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1.发明授权公开(公告)号：US07907409B2
公开(公告)日：2011-03-15
申请号：US12406645
申请日：2009-03-18
申请人： William G. Wyatt , Richard M. Weber
发明人： William G. Wyatt , Richard M. Weber
IPC分类号： H05K7/20
CPC分类号： H05K7/20809
摘要： According to one embodiment, a system for cooling computing components includes a computing rack housing a plurality of computing components of a computing system. A heat absorbing plate is disposed in and removable from the computing rack. The heat absorbing plate is thermally coupled to an outer surface of a computing component and comprises a plurality of walls defining a cavity containing a two-phase coolant. The cavity has a continuous volume allowing the two-phase coolant to absorb heat from the computing component and to transfer the heat to a heat transfer mechanism. The computing rack has a sidewall that is thermally coupled to the heat absorbing plate and comprises the heat transfer mechanism, which is operable to receive the heat transferred from the heat absorbing plate.
摘要翻译： 根据一个实施例，用于冷却计算组件的系统包括容纳计算系统的多个计算组件的计算机架。 吸热板设置在计算机架中并从计算机架上移除。 吸热板热耦合到计算部件的外表面，并且包括限定包含两相冷却剂的空腔的多个壁。 空腔具有允许两相冷却剂从计算部件吸收热量并将热量传递到热传递机构的连续容积。 计算机架具有热耦合到吸热板的侧壁，并且包括传热机构，其可操作以接收从吸热板传递的热量。
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2.发明申请System and Method for Separating Components of a Fluid Coolant for Cooling a Structure 有权用于分离用于冷却结构的流体冷却剂的部件的系统和方法公开(公告)号：US20080229780A1
公开(公告)日：2008-09-25
申请号：US11689947
申请日：2007-03-22
申请人： William G. Wyatt , Richard M. Weber
发明人： William G. Wyatt , Richard M. Weber
IPC分类号： F25B27/00
CPC分类号： F25B23/006
摘要： According to one embodiment of the invention, a cooling system for a heat-generating structure includes a heating device, a cooling loop, and a separation structure. The heating device heats a flow of fluid coolant including a mixture of water and antifreeze. The cooling loop includes a director structure which directs the flow of the fluid coolant substantially in the form of a liquid to the heating device. The heating device vaporizes a substantial portion of the water into vapor while leaving a substantial portion of the antifreeze as liquid. The separation structure receives, from the heating device, the flow of fluid coolant with the substantial portion of the water as vapor and the substantial portion of the antifreeze as liquid. The separation structure separates one of the substantial portion of the water as vapor or the substantial portion of the antifreeze as liquid from the cooling loop while allowing the other of the substantial portion of the water as vapor or the substantial portion of the antifreeze as liquid to remain in the cooling loop.
摘要翻译： 根据本发明的一个实施例，用于发热结构的冷却系统包括加热装置，冷却回路和分离结构。 加热装置加热包括水和防冻剂的混合物的流体冷却剂流。 冷却回路包括导向器结构，其将基本上呈液体形式的流体冷却剂的流动引导到加热装置。 加热装置将大部分的水蒸发成蒸汽，同时将大部分防冻液留下为液体。 分离结构从加热装置接收流体冷却剂的流动，其中大部分水作为蒸汽和大部分防冻液作为液体。 分离结构将水的大部分之一作为蒸汽或防冻剂的大部分分离成冷却回路，同时允许大部分水作为蒸汽或防冻剂的主要部分作为液体 留在冷却回路中。
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3.发明申请Method And Apparatus for Cooling Electronics with a Coolant at a Subambient Pressure 有权在低压下用冷却液冷却电子的方法和装置公开(公告)号：US20110157828A1
公开(公告)日：2011-06-30
申请号：US13043675
申请日：2011-03-09
CPC分类号： F25B23/006 , F25B43/00 , F28D15/0266 , F28D2021/0031 , F28F23/00 , H01L2924/0002 , H01Q1/02 , H01L2924/00
摘要： According to one embodiment of the invention, a method is provided for cooling heat-generating structure disposed in an environment having an ambient pressure. The heat-generating structure includes electronics. The method includes providing a coolant, reducing a pressure of the coolant to a subambient pressure at which the coolant has a boiling temperature less than a temperature of the heat-generating structure, and bringing the heat-generating structure and the coolant at the subambient pressure into contact with one another, so that the coolant boils and vaporizes to thereby absorb heat from the heat-generating structure. In a more particular embodiment the coolant is either pure water or pure methanol with an electrical resistivity level of greater than one million Ohms-cm. Further, in another particular embodiment the method includes filtering the coolant to maintain its purity above a particular level.
