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公开(公告)号：US5124717A
公开(公告)日：1992-06-23
申请号：US624390
申请日：1990-12-06
CPC分类号： B41J2/1604 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1635 , B41J2/1642 , B41J2002/14403
摘要： An ink jet printhead having an integral membrane filter fabricated over the surface of the printhead containing the ink inlet is disclosed. The individual printheads are obtained by a sectioning operation which cuts aligned and bonded channel and heater wafers. The mated wafers contain a plurality of printheads and must be separated. The integral membrane filter is formed on the channel wafer after it is anisotropically etched incorporating the etch resistant mask layer and prior to mating with the heater wafer. A patternable layer is deposited over the etch resistant masking layer and exposed, patterned and developed to establish the mesh filter. In one embodiment, the side of the channel wafer not patterned and etched is heavily doped to form an etch stop which increases the robustness of the membrane filter by ensuring that the masking layer remains intact during subsequent fabricating steps. This doped region beneath the patternable layer is then etched using the membrane filter as a mask to open the filter pores through the doped layer of the channel wafer, thereby increasing the filter thickness and its overall strength.
摘要翻译： 公开了一种在包含墨水入口的打印头的表面上制造的具有整体膜过滤器的喷墨打印头。 单个打印头通过切割对准和粘合的通道和加热器晶片的切片操作获得。 配对的晶片包含多个打印头，必须分开。 整体膜过滤器在其各向异性蚀刻之后形成在通道晶片上，其包含耐蚀刻掩模层并且在与加热器晶片配合之前。 将可图案层沉积在抗蚀刻掩模层上，并进行曝光，图案化和显影以建立网状过滤器。 在一个实施例中，未图案化和蚀刻的沟道晶片的侧面被重掺杂以形成蚀刻停止件，其通过确保掩模层在随后的制造步骤期间保持完整而增加了膜过滤器的鲁棒性。 然后使用膜过滤器作为掩模蚀刻可图案层下面的该掺杂区域，以通过通道晶片的掺杂层打开过滤器孔，从而增加过滤器厚度及其整体强度。
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公开(公告)号：US4601777A
公开(公告)日：1986-07-22
申请号：US719410
申请日：1985-04-03
IPC分类号： B41J2/01 , B41J2/015 , B41J2/05 , B41J2/16 , H01L49/02 , H01L21/306 , B44C1/22 , C03C15/00 , C23F1/02
CPC分类号： B41J2/1623 , B41J2/1604 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1635 , B41J2/1642 , H01L49/02
摘要： Several fabricating processes for ink jet printheads are disclosed, each printhead being composed of two parts aligned and bonded together. One part is a substantially flat substrate which contains on the surface thereof a lineal array of heating elements and addressing electrodes, and the second part is a substrate having at least one recess anisotropically etched therein to serve as an ink supply manifold when the two parts are bonded together. A lineal array of parallel grooves are formed in the second part, so that one end of the grooves communicate with the manifold recess an the other ends are open for use as an ink droplet expelling nozzles. Many printheads can be made simultaneously by producing a plurality of sets of heating elements array with their addressing electrodes on a silicon wafer and by placing alignment marks thereon at predetermined locations. A corresponding plurality of sets of channels and associated manifolds are produced in a second silicon wafer and, in one embodiment, alignment openings are etched thereon at predetermined locations. The two wafers are aligned via the alignment openings and alignment marks, then bonded together and diced into many separate printheads. A number of printheads can be fixedly mounted in a pagewidth configuration which confronts a moving recording medium for pagewidth printing or individual printheads may be adapted for carriage type ink jet printing.
摘要翻译： 公开了用于喷墨打印头的若干制造方法，每个打印头由对准和粘合在一起的两个部件组成。 一部分是在其表面上包含加热元件和寻址电极的线阵列的基本平坦的基板，并且第二部分是具有各向异性蚀刻在其中的至少一个凹部的基板，以当两部分为 结合在一起 在第二部分中形成一系列平行的凹槽，使得凹槽的一端与歧管凹槽连通，另一端打开以用作墨滴排出喷嘴。 许多打印头可以通过在硅晶片上产生多组加热元件阵列与其寻址电极并通过在预定位置放置对准标记而同时制造。 在第二硅晶片中产生相应的多组通道和相关联的歧管，并且在一个实施例中，在预定位置处蚀刻对准开口。 两个晶片通过对准开口和对准标记对齐，然后粘合在一起并切成许多单独的打印头。 许多打印头可以固定地安装在页宽配置中，该宽度配置面对用于页宽打印的移动记录介质，或者单独的打印头可适用于支架式喷墨打印。
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公开(公告)号：US4822755A
公开(公告)日：1989-04-18
申请号：US185600
申请日：1988-04-25
IPC分类号： H01L21/302 , B41J2/16 , H01L21/301 , H01L21/306 , H01L29/06 , H01L21/00 , H01L21/02 , H01L21/72 , H01L21/98
CPC分类号： B41J2/1628 , B41J2/1601 , B41J2/1623 , B41J2/1629 , B41J2/1642 , H01L21/30604 , B41J2202/13 , H01L29/0657 , Y10S438/928
摘要： A method for separating chips formed on a silicon substrate is provided which uses a combination of reactive ion etching techniques combined with orientation etching to yield integrated chips having edges which can be more precisely butted together to form large area arrays.
