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1.发明申请ELECTROSTATIC DISCHARGE (ESD) PROTECTION FOR ELECTRONIC DEVICES USING WIRE-BONDING 有权使用电线连接的电子设备的静电放电（ESD）保护公开(公告)号：US20120019967A1
公开(公告)日：2012-01-26
申请号：US12839528
申请日：2010-07-20
申请人： William T. Bandy, IV , Dylan J. Boday , Peter J. Golcher , Icko E.T. Iben , Sassan K. Shahidi , Joyce L.S. Tang
发明人： William T. Bandy, IV , Dylan J. Boday , Peter J. Golcher , Icko E.T. Iben , Sassan K. Shahidi , Joyce L.S. Tang
CPC分类号： H01L23/60 , H01L27/0255 , H01L2224/48227 , H01L2224/4912 , H01L2224/73265 , H01L2924/00013 , H01L2924/10253 , H01L2924/3025 , Y10T29/4921 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： A system in one embodiment includes a cable having a plurality of cable leads, and a multi-diode chip having a pad-side not facing the cable. The multi-diode chip includes a plurality of sets of contact pads on the pad-side of the multi-diode chip, and a plurality of crossed diode sets, wherein each set of crossed diodes is coupled between a first contact pad and a second contact pad of one set of contact pads, wherein at least two of the plurality of cable leads are coupled via wire-bonding to one of the plurality of sets of contact pads of the multi-diode chip for providing electrostatic discharge (ESD) protection for at least one element of the electronic device coupled to the at least two cable leads.
摘要翻译： 一个实施例中的系统包括具有多个电缆引线的电缆，以及具有焊盘侧不面向电缆的多极二极管芯片。 多二极管芯片包括在多二极管芯片的焊盘侧上的多组接触焊盘和多个交叉二极管组，其中每组交叉二极管耦合在第一接触焊盘和第二接触件之间 一组接触焊盘的焊盘，其中多个电缆引线中的至少两个通过引线接合耦合到多二极管芯片的多组接触焊盘之一，用于提供静电放电（ESD）保护，用于在 耦合到所述至少两个电缆引线的所述电子设备的至少一个元件。
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2.发明授权Electrostatic discharge (ESD) protection for electronic devices using wire-bonding 有权使用引线键合的电子设备的静电放电（ESD）保护公开(公告)号：US08514534B2
公开(公告)日：2013-08-20
申请号：US12839528
申请日：2010-07-20
申请人： William T. Bandy, IV , Dylan J. Boday , Peter J. Golcher , Icko E. T. Iben , Sassan K. Shahidi , Joyce L. S. Tang
发明人： William T. Bandy, IV , Dylan J. Boday , Peter J. Golcher , Icko E. T. Iben , Sassan K. Shahidi , Joyce L. S. Tang
CPC分类号： H01L23/60 , H01L27/0255 , H01L2224/48227 , H01L2224/4912 , H01L2224/73265 , H01L2924/00013 , H01L2924/10253 , H01L2924/3025 , Y10T29/4921 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： A system in one embodiment includes a cable having a plurality of cable leads, and a multi-diode chip having a pad-side not facing the cable. The multi-diode chip includes a plurality of sets of contact pads on the pad-side of the multi-diode chip, and a plurality of crossed diode sets, wherein each set of crossed diodes is coupled between a first contact pad and a second contact pad of one set of contact pads, wherein at least two of the plurality of cable leads are coupled via wire-bonding to one of the plurality of sets of contact pads of the multi-diode chip for providing electrostatic discharge (ESD) protection for at least one element of the electronic device coupled to the at least two cable leads.