摘要翻译： 根据本发明的一个实施例，提供一种用于冷却设置在具有环境压力的环境中的发热结构的方法。 发热结构包括电子产品。 该方法包括提供冷却剂，将冷却剂的压力降低到冷却剂的沸腾温度低于发热结构的温度的次环境压力，并使发热结构和冷却剂处于低于环境压力 彼此接触，使得冷却剂沸腾并蒸发，从而从发热结构吸收热量。 在更具体的实施方案中，冷却剂是纯水或具有大于100万欧姆 - 厘米的电阻率水平的纯甲醇。 此外，在另一个具体实施方案中，该方法包括过滤冷却剂以将其纯度保持在特定水平以上。
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4.发明授权Method and apparatus for cooling electronics with a coolant at a subambient pressure 有权用于在低于环境压力下用冷却剂冷却电子设备的方法和装置公开(公告)号：US07908874B2
公开(公告)日：2011-03-22
申请号：US11381297
申请日：2006-05-02
IPC分类号： F25D15/00
CPC分类号： F25B23/006 , F25B43/00 , F28D15/0266 , F28D2021/0031 , F28F23/00 , H01L2924/0002 , H01Q1/02 , H01L2924/00
摘要： According to one embodiment of the invention, a method is provided for cooling heat-generating structure disposed in an environment having an ambient pressure. The heat-generating structure includes electronics. The method includes providing a coolant, reducing a pressure of the coolant to a subambient pressure at which the coolant has a boiling temperature less than a temperature of the heat-generating structure, and bringing the heat-generating structure and the coolant at the subambient pressure into contact with one another, so that the coolant boils and vaporizes to thereby absorb heat from the heat-generating structure. In a more particular embodiment the coolant is either pure water or pure methanol with an electrical resistivity level of greater than one million Ohms-cm. Further, in another particular embodiment the method includes filtering the coolant to maintain its purity above a particular level.
摘要翻译： 根据本发明的一个实施例，提供一种用于冷却设置在具有环境压力的环境中的发热结构的方法。 发热结构包括电子产品。 该方法包括提供冷却剂，将冷却剂的压力降低到冷却剂的沸腾温度低于发热结构的温度的次环境压力，并使发热结构和冷却剂处于低于环境压力 彼此接触，使得冷却剂沸腾并蒸发，从而从发热结构吸收热量。 在更具体的实施方案中，冷却剂是纯水或具有大于100万欧姆 - 厘米的电阻率水平的纯甲醇。 此外，在另一个具体实施方案中，该方法包括过滤冷却剂以将其纯度保持在特定水平以上。
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公开(公告)号：US07907395B2
公开(公告)日：2011-03-15
申请号：US12404784
申请日：2009-03-16
申请人： Richard M. Weber , William G. Wyatt
发明人： Richard M. Weber , William G. Wyatt
CPC分类号： G06F1/20 , H05K7/20745 , H05K7/20818
摘要： According to one embodiment, a heat removal system for a computer room includes a heat pipe having two ends. One of the ends is thermally coupled to one or more of a number of components forming a portion of a computing system. The other end is thermally coupled to a heat dissipation mechanism. The heat pipe is operable to move heat from the components of the computing system to the heat dissipation mechanism.
