公开(公告)号：US11309271B2

公开(公告)日：2022-04-19

申请号：US16941486

申请日：2020-07-28

Applicant: XINTEC INC.

Inventor： Jiun-Yen Lai ,  Chia-Hsiang Chen

IPC: H01L23/00 ,  H01L23/48

Abstract: A chip structure includes a first substrate, a second substrate, a conductive via, and a redistribution layer. The first substrate has a first inclined sidewall. The second substrate is located on a bottom surface of the first substrate, and has an upper portion and a lower portion. The lower portion extends from the upper portion. The upper portion is between the first substrate and the lower portion. The upper portion has a second inclined sidewall, and a slope of the first inclined sidewall is substantially equal to a slope of the second inclined sidewall. The conductive via is in the lower portion. The redistribution layer extends from a top surface of the first substrate to a top surface of the lower portion of the second substrate sequentially along the first inclined sidewall and the second inclined sidewall, and is electrically connected to the conductive via.

公开(公告)号：US11935859B2

公开(公告)日：2024-03-19

申请号：US17588185

申请日：2022-01-28

Applicant: XINTEC INC.

Inventor： Jiun-Yen Lai ,  Chia-Hsiang Chen

IPC: H01L23/00 ,  H01L23/48

CPC classification number: H01L24/29 ,  H01L23/481 ,  H01L24/05 ,  H01L24/19 ,  H01L24/20 ,  H01L24/27 ,  H01L2224/29026

Abstract: A chip structure includes a first substrate, a second substrate, a conductive via, and a redistribution layer. The first substrate has a first inclined sidewall. The second substrate is located on a bottom surface of the first substrate, and has an upper portion and a lower portion. The lower portion extends from the upper portion. The upper portion is between the first substrate and the lower portion. The upper portion has a second inclined sidewall, and a slope of the first inclined sidewall is substantially equal to a slope of the second inclined sidewall. The conductive via is in the lower portion. The redistribution layer extends from a top surface of the first substrate to a top surface of the lower portion of the second substrate sequentially along the first inclined sidewall and the second inclined sidewall, and is electrically connected to the conductive via.