摘要翻译： 一个实施例中的系统包括具有多个电缆引线的电缆，以及具有焊盘侧不面向电缆的多极二极管芯片。 多二极管芯片包括在多二极管芯片的焊盘侧上的多组接触焊盘和多个交叉二极管组，其中每组交叉二极管耦合在第一接触焊盘和第二接触件之间 一组接触焊盘的焊盘，其中多个电缆引线中的至少两个通过引线接合耦合到多二极管芯片的多组接触焊盘之一，用于提供静电放电（ESD）保护，用于在 耦合到所述至少两个电缆引线的所述电子设备的至少一个元件。
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3.发明授权公开(公告)号：US08405950B2
公开(公告)日：2013-03-26
申请号：US12125007
申请日：2008-05-21
IPC分类号： H01H47/00
CPC分类号： H05K1/0259 , H05K1/0393 , H05K1/167 , H05K3/323 , Y10T29/49208
摘要： A cable having an electrostatic discharge (ESD) dissipative layer in one embodiment includes a plurality of leads; an ESD dissipative layer; and a coupling layer between the leads and the ESD dissipative layer, the coupling layer electrically connecting each of the leads, individually, to the ESD dissipative layer. A cable having an electrostatic discharge (ESD) dissipative layer in another embodiment comprises at least 16 leads; an ESD dissipative layer; and a coupling layer between the leads and the ESD dissipative layer, the coupling layer electrically connecting each of the leads, individually, to the ESD dissipative layer. A method for fabricating a cable in one embodiment comprises coupling an electrostatic discharge (ESD) dissipative layer to a plurality of leads using a coupling layer between the leads and the ESD dissipative layer, the coupling layer electrically connecting each of the leads, individually, to the ESD dissipative layer.
摘要翻译： 在一个实施例中，具有静电放电（ESD）耗散层的电缆包括多个引线; ESD耗散层; 以及引线和ESD耗散层之间的耦合层，所述耦合层将每个引线单独地电连接到ESD耗散层。 在另一个实施例中具有静电放电（ESD）耗散层的电缆包括至少16个引线; ESD耗散层; 以及引线和ESD耗散层之间的耦合层，所述耦合层将每个引线单独地电连接到ESD耗散层。 在一个实施例中制造电缆的方法包括使用引线和ESD耗散层之间的耦合层将静电放电（ESD）耗散层耦合到多个引线，所述耦合层单独地将每个引线电连接到 ESD耗散层。
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公开(公告)号：US07274536B2
公开(公告)日：2007-09-25
申请号：US11449443
申请日：2006-06-07
申请人： Annayya P. Deshpande , Hoodin Hamidi , Icko E. Iben , Kevin Thuy Luong , Sassan K. Shahidi , Abel J. Taina
发明人： Annayya P. Deshpande , Hoodin Hamidi , Icko E. Iben , Kevin Thuy Luong , Sassan K. Shahidi , Abel J. Taina
IPC分类号： G11B5/127
CPC分类号： G11B5/105 , G11B5/00821 , G11B5/60 , G11B15/62
摘要： A tape head read/write module that has a composite air bearing surface, and a method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the module includes a substrate that has an air bearing surface, a front, a back, and a chip receiving slot. The air bearing surface of the substrate has a first portion adjoining a first side of the chip receiving slot, and a second portion adjoining a second side of the chip receiving slot. The module also includes a chip that has an air bearing surface, a bottom surface, a front, a back, and active elements. The active elements are located proximate the front of the chip. The chip is positioned in the chip receiving slot in the substrate, with the air bearing surface of the chip substantially aligned with the air bearing surface of the substrate.
摘要翻译： 具有复合空气轴承表面的磁头读/写模块，以及用于将芯片嵌入基板以形成复合空气轴承表面的方法和装置。 模块的示例包括具有空气轴承表面，前部，后部和芯片接收槽的基板。 衬底的空气轴承表面具有邻接芯片接收槽的第一侧的第一部分和与芯片接收槽的第二侧相邻的第二部分。 该模块还包括具有空气轴承表面，底面，前部，后部和有源元件的芯片。 有源元件靠近芯片的前部。 芯片位于基板中的芯片接收槽中，芯片的空气轴承表面基本上与基板的空气轴承表面对准。
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公开(公告)号：US20090067089A1
公开(公告)日：2009-03-12
申请号：US11852667
申请日：2007-09-10
IPC分类号： G11B33/00
CPC分类号： H05K1/0313 , G11B5/00813 , H05K1/0393 , H05K2201/0141
摘要： A tape drive system according to one general embodiment includes a magnetic head; a drive mechanism for passing a magnetic recording tape over the head; a cable coupled to the magnetic head, the cable comprising a first layer of liquid crystal polymer, and at least 16 electrically conductive leads operatively coupled to the first layer of liquid crystal polymer; and a controller coupled to the cable, and communicating with the head using the cable. A cable according to another general embodiment includes a first layer of liquid crystal polymer; and at least 16 electrically conductive leads operatively coupled to the first layer of liquid crystal polymer.