摘要翻译： 根据一个实施例，用于计算机室的散热系统包括具有两端的热管。 其中一个端部热耦合到形成计算系统的一部分的多个部件中的一个或多个。 另一端热耦合到散热机构。 热管可操作以将热量从计算系统的组件移动到散热机构。
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6.发明授权公开(公告)号：US09644869B2
公开(公告)日：2017-05-09
申请号：US11924335
申请日：2007-10-25
CPC分类号： F25B23/006 , F28D15/00 , H01Q1/02 , H05K7/20281
摘要： According to one embodiment, a cooling system for heat-generating structures comprises a cooling loop and a heat exchanger. The cooling loop directs a flow of a fluid coolant to both an active heat-generating structure and an inactive heat-generating structure. The fluid coolant receiving thermal energy from the active heat-generating structure and transfers thermal energy to the inactive heat-generating structure when a temperature of the fluid coolant is greater than an ambient temperature of an environment surrounding the heat-generating structures. The active heat-generating structure is operable to switch to an inactive state and the inactive heat-generating structure is operable to switch to an active state. The heat exchanger is in thermal communication with the first and second heat-generating structures and is operable to receive the fluid coolant at a first temperature and dispense of the fluid coolant out of the heat exchanger at a second temperature.
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7.发明授权System and method for separating components of a fluid coolant for cooling a structure 有权用于分离用于冷却结构的流体冷却剂的部件的系统和方法公开(公告)号：US08651172B2
公开(公告)日：2014-02-18
申请号：US11689947
申请日：2007-03-22
申请人： William G. Wyatt , Richard M. Weber
发明人： William G. Wyatt , Richard M. Weber
CPC分类号： F25B23/006
摘要： A cooling system for a heat-generating structure includes a heating device, a cooling loop, and one or more reservoirs. The heating device is configured to heat fluid coolant comprising a mixture of water and antifreeze and vaporize a portion of the water into vapor while leaving a portion of the antifreeze as liquid in the fluid coolant. The cooling loop has a portion that splits the fluid coolant received from the heating device into a first path configured to receive at least some of the portion of the water as vapor and a second path configured to receive at least some of the portion of the antifreeze as liquid. The one or more reservoirs are configured to receive one of the at least some of the portion of the water as vapor from the first path or the at least some of the portion of the antifreeze as liquid from the second path.
摘要翻译： 用于发热结构的冷却系统包括加热装置，冷却回路和一个或多个储存器。 加热装置被配置为加热包含水和防冻剂的混合物的流体冷却剂，并将一部分水蒸发成蒸汽，同时将一部分防冻剂作为液体留在流体冷却剂中。 冷却回路具有将从加热装置接收的流体冷却剂分离成第一路径的部分，该第一路径被配置为接收作为蒸汽的部分水中的至少一部分，以及第二路径，其被配置为接收防冻剂的至少一部分 作为液体。 一个或多个储存器被配置为从第一路径或防冻剂的至少一部分中的至少一部分水中的一部分作为液体从第二路径接收。
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8.发明授权Method and apparatus for cooling electronics with a coolant at a subambient pressure 有权用于在低于环境压力下用冷却剂冷却电子设备的方法和装置公开(公告)号：US08490418B2
公开(公告)日：2013-07-23
申请号：US13043675
申请日：2011-03-09
IPC分类号： F25B1/00
CPC分类号： F25B23/006 , F25B43/00 , F28D15/0266 , F28D2021/0031 , F28F23/00 , H01L2924/0002 , H01Q1/02 , H01L2924/00
摘要： According to one embodiment of the invention, a method is provided for cooling heat-generating structure disposed in an environment having an ambient pressure. The heat-generating structure includes electronics. The method includes providing a coolant, reducing a pressure of the coolant to a subambient pressure at which the coolant has a boiling temperature less than a temperature of the heat-generating structure, and bringing the heat-generating structure and the coolant at the subambient pressure into contact with one another, so that the coolant boils and vaporizes to thereby absorb heat from the heat-generating structure. In a more particular embodiment the coolant is either pure water or pure methanol with an electrical resistivity level of greater than one million Ohms-cm. Further, in another particular embodiment the method includes filtering the coolant to maintain its purity above a particular level.