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公开(公告)号：USRE32572E
公开(公告)日：1988-01-05
申请号：US947020
申请日：1986-12-29
IPC分类号： B41J2/16
CPC分类号： B41J2/1623 , B41J2/1604 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1635 , B41J2/1642
摘要： Several fabricating processes for ink jet printheads are disclosed, each printhead being composed of two parts aligned and bonded together. One part is a substantially flat substrate which contains on the surface thereof a lineal array of heating elements and addressing electrodes, and the second part is a substrate having at least one recess anisotropically etched therein to serve as an ink supply manifold when the two parts are bonded together. A lineal array of parallel grooves are formed in the second part, so that one end of the grooves communicate with the manifold recess an the other ends are open for use as an ink droplet expelling nozzles. Many printheads can be made simultaneously by producing a plurality of sets of heating elements array with their addressing electrodes on a silicon wafer and by placing alignment marks thereon at predetermined locations. A corresponding plurality of sets of channels and associated manifolds are produced in a second silicon wafer and, in one embodiment, alignment openings are etched thereon at predetermined locations. The two wafers are aligned via the alignment openings and alignment marks, then bonded together and diced into many separate printheads. A number of printheads can be fixedly mounted in a pagewidth configuration which confronts a moving recording medium for pagewidth printing or individual printheads may be adapted for carriage type ink jet printing.
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公开(公告)号：US4961821A
公开(公告)日：1990-10-09
申请号：US440296
申请日：1989-11-22
IPC分类号： B41J2/05 , B41J2/135 , B41J2/16 , H01L21/301 , H01L21/306 , H01L21/308 , H01L21/768
CPC分类号： B41J2/1603 , B41J2/1628 , B41J2/1629 , H01L21/30608 , H01L21/3081 , H01L21/76898
摘要： At least one through opening of predetermined location and dimensions is fabricated in a (100) silicon wafer by orientation dependent etching method after completion of integrated circuits on the wafer, the opening extending through the wafer between a circuit surface of the wafer and an opposite parallel base surface of the wafer and having a predetermined location relative to the integrated circuit on the circuit surface of the wafer. The method includes the steps of fabricating the integrated circuit on the circuit surface of the wafer; applying an etch resistant layer of plasma solicon nitride on the circuit and base surfaces of the wafer; patterning the etch resistant plasma silicon nitride layer on the circuit surface to define an upper etch opening having a location and dimensions which define the predetermined location and dimensions of the through opening; and patterning the plasma silicon nitride layer on the base surface to produce a lower etch opening aligned with the upper etch opening within a predetermined tolerance. The wafer is then anisotropically etched to produce a first recess corresponding to the upper etch opening in the circuit surface and a second recess corresponding to the lower etch opening in the base surface, each of the first and second recesses being bounded by (111) plane side walls. The anisotropic etching of the second recess intersects the first recess to form the through opening bounded by (111) plane side walls and has its predetermined dimensions and location defined by the patterning of the upper etch opening.