摘要翻译： 根据一般实施例的磁带驱动系统包括磁头; 用于将磁记录带通过头部的驱动机构; 耦合到所述磁头的电缆，所述电缆包括第一层液晶聚合物，以及至少16个导电引线，可操作地耦合到所述第一液晶聚合物层; 以及耦合到电缆的控制器，并且使用电缆与头部通信。 根据另一个一般实施例的电缆包括第一层液晶聚合物; 以及可操作地耦合到第一液晶聚合物层的至少16个导电引线。
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公开(公告)号：US07167339B2
公开(公告)日：2007-01-23
申请号：US10727788
申请日：2003-12-03
申请人： Robert Glenn Biskeborn , Luis Hector Palacios Borja , Calvin Shyhjong Lo , Kevin Thuy Luong , Sassan K. Shahidi
发明人： Robert Glenn Biskeborn , Luis Hector Palacios Borja , Calvin Shyhjong Lo , Kevin Thuy Luong , Sassan K. Shahidi
IPC分类号： G11B5/187
CPC分类号： G11B5/39 , G11B5/40 , Y10T29/49021 , Y10T29/49036 , Y10T29/49041 , Y10T29/49048
摘要： A method is provided for providing air-skiving edges of a tape head. A slot is created in an upper face of a substrate of a tape head. The slot includes at least one edge defining an edge of a tape bearing surface (TBS) of the tape head. The surface of the tape head is then formed and finished, such as by lapping. A grind operation is subsequently conducted to form a notch in the upper face of the substrate of the tape head. Such notch extends from the slot to an outside end of the substrate of the tape head.
摘要翻译： 提供了一种用于提供磁头的空气刮除边缘的方法。 在磁带头的基板的上表面上形成槽。 所述槽包括至少一个限定所述带头的带支承表面（TBS）的边缘的边缘。 然后，例如通过研磨，形成并完成带头的表面。 随后进行研磨操作以在带头的基材的上表面形成切口。 这样的缺口从带头的基底的狭缝延伸到外端。
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7.发明授权Method and apparatus for embedding a chip in a substrate to form a composite air bearing surface 失效将芯片嵌入基板以形成复合空气轴承表面的方法和装置公开(公告)号：US07082013B2
公开(公告)日：2006-07-25
申请号：US10431247
申请日：2003-05-06
申请人： Annayya P. Deshpande , Hoodin Hamidi , Icko E. Iben , Kevin Thuy Luong , Sassan K. Shahidi , Abel J. Taina
发明人： Annayya P. Deshpande , Hoodin Hamidi , Icko E. Iben , Kevin Thuy Luong , Sassan K. Shahidi , Abel J. Taina
IPC分类号： G11B17/32
CPC分类号： G11B5/105 , G11B5/00821 , G11B5/60 , G11B15/62
摘要： A method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the method includes securing the substrate in a fixed position, aligning the chip in a first direction with a chip receiving slot in the substrate, depositing adhesive in the chip receiving slot, and aligning the chip in a second direction with the chip receiving slot. The chip is pushed into the adhesive in the chip receiving slot until the air bearing surface of the chip is substantially at a desired protrusion in a third direction in relation to the air bearing surface of the substrate. The adhesive is cured with the air bearing surface of the chip substantially at the desired protrusion in the third direction, and with the chip substantially aligned in the first and second directions with chip receiving slot.
摘要翻译： 一种用于将芯片嵌入基板以形成复合空气轴承表面的方法和装置。 该方法的一个实例包括将基板固定在固定位置，将芯片沿第一方向与衬底中的芯片接收槽对准，在芯片接收槽中沉积粘合剂，并将芯片沿第二方向与芯片接收 槽 芯片被推入到芯片接收槽中的粘合剂中，直到芯片的空气支承表面相对于衬底的空气轴承表面在第三方向上基本上处于期望的突起。 粘合剂在芯片的空气支承表面基本上在第三方向上以期望的突起固化，并且芯片在第一和第二方向上基本上与芯片接收槽对齐。
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公开(公告)号：US08213120B2
公开(公告)日：2012-07-03
申请号：US11852667
申请日：2007-09-10
CPC分类号： H05K1/0313 , G11B5/00813 , H05K1/0393 , H05K2201/0141
摘要： A tape drive system according to one general embodiment includes a magnetic head; a drive mechanism for passing a magnetic recording tape over the head; a cable coupled to the magnetic head, the cable comprising a first layer of liquid crystal polymer, and at least 16 electrically conductive leads operatively coupled to the first layer of liquid crystal polymer; and a controller coupled to the cable, and communicating with the head using the cable. A cable according to another general embodiment includes a first layer of liquid crystal polymer; and at least 16 electrically conductive leads operatively coupled to the first layer of liquid crystal polymer.