摘要翻译： 根据本发明的一个实施例，提供一种用于冷却设置在具有环境压力的环境中的发热结构的方法。 发热结构包括电子产品。 该方法包括提供冷却剂，将冷却剂的压力降低到冷却剂的沸腾温度低于发热结构的温度的次环境压力，并使发热结构和冷却剂处于低于环境压力 彼此接触，使得冷却剂沸腾并蒸发，从而从发热结构吸收热量。 在更具体的实施方案中，冷却剂是纯水或具有大于100万欧姆 - 厘米的电阻率水平的纯甲醇。 此外，在另一个具体实施方案中，该方法包括过滤冷却剂以将其纯度保持在特定水平以上。
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9.发明申请System and Method for Cooling Structures Having Both an Active State and an Inactive State 有权具有活动状态和非活动状态的冷却结构的系统和方法公开(公告)号：US20090107663A1
公开(公告)日：2009-04-30
申请号：US11924335
申请日：2007-10-25
CPC分类号： F25B23/006 , F28D15/00 , H01Q1/02 , H05K7/20281
摘要： According to one embodiment, a cooling system for heat-generating structures comprises a cooling loop and a heat exchanger. The cooling loop directs a flow of a fluid coolant to both an active heat-generating structure and an inactive heat-generating structure. The fluid coolant receiving thermal energy from the active heat-generating structure and transfers thermal energy to the inactive heat-generating structure when a temperature of the fluid coolant is greater than an ambient temperature of an environment surrounding the heat-generating structures. The active heat-generating structure is operable to switch to an inactive state and the inactive heat-generating structure is operable to switch to an active state. The heat exchanger is in thermal communication with the first and second heat-generating structures and is operable to receive the fluid coolant at a first temperature and dispense of the fluid coolant out of the heat exchanger at a second temperature.
摘要翻译： 根据一个实施例，用于发热结构的冷却系统包括冷却回路和热交换器。 冷却回路将流体冷却剂的流动引导到活性发热结构和非活性发热结构两者。 当流体冷却剂的温度大于围绕发热结构的环境的环境温度时，流体冷却剂从主动发热结构接收热能并将热能传递到非活性发热结构。 活动发热结构可操作以切换到非活动状态，并且非活动发热结构可操作以切换到活动状态。 热交换器与第一和第二发热结构热连通，并且可操作以在第一温度下接收流体冷却剂，并在第二温度下将流体冷却剂分配出热交换器。
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10.发明申请公开(公告)号：US20090244830A1
公开(公告)日：2009-10-01
申请号：US12406645
申请日：2009-03-18
申请人： William G. Wyatt , Richard M. Weber
发明人： William G. Wyatt , Richard M. Weber
IPC分类号： G06F1/20
CPC分类号： H05K7/20809
摘要： According to one embodiment, a system for cooling computing components includes a computing rack housing a plurality of computing components of a computing system. A heat absorbing plate is disposed in and removable from the computing rack. The heat absorbing plate is thermally coupled to an outer surface of a computing component and comprises a plurality of walls defining a cavity containing a two-phase coolant. The cavity has a continuous volume allowing the two-phase coolant to absorb heat from the computing component and to transfer the heat to a heat transfer mechanism. The computing rack has a sidewall that is thermally coupled to the heat absorbing plate and comprises the heat transfer mechanism, which is operable to receive the heat transferred from the heat absorbing plate.
摘要翻译： 根据一个实施例，用于冷却计算组件的系统包括容纳计算系统的多个计算组件的计算机架。 吸热板设置在计算机架中并从计算机架上移除。 吸热板热耦合到计算部件的外表面，并且包括限定包含两相冷却剂的空腔的多个壁。 空腔具有允许两相冷却剂从计算部件吸收热量并将热量传递到热传递机构的连续容积。 计算机架具有热耦合到吸热板的侧壁，并且包括传热机构，其可操作以接收从吸热板传递的热量。
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