Abstract:
An apparatus and method for delay time computation and delay compensation between a Base Station (BS) and a remote Radio Frequency (RF) unit in a broadband wireless access system are provided. In a method of operating an apparatus for determining a delay time to compensate for delay between a BS modem card and a remote RF unit in a wireless access system, the method includes determining a process delay time required when traffic data is output from the BS modem card to an antenna of the remote RF unit in a state where a reference cable having a length short enough to neglect a cable delay time is connected between the BS modem card and the remote RF unit, determining a cable delay time required when a sync pulse signal is transmitted through a cable used in actual system operation between the BS modem card and the remote RF unit, and determining a time for outputting traffic data at an earlier time from a modem included in the BS modem card by using the determined process delay time and cable delay time.
Abstract:
A temperature control method of a semiconductor device is provided. The temperature control method includes detecting a temperature of the semiconductor device; activating a reverse body biasing operation in which a body bias voltage applied to a function block of the semiconductor device is regulated, when the detected temperature is greater than a first temperature level; and activating a thermal throttling operation in which at least one of a frequency of a driving clock provided to a function block of the semiconductor device and a driving voltage applied to the function block of the semiconductor device is regulated, when the detected temperature is greater than a second temperature level that is different than the first temperature level.
Abstract:
Provided is a system for providing a MyData service using information provision and profit distribution, including at least one user terminal that consents to information provision of at least one type of MyData and receives profit distribution when the at least one type of MyData of which information is provided is utilized, an enterprise terminal, and a MyData service provision server that includes a consent confirmation unit that receives consent to information provision of at least one type of MyData from the at least one user terminal, a collection unit, an information provision unit that extracts MyData corresponding to target data for which information provision is required and provides the MyData to the enterprise terminal when the target data is received from the enterprise terminal, and a profit distribution unit that distributes profits to at least one user terminal that has provided MyData provided to the enterprise terminal.
Abstract:
There is provided a semiconductor package including: a semiconductor chip; and an extension die provided on the semiconductor chip, wherein the semiconductor chip includes a heating point configured to generate a temperature greater than or equal to a pre-determined reference temperature in the semiconductor chip, the heating point provided in a center region of the extension die