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公开(公告)号：US4789425A
公开(公告)日：1988-12-06
申请号：US82417
申请日：1987-08-06
申请人： Donald J. Drake , William G. Hawkins , Stephen F. Pond , Michael R. Campanelli , Pamela J. Hartman , Raymond E. Bailey
发明人： Donald J. Drake , William G. Hawkins , Stephen F. Pond , Michael R. Campanelli , Pamela J. Hartman , Raymond E. Bailey
CPC分类号： B41J2/1628 , B23P15/00 , B41J2/1603 , B41J2/1623 , B41J2/1625 , B41J2/1629 , B41J2/1631 , B41J2/1635 , B41J2/1642 , Y10T29/49083
摘要： A thermal ink jet printhead of the type which expels droplets on demand towards a recording medium from nozzles located above and generally parallel with the bubble generating heating elements contained therein is disclosed, together with fabrication processes therefor. The droplets are propelled along trajectories that are perpendicular to the heating element surfaces and from nozzles located in the printhead roof; such configuration is generally referred to as "roofshooter". Each printhead comprises a silicon heater plate and a fluid directing structural member. The heater plate has a linear array of heating elements associated addressing electrodes, and an elongated ink fill hole parallel with the heating element array. The structural member contains at least one recessed cavity, a plurality of nozzles, and a plurality of parallel walls within the recessed cavity which define individual ink channels for directing ink to the nozzles. The recessed cavity and fill hole are in communication with each other and form the ink reservoir within the printhead. The ink holding capacity of the fill hole is larger than that of the recessed cavity. The fill hole is precisely formed and positioned within the heater plate by anisotropic etching. The structural member may be fabricated either from two layers of photoresist, a two-stage flat nickel electroform, or a single photoresist layer and a single stage flat nickel electroform.
摘要翻译： 公开了一种根据需要将液滴从记录介质喷出的类型的热喷墨打印头，其喷嘴位于包含在其中的产生发泡元件的上方并大致平行的喷嘴及其制造工艺。 液滴沿着垂直于加热元件表面和位于打印头顶部的喷嘴的轨迹推进; 这种构造通常被称为“屋顶运动器”。 每个打印头包括硅加热器板和流体引导结构构件。 加热器板具有与寻址电极相关联的加热元件的线性阵列和与加热元件阵列平行的细长的墨水填充孔。 结构构件在凹腔内包含至少一个凹腔，多个喷嘴和多个平行壁，其限定用于将墨引导到喷嘴的各个墨通道。 凹腔和填充孔彼此连通并在打印头内形成墨水容器。 填充孔的油墨保持能力大于凹腔的油墨保持能力。 填充孔通过各向异性蚀刻精确地形成并定位在加热器板内。 结构构件可以由两层光致抗蚀剂，两级平面镍电铸或单一光致抗蚀剂层和单级平面镍电铸制成。
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公开(公告)号：US4639748A
公开(公告)日：1987-01-27
申请号：US781554
申请日：1985-09-30
CPC分类号： B41J2/1604 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1635 , B41J2/1642 , B41J2/17563
摘要： An ink jet printhead having an internal, integrated filtering system and fabricating process therefor is disclosed. Each printhead is composed of two parts aligned and bonded together. One part is a substantially flat substrate which contains on a surface thereof a linear array of heating elements and addressing electrodes. The other part is a flat substrate having a set of concurrently etched recesses in one surface. The set of recesses include a parallel array of elongated recesses for use as capillary filled, ink channels having ink droplet emitting nozzles at one end and having interconnection with a common ink supplying manifold recess at the other ends. The manifold recess contains an internal, closed wall defining a chamber with an ink fill hole. Small passageways are formed in the internal chamber walls to permit passage of ink therefrom into the manifold. Each of the passageways have smaller cross-sectional flow areas than the nozzles to filter the ink, while the total cross-sectional flow area of the passageways is larger than the total cross-sectional flow area of the nozzles. Many printheads can be made simultaneously by producing a plurality of sets of heating element arrays with their addressing electrodes on a silicon wafer and by placing alignment marks thereon at predetermined locations. A corresponding plurality of sets of channels and associated manifolds with internal filters are produced in a second silicon wafer and, in one embodiment, alignment openings are etched thereon at predetermined locations. The two wafers are aligned via the alignment openings and alignment marks, then bonded together and diced into many separate printheads.