摘要翻译： 根据一般实施例的磁带驱动系统包括磁头; 用于将磁记录带通过头部的驱动机构; 耦合到所述磁头的电缆，所述电缆包括第一层液晶聚合物，以及至少16个导电引线，可操作地耦合到所述第一液晶聚合物层; 以及耦合到电缆的控制器，并且使用电缆与头部通信。 根据另一个一般实施例的电缆包括第一层液晶聚合物; 以及可操作地耦合到第一液晶聚合物层的至少16个导电引线。
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9.发明申请公开(公告)号：US20090290278A1
公开(公告)日：2009-11-26
申请号：US12125007
申请日：2008-05-21
CPC分类号： H05K1/0259 , H05K1/0393 , H05K1/167 , H05K3/323 , Y10T29/49208
摘要： A cable having an electrostatic discharge (ESD) dissipative layer in one embodiment includes a plurality of leads; an ESD dissipative layer; and a coupling layer between the leads and the ESD dissipative layer, the coupling layer electrically connecting each of the leads, individually, to the ESD dissipative layer. A cable having an electrostatic discharge (ESD) dissipative layer in another embodiment comprises at least 16 leads; an ESD dissipative layer; and a coupling layer between the leads and the ESD dissipative layer, the coupling layer electrically connecting each of the leads, individually, to the ESD dissipative layer. A method for fabricating a cable in one embodiment comprises coupling an electrostatic discharge (ESD) dissipative layer to a plurality of leads using a coupling layer between the leads and the ESD dissipative layer, the coupling layer electrically connecting each of the leads, individually, to the ESD dissipative layer.
摘要翻译： 在一个实施例中，具有静电放电（ESD）耗散层的电缆包括多个引线; ESD耗散层; 以及引线和ESD耗散层之间的耦合层，所述耦合层将每个引线单独地电连接到ESD耗散层。 在另一个实施例中具有静电放电（ESD）耗散层的电缆包括至少16个引线; ESD耗散层; 以及引线和ESD耗散层之间的耦合层，所述耦合层将每个引线单独地电连接到ESD耗散层。 在一个实施例中制造电缆的方法包括使用引线和ESD耗散层之间的耦合层将静电放电（ESD）耗散层耦合到多个引线，所述耦合层单独地将每个引线电连接到 ESD耗散层。
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10.发明授权Cable having translucent, semi-transparent or transparent ESD dissipative layer and/or metallic layer 失效电缆具有半透明，半透明或透明的ESD耗散层和/或金属层公开(公告)号：US07525047B2
公开(公告)日：2009-04-28
申请号：US11781850
申请日：2007-07-23
IPC分类号： H01B7/08
CPC分类号： G11B5/486 , G11B5/4853
摘要： A cable in one embodiment includes a plurality of leads; and an electrostatic discharge (ESD) dissipative layer operatively coupled to the leads, the ESD dissipative layer being characterized as being at least one of translucent, semi-transparent or transparent. A cable in another embodiment includes a plurality of leads; an ESD dissipative layer operatively coupled to the leads, the ESD dissipative layer; and a metallic layer operatively coupled to the leads, the metallic and ESD dissipative layers being characterized as being at least one of translucent, semi-transparent or transparent. A cable in another embodiment includes a plurality of leads; a metallic layer operatively coupled to the leads, the metallic layer being characterized as being at least one of translucent, semi-transparent or transparent, wherein the metallic layer has a volume resistivity of greater than 1×104 ohm·cm as defined by ANSI/EIA-541-1988; and an insulating layer positioned between the metallic layer and the leads.
摘要翻译： 一个实施例中的电缆包括多个引线; 以及可操作地耦合到所述引线的静电放电（ESD）耗散层，所述ESD耗散层被表征为半透明，半透明或透明中的至少一个。 另一实施例中的电缆包括多个引线; 可操作地耦合到引线的ESD耗散层，ESD耗散层; 以及可操作地耦合到所述引线的金属层，所述金属和ESD耗散层被表征为半透明，半透明或透明中的至少一个。 另一实施例中的电缆包括多个引线; 金属层，其可操作地耦合到所述引线，所述金属层的特征在于为半透明，半透明或透明中的至少一种，其中所述金属层具有大于1×104欧姆·厘米的体积电阻率，如ANSI / EIA- 541-1988; 以及位于金属层和引线之间的绝缘层。
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