公开(公告)号：US4392014A

公开(公告)日：1983-07-05

申请号：US255781

申请日：1981-04-20

申请人： William P. Trumble ,  Roger C. Finn ,  Charles F. C. Jackson

发明人： William P. Trumble ,  Roger C. Finn ,  Charles F. C. Jackson

IPC分类号： H02G15/00 ,  H02G15/10 ,  H02G15/117 ,  H02G15/113

CPC分类号： H02G15/117 ,  H02G15/003 ,  H02G15/10

摘要： A splice between ends of a pair of telecommunications cables is encapsulated in a thermoset foam. To encapsulate the splice it is positioned within a mold with the cables extending through apertures in the mold. At the apertures the cables are wrapped with an open cell foam material to block the cavity ends. A foam base material is then mixed with an activating agent which includes both a heat activated blowing agent and a material which reacts exothermically with the foam base material. The mixture is deposited within the mold and the mold closed. The mixture then foams to fill the mold and rapidly cures. The resulting joint is light, durable, waterproof and re-enterable.

摘要翻译： 一对通信电缆的端部之间的接头被封装在热固性泡沫中。 为了封装接头，将其定位在模具内，其中电缆延伸穿过模具中的孔。 在孔处，电缆用开孔泡沫材料包裹以阻挡空腔端部。 然后将泡沫基材与活化剂混合，活化剂包括热活化发泡剂和与泡沫基材物质放热反应的材料。 混合物沉积在模具内，模具封闭。 然后混合物泡沫以填充模具并迅速固化。 所得的接头轻便耐用，防水，可重新进入。

公开(公告)号：US4678272A

公开(公告)日：1987-07-07

申请号：US347013

申请日：1982-02-08

申请人： Roger C. Finn ,  Morley S. MacKenzie

发明人： Roger C. Finn ,  Morley S. MacKenzie

IPC分类号： B29C70/74 ,  B29D11/00 ,  G02B6/38

CPC分类号： G02B6/2558 ,  B29C70/74 ,  B29D11/00663 ,  B29L2011/0075

摘要： An optical fiber splice comprises two coated fibers, generally of fused silicon, fusion spliced end-to-end. The coating is removed from the ends of the fibers for a short distance prior to fusion. After fusion the uncoated ends and a short length of coated fiber, each side of the fusion joint, are encased in a synthetic resin. Conveniently, the resin is molded about the fibers and is cured by radiation, such as UV light, bright visual light and ion bombardment. The resin may contain reinforcement material.

摘要翻译： 光纤熔接包括两个经熔融硅涂覆的光纤，熔接端对端。 在融合之前，将涂层从纤维的端部移除短距离。 在融合后，未涂覆的端部和短长度的涂覆纤维，熔接接头的每一侧都被包裹在合成树脂中。 方便地，树脂围绕纤维成型，并通过辐射固化，例如UV光，明亮的视觉光和离子轰击。 树脂可以含有增强材料。

公开(公告)号：US4808434A

公开(公告)日：1989-02-28

申请号：US102696

申请日：1987-09-30

申请人： Reginald B. P. Bennett ,  Allan R. Drake ,  Roger C. Finn

发明人： Reginald B. P. Bennett ,  Allan R. Drake ,  Roger C. Finn

IPC分类号： H05K1/09 ,  H05K3/24 ,  H05K3/34 ,  H05K3/40 ,  H05K3/46 ,  B05D3/06 ,  B05D5/12

CPC分类号： H05K3/3484 ,  H05K3/247 ,  H05K3/4664 ,  H05K3/4685 ,  H05K1/095 ,  H05K2201/0305 ,  H05K2201/035 ,  H05K2203/043 ,  H05K3/4038

摘要： The invention provides a method of applying an overlay conductor between at least a pair of connection land areas on a surface of a printed circuit board. The pattern of the conductor is first defined by the application of a dielectric material between the pair of land areas. A silver polymer ink is then applied over the dielectric material and over only a portion of each land area. The polymer ink is then cured by exposure to a source of heat. The pair of land areas and at least the portion of the cured ink overlaying the land areas are then covered with silver solder paste which is subsequently reflowed by exposure to a source of heat and allowed to solidify thereby attaching the conductor to the land area and providing a secure conductive connection.

摘要翻译： 本发明提供一种在印刷电路板的表面上的至少一对连接区域之间施加覆盖导体的方法。 导体的图案首先通过在一对接地区域之间施加电介质材料来定义。 然后将银聚合物油墨施加在电介质材料上并且仅在每个焊盘区域的一部分上。 然后通过暴露于热源来固化聚合物油墨。 该对地面区域和至少覆盖在陆地区域上的固化油墨的部分然后用银焊膏覆盖，银焊膏随后通过暴露于热源而被回流并允许固化，从而将导体附着到陆地区域并提供 一个安全的导电连接。

公开(公告)号：US5895544A

公开(公告)日：1999-04-20

申请号：US769567

申请日：1996-12-19

申请人： Roger C. Finn ,  Raymond K. Orr

发明人： Roger C. Finn ,  Raymond K. Orr

IPC分类号： H01F27/26

CPC分类号： H01F27/263

摘要： A method of providing a predetermined set distance apart between two members in article manufacture. This involves clamping the members together with a mixture of an adhesive and glass microspheres between opposing surfaces of the members, the microspheres being of specific grid size. The largest diameter microspheres are gripped between the opposing surfaces thereby determining the distance between the members. The invention is particularly useful for precise location apart between members with small gaps therebetween, e.g. less than 3 mil. It is useful particularly for magnetic device cores of small dimensions.

摘要翻译： 一种在物品制造中在两个构件之间提供预定的设定距离的方法。 这涉及将构件与粘合剂和玻璃微球体的混合物夹在构件的相对表面之间，微球具有特定的格栅尺寸。 最大直径的微球被夹在相对的表面之间，从而确定构件之间的距离。 本发明对于在其间具有小间隙的构件之间的精确位置分离特别有用。 小于3密耳 特别适用于小尺寸的磁性器件芯。

公开(公告)号：US4762732A

公开(公告)日：1988-08-09

申请号：US101538

申请日：1987-09-28

申请人： Allan R. Drake ,  Roger C. Finn ,  Reginald B. P. Bennett

发明人： Allan R. Drake ,  Roger C. Finn ,  Reginald B. P. Bennett

IPC分类号： G03F7/004 ,  H05K1/09 ,  H05K3/24 ,  H05K3/34 ,  B05D3/06

CPC分类号： H05K3/247 ,  G03F7/0047 ,  H05K1/095 ,  H05K3/3484 ,  H05K2201/035 ,  H05K2203/043

摘要： The invention provides a process for forming an electrical conductor pattern on desired areas of a substrate comprising the steps of applying a predetermined pattern of silver polymer ink on the substrate and at least partially curing it. A layer of silver solder paste is then applied over the cured polymer ink to a width larger than that of the ink. The solder paste is then reflowed and allowed to solidify, whereby the silver polymer ink becomes encapsulated in the reflowed silver solder to form the desired pattern of conductors which may then be covered with a layer of dielectric material comprising a cured non-conductive polymer ink.

摘要翻译： 本发明提供了一种在衬底的期望区域上形成电导体图案的方法，包括以下步骤：在衬底上施加预定图案的银聚合物油墨并且至少部分地固化。 然后将一层银焊膏施加在固化的聚合物油墨上，其宽度大于油墨的宽度。 然后将焊膏回流并使其固化，由此银聚合物油墨被包封在回流的银焊料中以形成期望的导体图案，然后可以用包含固化的非导电聚合物油墨的介电材料层覆盖。