摘要翻译： 公开了一种具有内部集成过滤系统及其制造方法的喷墨打印头。 每个打印头由对准和粘合在一起的两个部件组成。 一部分是基本平坦的基板，其在其表面上包含加热元件和寻址电极的线性阵列。 另一部分是在一个表面中具有一组同时蚀刻的凹槽的平坦基底。 这组凹槽包括用作毛细管填充的墨水通道的细长凹槽的平行阵列，墨水通道在一端具有喷墨嘴，并且在另一端具有与公共墨水供应歧管凹槽的互连。 歧管凹槽包含限定具有墨水填充孔的室的内部封闭壁。 在内部室壁中形成小通道，以允许墨水从歧管中通过。 每个通道具有比用于过滤油墨的喷嘴更小的横截面流动面积，而通道的总截面流动面积大于喷嘴的总横截面积面积。 可以通过在硅晶片上产生多组加热元件阵列及其寻址电极并且通过在预定位置放置对准标记来同时制造许多打印头。 在第二硅晶片中产生相应的多组具有内部滤波器的通道和相关联的歧管，并且在一个实施例中，在预定位置处蚀刻对准开口。 两个晶片通过对准开口和对准标记对齐，然后粘合在一起并切成许多单独的打印头。
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8.发明授权
公开(公告)号：US4678529A
公开(公告)日：1987-07-07
申请号：US881414
申请日：1986-07-02
CPC分类号： B41J2/1628 , B41J2/1604 , B41J2/1623 , B41J2/1629 , B41J2/1635 , B41J2/1642 , B41J2/1645 , Y10T156/1059
摘要： A method of bonding ink jet printhead components together by coating a flexible substrate with a relatively thin, uniform layer of an adhesive having an intermediate non-tacky curing stage with a shelf life with around one month for ease of alignment of the parts and ease of storage of the components having the adhesive thereon. Transferring about half of the adhesive layer on the flexible substrate to the high points or lands of one of the printhead components within a predetermined time of the coating of the flexible substrate by placing it in contact therewith and applying a predetermined temperature and pressure to the flexible substrate prior to peeling it from the printhead component. This causes the adhesive to fail cohesively in the liquid state, assuring that about half of the thickness of the adhesive layer stays with the flexible substrate and is discarded therewith, leaving a very thin uniform layer of adhesive on the printhead component lands. The transferred adhesive layer remaining on the printhead component enters an intermediate non-tacky curing stage to assist in subsequent alignment of the printhead components. The printhead components are aligned and the adhesive layer cured to complete fabrication of the printhead.
摘要翻译： 通过用相对薄的均匀的粘合剂层将粘合喷墨打印头部件的方法粘合在一起，该粘合剂具有中间非粘性固化阶段，其具有大约一个月的保质期，以便部件的对准和易于 在其上存储具有粘合剂的部件。 通过使其与其接触并将其预定的温度和压力施加到柔性基板上，将柔性基板上的粘合剂层的大约一半转移到柔性基板的涂覆的预定时间内的一个打印头部件的高点或平台上 在将其从打印头部件剥离之前的基板。 这导致粘合剂在液体状态下内聚失效，确保粘合剂层的厚度的大约一半与柔性基材保持并被丢弃，在打印头部件焊盘上留下非常薄的均匀的粘合剂层。 残留在打印头组件上的转移的粘合剂层进入中间非粘性固化阶段以帮助打印头组件的随后对准。 打印头组件对准并且粘合剂层固化以完成打印头的制造。
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公开(公告)号：US4975143A
公开(公告)日：1990-12-04
申请号：US440211
申请日：1989-11-22
CPC分类号： H01L21/68 , H01L2224/16 , H01L2924/01014 , H01L2924/10253 , Y10T156/1092 , Y10T156/1744
摘要： The vacuum hold down alignment substrate is formed as an array of precisely aligned alignment substrate subunits. Each subunit is formed with an alignment pattern formed in a photo-patternable or electroformable material. When the plurality of alignment substrate subunits are formed into an array to produce the alignment substrate, the alignment patterns are aligned to receive corresponding patterns in discrete subunit devices which are aligned into an array on the alignment substrate.
摘要翻译： 真空压紧对准基板形成为精确对准的对准衬底子单元的阵列。 每个子单元形成有形成在可光图案化或可电铸材料中的对准图案。 当多个对准衬底子单元形成为阵列以产生对准衬底时，对准图案对齐以在离散子单元器件中接收对准到对准衬底上的阵列中的对应图案。
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10.发明授权Process and apparatus for assembling smaller scanning or printing arrays together to form an extended array 失效用于将较小扫描或打印阵列组装在一起以形成扩展阵列的方法和装置
公开(公告)号：US5034083A
公开(公告)日：1991-07-23
申请号：US422220
申请日：1989-10-16
CPC分类号： B41J2/155 , H01L24/75 , H01L24/83 , H04N1/03 , B41J2002/14362 , B41J2202/20 , H01L2224/8319 , H01L2224/83224 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/07802 , H01L2924/10253 , H01L2924/12042 , H04N2201/02456 , H04N2201/02487 , Y10T156/1089
摘要： Process and apparatus for fabricating an extended scanning or printing array in which plural smaller scanning or printing chips are bonded end-to-end onto the surface of a glass substrate having an opaque thermally and/or electrically conductive coating thereon, with the coating removed at discrete sites to allow a photocurable adhesive placed at the sites to be cured through exposure to UV light from underneath the substrate, the photocurable adhesive holding the chips in place while a chip bonding adhesive deposited on the conductive coating where the chips are located is cured to provide a permanent structure.
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