摘要:
A wafer loading system positioning method and device, comprising a loading system, having a base and a rear plate for docking on a positioning frame of a production equipment. The main characteristic thereof is that the loading system in an upper part of the rear plate has a holding seat and the positioning frame in an upper part of a front side has an upward extending positioning element. Two eccentric cams on the holding seat and the positioning element allow to adjust a relative position of the holding seat with respect to the positioning element. A lifting mechanism enables raising of the loading system for lifting said holding seat above said positioning element, so as to enable said holding seat to engage with said positioning element.
摘要:
The invention includes mainly a machine base, a carrier, a sliding control mechanism, a latch mechanism, a horizontal shifting mechanism, and a lifting mechanism. The FOUP (front-opening unified pod) is put on the carrier and latched by a locking plate of the latch at an accurate position. The carrier moves forwardly to tightly engage the FOUP to a gate on an access at a backboard of the machine base, and thus a cover of the FOUP is opened by a headstock gear at the back of the gate then carried backwardly away from the FOUP by the horizontal shifting mechanism and lowered by the lifting mechanism. Reversely, the cover is closed on the FOUP. As such, the cover is loaded and opened automatically, as well as in closed, which can be a part of automation and prevents wafers from contamination.
摘要:
A two screw double-stroke and screw differential-motion mechanism is applied in a standard mechanical interface. The two mechanisms are utilized for the correlation of transmission between screws and nuts and the screw differential-motion, so as to achieve more efficient positioning and clamp retrieval and placement.
摘要:
A brittle material breaking apparatus using a lifting mechanism to lift/lower a carrier wherein the lifting mechanism is controlled to lift the carrier for holding the brittle material for breaking, and then to lower the carrier from the brittle material to a distance for enabling the brittle material to be shifted to a next scribe line for further breaking, preventing the occurrence of friction between the brittle material and the carrier and the production of static electricity and micro particles and, improving the breaking quality. The brittle material breaking apparatus further includes a stroke fine adjustment mechanism adapted to adjust the stroke of the breaking-cutter relative to the brittle material.
摘要:
A brittle material rotating and aligning mechanism including a bearing, a rotary table, and a driving mechanismU, and installed in the worktable of a brittle material scribing and breaking apparatus; carries brittle material, for example, a semiconductor wafer for scribing and breaking into individual dies. The driving mechanism uses a flexible transmission member to rotate the rotary table for low installation cost, no requirement for a precision adjustment during installation, and, preventing the occurrence of back lash or the production of particles due to friction between the transmission member and the driving wheel of the driving mechanism, or between the transmission member and the rotary table.
摘要:
A brittle material breaking apparatus using a lifting mechanism to lift/lower a carrier wherein the lifting mechanism is controlled to lift the carrier for holding the brittle material for breaking, and then to lower the carrier from the brittle material to a distance for enabling the brittle material to be shifted to a next scribe line for further breaking, preventing the occurrence of friction between the brittle material and the carrier and the production of static electricity and micro particles and, improving the breaking quality. The brittle material breaking apparatus further includes a stroke fine adjustment mechanism adapted to adjust the stroke of the breaking-cutter relative to the brittle material.
摘要:
A brittle material rotating and aligning mechanism including a bearing, a rotary table, and a driving mechanismU, and installed in the worktable of a brittle material scribing and breaking apparatus; carries brittle material, for example, a semiconductor wafer for scribing and breaking into individual dies. The driving mechanism uses a flexible transmission member to rotate the rotary table for low installation cost, no requirement for a precision adjustment during installation, and, preventing the occurrence of back lash or the production of particles due to friction between the transmission member and the driving wheel of the driving mechanism, or between the transmission member and the rotary table.
摘要:
A brittle material rotating and aligning mechanism including a bearing, a rotary table, and a driving mechanismU, and installed in the worktable of a brittle material scribing and breaking apparatus; carries brittle material, for example, a semiconductor wafer for scribing and breaking into individual dies. The driving mechanism uses a flexible transmission member to rotate the rotary table for low installation cost, no requirement for a precision adjustment during installation, and, preventing the occurrence of back lash or the production of particles due to friction between the transmission member and the driving wheel of the driving mechanism, or between the transmission member and the rotary table.
摘要:
A cutting tool adjustment method includes lowering a cutting tool on a transparent Mylar to produce an indentation before an actual scribing operation; picking up the image of the indentation; using a numerical analysis method and a set formula to automatically calculate a correction angle and position so as to adjust the angle and position of the cutting tool subject to the calculation result; and repeating the calculation and adjustment procedures, if necessary.
摘要:
A cutting tool adjustment method is disclosed to lower a cutting tool on a transparent Mylar to produce an indentation before actual scribing operation, and then to pick up the image of the indentation, and then to use a numerical analysis method and the set formula to automatically calculate the correction angle and position and to adjust the angle and position of the cutting tool subject to the calculation result, and then to repeat the calculation and adjustment procedure if necessary. Thus, the cutting tool and its cutting edge can be accurately adjusted to the correct angle and position to obtain a precise indentation. Further, by means of the automatic adjustment procedure, the present invention saves much adjusting time, thereby improving the productivity.