-
公开(公告)号：US11732362B2
公开(公告)日：2023-08-22
申请号：US16781813
申请日：2020-02-04
Applicant: Xerox Corporation , Palo Alto Research Center Incorporated
Inventor： Yunda Wang , Sourobh Raychaudhuri , JengPing Lu , Eugene M. Chow , Julie A. Bert , David Biegelsen , George A. Gibson , Jamie Kalb
CPC classification number: C23C16/50 , B81B3/0018 , H01L21/67271 , H01L21/67282 , H01L21/67294 , H01L24/75 , H01L24/95 , H01L2224/95001 , H01L2224/95101 , H01L2224/95115 , H01L2224/95144 , H01L2224/95145 , H01L2924/10253 , H01L2924/1434 , H01L2924/1461
Abstract: Disclosed herein are implementations of a particles-transferring system, particle transferring unit, and method of transferring particles in a pattern. In one implementation, a particles-transferring system includes a first substrate including a first surface to support particles in a pattern, particle transferring unit including an outer surface to be offset from the first surface by a first gap, and second substrate including a second surface to be offset from the outer surface by a second gap. The particle transferring unit removes the particles from the first surface in response to the particles being within the first gap, secures the particles in the pattern to the outer surface, and transports the particles in the pattern. The second substrate removes the particles in the pattern from the particle transferring unit in response to the particles being within the second gap. The particles are to be secured in the pattern to the second surface.
-
公开(公告)号：US20180327905A1
公开(公告)日：2018-11-15
申请号：US15591959
申请日：2017-05-10
Applicant: Xerox Corporation , Palo Alto Research Center Incorporated
Inventor： Yunda Wang , Sourobh Raychaudhuri , JengPing Lu , Eugene M. Chow , Julie A. Bert , David Biegelsen , George A. Gibson , Jamie Kalb
IPC: C23C16/50
CPC classification number: H01L21/67271 , H01L21/67282 , H01L21/67294 , H01L24/75 , H01L24/81 , H01L24/95
Abstract: Disclosed herein are implementations of a particles-transferring system, particle transferring unit, and method of transferring particles in a pattern. In one implementation, a particles-transferring system includes a first substrate including a first surface to support particles in a pattern, particle transferring unit including an outer surface to be offset from the first surface by a first gap, and second substrate including a second surface to be offset from the outer surface by a second gap. The particle transferring unit removes the particles from the first surface in response to the particles being within the first gap, secures the particles in the pattern to the outer surface, and transports the particles in the pattern. The second substrate removes the particles in the pattern from the particle transferring unit in response to the particles being within the second gap. The particles are to be secured in the pattern to the second surface.
-
公开(公告)号：US20200173026A1
公开(公告)日：2020-06-04
申请号：US16781813
申请日：2020-02-04
Applicant: Xerox Corporation , Palo Alto Research Center Incorporated
Inventor： Yunda Wang , Sourobh Raychaudhuri , JengPing Lu , Eugene M. Chow , Julie A. Bert , David Biegelsen , George A. Gibson , Jamie Kalb
Abstract: Disclosed herein are implementations of a particles-transferring system, particle transferring unit, and method of transferring particles in a pattern. In one implementation, a particles-transferring system includes a first substrate including a first surface to support particles in a pattern, particle transferring unit including an outer surface to be offset from the first surface by a first gap, and second substrate including a second surface to be offset from the outer surface by a second gap. The particle transferring unit removes the particles from the first surface in response to the particles being within the first gap, secures the particles in the pattern to the outer surface, and transports the particles in the pattern. The second substrate removes the particles in the pattern from the particle transferring unit in response to the particles being within the second gap. The particles are to be secured in the pattern to the second surface.
-
公开(公告)号：US10604843B2
公开(公告)日：2020-03-31
申请号：US15591959
申请日：2017-05-10
Applicant: Xerox Corporation , Palo Alto Research Center Incorporated
Inventor： Yunda Wang , Sourobh Raychaudhuri , JengPing Lu , Eugene M. Chow , Julie A. Bert , David Biegelsen , George A. Gibson , Jamie Kalb
Abstract: Disclosed herein are implementations of a particles-transferring system, particle transferring unit, and method of transferring particles in a pattern. In one implementation, a particles-transferring system includes a first substrate including a first surface to support particles in a pattern, particle transferring unit including an outer surface to be offset from the first surface by a first gap, and second substrate including a second surface to be offset from the outer surface by a second gap. The particle transferring unit removes the particles from the first surface in response to the particles being within the first gap, secures the particles in the pattern to the outer surface, and transports the particles in the pattern. The second substrate removes the particles in the pattern from the particle transferring unit in response to the particles being within the second gap. The particles are to be secured in the pattern to the second surface.
