公开(公告)号：US4972311A

公开(公告)日：1990-11-20

申请号：US232003

申请日：1988-08-15

申请人： William J. Holdgrafer ,  Douglas L. Gauntt ,  Robert B. Newsome

发明人： William J. Holdgrafer ,  Douglas L. Gauntt ,  Robert B. Newsome

IPC分类号： H01L21/52 ,  G05D3/00 ,  G05D3/12 ,  H01L21/50 ,  H01L21/60 ,  H01L21/68

CPC分类号： H01L24/78 ,  H01L21/682 ,  G05B2219/37572 ,  G05B2219/37619 ,  G05B2219/41206 ,  G05B2219/49195 ,  H01L2224/78301 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/12042

摘要： Apparatus and a method of correcting for repeatable positioning errors in an X-Y table is provided. An accurate mask is provided having a plurality of repetitive recognizable patterns thereon which is placed in the field of view of a pattern recognition system of a semiconductor processing machine to be calibrated. The semiconductor processing machine is programmed to perform a series of steps which steps the X-Y table to positions which are supposedly accurate relative to a fixed point. At each of the stepped points, the plurality of repetitive recognizable patterns on the mask are electronically scanned by the pattern recognition system and the deviation of the position of the pattern relative to the desired position is calculated to provide X and Y deviations from the theoretical position of the X-Y table. These deviations of points along a linear X and a linear Y axis are employed to calculate the actual deviations of other pattern points for all of the possible positions of movement along other X and Y axes.

公开(公告)号：US5205463A

公开(公告)日：1993-04-27

申请号：US894552

申请日：1992-06-05

申请人： William J. Holdgrafer ,  Lee R. Levine ,  Douglas L. Gauntt

发明人： William J. Holdgrafer ,  Lee R. Levine ,  Douglas L. Gauntt

IPC分类号： H01L21/60 ,  H01L21/607

CPC分类号： H01L24/85 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48511 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L24/78 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/181

摘要： A method of pre-forming a length of fine wire while simultaneously making a fire wire interconnection between a first and a second bonding point on a semiconductor device includes the steps of teaching the location of the edges of the die and teaching a plane in space which is located away from the edges of said die. After teaching the height of the clearance above the die and the XYZ location of the first and second bonding points the automatic wire bonder in directed to generate a desired geometric link profile between bonding points which defines the length of links L1, L2 and L3. Using the geometric profile and empirically determined constants the automatic wire bonder calculates a tool trajectory for pre-forming the fine wire while simultaneously making a fine wire interconnection with an automatic wire bonder.

摘要翻译： 一种在半导体器件上的第一和第二接合点之间同时形成火线互连的预成形细线的方法包括以下步骤：教导模具边缘的位置并在空间中教导一个平面 位于远离所述模具的边缘的位置。 在示出模具上方的间隙的高度和第一和第二接合点的XYZ位置之后，自动引线接合器被引导以在限定连接件L1，L2和L3的长度的接合点之间产生期望的几何连接轮廓。 使用几何轮廓和经验确定的常数，自动接线机计算用于预成形细丝的刀具轨迹，同时使用自动接线机进行细线互连。