Pre-Lithiation of Electrode Materials in a Semi-Solid Electrode
    3.
    发明申请
    Pre-Lithiation of Electrode Materials in a Semi-Solid Electrode 审中-公开
    电极材料在半固体电极中的预锂化

    公开(公告)号:US20160126543A1

    公开(公告)日:2016-05-05

    申请号:US14930991

    申请日:2015-11-03

    摘要: Embodiments described herein relate generally to electrochemical cells having pre-lithiated semi-solid electrodes, and particularly to semi-solid electrodes that are pre-lithiated during the mixing of the semi-solid electrode slurry such that a solid-electrolyte interface (SEI) layer is formed in the semi-solid electrode before the electrochemical cell formation. In some embodiments, a semi-solid electrode includes about 20% to about 90% by volume of an active material, about 0% to about 25% by volume of a conductive material, about 10% to about 70% by volume of a liquid electrolyte, and lithium (as lithium metal, a lithium-containing material, and/or a lithium metal equivalent) in an amount sufficient to substantially pre-lithiate the active material. The lithium metal is configured to form a solid-electrolyte interface (SEI) layer on a surface of the active material before an initial charging cycle of an electrochemical cell that includes the semi-solid electrode.

    摘要翻译: 本文所述的实施方案一般涉及具有预硫化半固体电极的电化学电池,特别涉及在半固体电极浆料的混合期间预硫化的半固体电极,使得固体 - 电解质界面(SEI)层 在电化学电池形成之前形成在半固体电极中。 在一些实施方案中,半固体电极包括约20体积%至约90体积%的活性材料,约0体积%至约25体积%的导电材料,约10体积%至约70体积%的液体 电解质和锂(作为锂金属,含锂材料和/或锂金属当量),其量足以基本上预先活化材料。 锂金属构造成在包括半固体电极的电化学电池的初始充电循环之前在活性材料的表面上形成固体 - 电解质界面(SEI)层。

    CIRCUIT BOARD HOLDING MEMBER AND IMAGE FORMING APPARATUS
    5.
    发明申请
    CIRCUIT BOARD HOLDING MEMBER AND IMAGE FORMING APPARATUS 有权
    电路板控制会员和图像形成装置

    公开(公告)号:US20110051377A1

    公开(公告)日:2011-03-03

    申请号:US12731716

    申请日:2010-03-25

    申请人: Takaaki FUKUSHIMA

    发明人: Takaaki FUKUSHIMA

    IPC分类号: H05K7/00 H02B1/01

    摘要: A circuit board holding member includes a body portion, holding portions and first attachment portions. The body portion is made of resin, and is provided to hold a circuit board. The holding portions are made of resin. The holding portions are formed integrally with the body portion, and are provided to hold connection lines to be connected from electric modules of an apparatus to the circuit board. The first attachment portions are provided in the body portion and serve for removably attaching the circuit board to the apparatus.

    摘要翻译: 电路板保持构件包括主体部分,保持部分和第一附接部分。 主体部分由树脂制成,并且设置成保持电路板。 保持部分由树脂制成。 保持部与主体部一体地形成,并且设置成保持要从设备的电气模块连接到电路板的连接线。 第一安装部分设置在主体部分中,用于将电路板可移除地附接到设备。