-
公开(公告)号：US12224082B2
公开(公告)日：2025-02-11
申请号：US18107575
申请日：2023-02-09
Applicant: PALO ALTO RESEARCH CENTER INCORPORATED
Inventor： Qian Wang , Christopher L. Chua , Yu Wang , Eugene M. Chow
Abstract: A microspring includes a film stack having a base disposed on a build plane and a spring member extending from the base. The film stack includes a compressive layer, a substantially stress-free layer, and a tensile layer. The film stack is formed of one or more materials that become superconducting below 140 K. A stress gradient in the film stack causes the spring member to curl away from the build plane of the base.
-
Patent Agency Ranking
公开(公告)号：US11615976B2
公开(公告)日：2023-03-28
申请号：US17690485
申请日：2022-03-09
Applicant: PALO ALTO RESEARCH CENTER INCORPORATED
Inventor： JengPing Lu , Eugene M. Chow , David K. Biegelsen
IPC: H01L21/68 , H01L21/683
Abstract: First and second chiplets are positioned along a surface to respectively cover first and second electrodes. The first electrode is activated to cause an attraction force between the first electrode and the first chiplet. The second electrode is deactivated allowing the second chiplet to rotate on the surface. While the first electrode is activated and the second electrode is deactivated, a rotation field is applied to cause the second chiplet to be oriented at a desired orientation angle, the first chiplet being prevented from rotating by the attraction force.
-
7.发明授权公开(公告)号：US11527420B2
公开(公告)日：2022-12-13
申请号：US17208322
申请日：2021-03-22
Applicant: Palo Alto Research Center Incorporated
Inventor： Christopher L. Chua , Qian Wang , Eugene M. Chow
IPC: H01L21/56 , H01L23/532 , H01L23/29 , H01L23/31 , H01L23/482 , H01L23/00
Abstract: A release layer is formed on a surface of an integrated circuit wafer. The surface is passivated and includes metal contact materials. A stress-engineered film having an intrinsic stress profile is deposited over the release layer. The stress-engineered film is patterned and the release layer is undercut etched so that a released portion of the patterned stress-engineered film is released from the surface while leaving an anchor portion fixed to the surface. The intrinsic stress profile in the stress-engineered film biases the released portion away from the surface. The released portion is placed entirely within an area defined by the metal contact material.
-
公开(公告)号：US20220382227A1
公开(公告)日：2022-12-01
申请号：US17326902
申请日：2021-05-21
Applicant: Palo Alto Research Center Incorporated
Inventor： Anne Plochowietz , Anand Ramakrishnan , Warren Jackson , Lara S. Crawford , Bradley Rupp , Sergey Butylkov , Jeng Ping Lu , Eugene M. Chow
Abstract: Control loop latency can be accounted for in predicting positions of micro-objects being moved by using a hybrid model that includes both at least one physics-based model and machine-learning models. The models are combined using gradient boosting, with a model created during at least one of the stages being fitted based on residuals calculated during a previous stage based on comparison to training data. The loss function for each stage is selected based on the model being created. The hybrid model is evaluated with data extrapolated and interpolated from the training data to prevent overfitting and ensure the hybrid model has sufficient predictive ability. By including both physics-based and machine-learning models, the hybrid model can account for both deterministic and stochastic components involved in the movement of the micro-objects, thus increasing the accuracy and throughput of the micro-assembly.
-
公开(公告)号：US20210162727A1
公开(公告)日：2021-06-03
申请号：US17171286
申请日：2021-02-09
Applicant: Palo Alto Research Center Incorporated
Inventor： JengPing Lu , Eugene M. Chow , Sourobh Raychaudhuri
Abstract: Sheets of a thin film material are attached to a carrier wafer. The carrier wafer and the attached sheets of thin film material are separated to form chiplet carriers. Each chiplet carrier includes a portion of the sheets of thin film material attached to a portion of the carrier wafer. The chiplet carriers are placed on an assembly surface in a random pattern. The chiplet carriers are arranged from the random pattern to a predetermined pattern, and the portions of the thin film material are transferred from the chiplet carriers to a target substrate.
-
公开(公告)号：US10933636B2
公开(公告)日：2021-03-02
申请号：US14099873
申请日：2013-12-06
Applicant: Palo Alto Research Center Incorporated
Inventor： Armin R. Volkel , Eugene M. Chow
Abstract: Disclosed herein is a material ejector (e.g., print head) geometry having alignment of material inlet channels in-line with microchannels, symmetrically disposed in a propellant flow, to obtain smooth, well-controlled, trajectories in a ballistic aerosol ejection implementation. Propellant (e.g., pressurized air) is supplied from above and below (or side-by-side) a microchannel array plane. Obviating sharp (e.g., 90 degree) corners permits propellant to flow smoothly from macroscopic source into the microchannels.
-
-
-
-
-
-
-
-
-
Search Results
100
records
(took 0.029 seconds)
