公开(公告)号：US10306775B2

公开(公告)日：2019-05-28

申请号：US15409807

申请日：2017-01-19

Applicant: XEROX CORPORATION

Inventor： Chad David Freitag ,  Tygh James Newton ,  Chad Johan Slenes

IPC: H05K3/40 ,  H05K1/11 ,  H05K3/36 ,  H05K3/32

Abstract: A method of forming an electrical interconnect includes etching a lattice pattern into a contact pad on a circuit substrate as a first connection point, at least partially filling the lattice pattern with a conductive epoxy, contacting the conductive epoxy with a second connection point, and curing the epoxy.

公开(公告)号：US20170135228A1

公开(公告)日：2017-05-11

申请号：US15409807

申请日：2017-01-19

Applicant: XEROX CORPORATION

Inventor： Chad David Freitag ,  Tygh James Newton ,  Chad Johan Slenes

IPC: H05K3/40

CPC classification number: H05K3/4007 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K3/321 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/0394 ,  H05K2201/09681 ,  H05K2201/0969

Abstract: A method of forming an electrical interconnect includes etching a lattice pattern into a contact pad on a circuit substrate as a first connection point, at least partially filling the lattice pattern with a conductive epoxy, contacting the conductive epoxy with a second connection point, and curing the epoxy.

公开(公告)号：US09278526B1

公开(公告)日：2016-03-08

申请号：US14513793

申请日：2014-10-14

Applicant: XEROX CORPORATION

Inventor： Chad Johan Slenes ,  Samuel Vincent Schultz ,  William Bruce Weaver ,  Jon Garret Judge

IPC: B41J2/045 ,  B41J2/14 ,  B41J2/16

CPC classification number: B41J2/14201 ,  B41J2/14233 ,  B41J2002/14491

Abstract: A printhead for a printer and methods for making the printhead. The printhead may include a driver module on a jetstack. The jetstack may include a plurality of holes formed therethrough. A first adhesive layer may be disposed on the jetstack. A diaphragm plate may be disposed on the first adhesive layer. A piezoelectric layer may be disposed on the diaphragm plate. A second adhesive layer may be disposed on the piezoelectric layer. A chip on flex may be disposed on the second adhesive layer.

Abstract translation: 用于打印机的打印头和制造打印头的方法。 打印头可以包括在喷射架上的驱动器模块。 喷射架可以包括穿过其中形成的多个孔。 第一粘合剂层可以设置在喷涂层上。 隔膜板可以设置在第一粘合剂层上。 压电层可以设置在隔膜板上。 第二粘合剂层可以设置在压电层上。 柔性芯片可以设置在第二粘合剂层上。