公开(公告)号：US20100213475A1

公开(公告)日：2010-08-26

申请号：US12772968

申请日：2010-05-03

Applicant: Won-Jin SON

Inventor： Won-Jin SON

IPC: H01L27/15

CPC classification number: H01L33/48 ,  H01L25/0753 ,  H01L33/38 ,  H01L33/483 ,  H01L33/486 ,  H01L33/50 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/00014

Abstract: Provided is a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes a package main body with a cavity, a plurality of light emitting diode chips, a wire, and a plurality of lead frames. The plurality of light emitting diode chips are mounted in the cavity. The wire is connected to an electrode of at least one light emitting diode chip. The plurality of lead frames are formed in the cavity, and at least one lead frame is electrically connected to the light emitting diode chip or a plurality of wires.

Abstract translation: 提供一种发光二极管封装及其制造方法。 发光二极管封装包括具有空腔的封装主体，多个发光二极管芯片，导线和多个引线框架。 多个发光二极管芯片安装在空腔中。 导线连接至少一个发光二极管芯片的电极。 多个引线框架形成在空腔中，并且至少一个引线框架电连接到发光二极管芯片或多个导线。

公开(公告)号：US20100258823A1

公开(公告)日：2010-10-14

申请号：US12814336

申请日：2010-06-11

Applicant: Won-Jin SON

Inventor： Won-Jin SON

IPC: H01L33/52 ,  H01L33/36 ,  H01L33/44 ,  H01L33/62

CPC classification number: H01L33/48 ,  H01L25/0753 ,  H01L33/38 ,  H01L33/483 ,  H01L33/486 ,  H01L33/50 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/00014

Abstract: Provided is a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes a package main body with a cavity, a plurality of light emitting diode chips, a wire, and a plurality of lead frames. The plurality of light emitting diode chips are mounted in the cavity. The wire is connected to ah electrode of at least one light emitting diode chip. The plurality of lead frames are formed in the cavity, and at least one lead frame is electrically connected to the light emitting diode chip or a plurality of wires.

Abstract translation: 提供一种发光二极管封装及其制造方法。 发光二极管封装包括具有空腔的封装主体，多个发光二极管芯片，导线和多个引线框架。 多个发光二极管芯片安装在空腔中。 电线与至少一个发光二极管芯片的电极连接。 多个引线框架形成在空腔中，并且至少一个引线框架电连接到发光二极管芯片或多个导线。