17992882
申请日：2022-11-22
申请人： Yu-Peng Chung , Chia-Wei Li , Wen Cheng Hsu , En-Ming Chen , Che-Chih Tsao
发明人： Yu-Peng Chung , Chia-Wei Li , Wen Cheng Hsu , En-Ming Chen , Che-Chih Tsao
CPC分类号： H01G9/012 , H01G9/0029 , H01G9/0425 , H01G9/08 , H01G9/151
摘要： This invention describes a packaging structure for roll-type (wound-type) aluminum conductive polymer capacitor element. Two protective substrates are applied to sandwich a roll-type capacitor element in between with an insulating material surrounding the capacitor element also in between the protective substrates. The protective substrates comprise electrically separated anodic conductive pad and cathodic conductive pad on their surfaces and through holes that pass through the conductive pads. The capacitor element is oriented with its axis perpendicular to the two substrates. The anodic and cathodic leads of the capacitor element pass through the through holes. An anodic external terminal is plated over the anodic conductive pad and a cathodic external terminal is plated over the cathodic conductive pad so that the anodic external terminal is electrically connected to the anodic lead and the cathodic external terminal is electrically connected to the cathodic lead.
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公开(公告)号：US07326300B2
公开(公告)日：2008-02-05
申请号：US11178069
申请日：2005-07-07
申请人： Lu Nan Sun , Ching Lung Wang , Wen Cheng Hsu , Yu-Ying Chan
发明人： Lu Nan Sun , Ching Lung Wang , Wen Cheng Hsu , Yu-Ying Chan
CPC分类号： H01L21/6715 , B05C5/0254 , B05C13/00 , G03F7/16 , H01L21/67784
摘要： A coating apparatus (2) includes a work table (20) having a plurality of blowing holes (201) for suspending a substrate (200) thereabove, a coating unit (22) having a photoresist coating nozzle (222) and a supplying device (224) for photoresist material. The photoresist coating nozzle is disposed above the work table, and the supplying device connects to the coating nozzle for supplying photoresist thereto. In operation, the substrate to be coated is continuously suspended in the gas just above but not in contact with the work table. Therefore, accumulation of static electricity and/or foreign particles on the substrate can be avoided. Gas emitting from the blowing holes can remove foreign particles from the surface of the work table and the backside of the work table.
摘要翻译： 涂覆装置（2）包括具有多个用于悬挂上述基板（200）的吹扫孔（201）的工作台（20），具有光致抗蚀剂涂布喷嘴（222）和供给装置（22）的涂布单元 224）用于光致抗蚀剂材料。 光致抗蚀剂涂布喷嘴设置在工作台的上方，供给装置连接到用于向其施加光致抗蚀剂的涂布喷嘴。 在操作中，待涂覆的基板连续地悬挂在正好在工作台上方但不与工作台接触的气体中。 因此，可以避免静电和/或异物在基板上的积聚。 从吹风孔排出的气体可以从工作台表面和工作台的背面除去异物。
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公开(公告)号：US20240304394A1
公开(公告)日：2024-09-12
申请号：US18445743
申请日：2024-01-12
申请人： Yu-Peng Chung , Chia-Wei Li , Wen Cheng Hsu , En-Ming Chen , Che-Chih Tsao
发明人： Yu-Peng Chung , Chia-Wei Li , Wen Cheng Hsu , En-Ming Chen , Che-Chih Tsao
CPC分类号： H01G9/0029 , H01G9/008 , H01G9/08
摘要： This invention describes a packaging structure for roll-type (wound-type) aluminum conductive polymer capacitor element. Two protective substrates are applied to sandwich a roll-type capacitor element in between with an insulating material surrounding the capacitor element also in between the protective substrates. The protective substrates comprise electrically separated anodic conductive pad and cathodic conductive pad on their surfaces. The capacitor element is oriented with its axis perpendicular to the two substrates. The anodic and cathodic leads of the capacitor element pass through the through holes. An anodic external terminal is plated over the anodic conductive pad and a cathodic external terminal is plated over the cathodic conductive pad so that the anodic external terminal is electrically connected to the anodic lead and the cathodic external terminal is electrically connected to the cathodic lead. In another arrangement, the anodic and cathodic leads are bent by about 90 degree so that they point to the two sides of the packaging. External terminals are placed on the two sides of the packaging on the surfaces of the insulating material. In still another arrangement, the packaging structure uses only one protective substrate.
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