Abstract:
A self-destructing device includes a stressed substrate with a heater thermally coupled to the stressed substrate. The device includes a power source and trigger circuitry comprising a sensor and a switch. The sensor generates a trigger signal when exposed to a trigger stimulus. The switch couples the power source to the heater in response to the trigger signal When energized by the power source, the heater generates heat sufficient to initiate self-destruction of the stressed substrate.
Abstract:
Systems and methods for operating a tag system. The methods comprising: wirelessly communicating, from a tag, a first signal at a first frequency spectrum that allows a tag reader to detect the first signal, when the tag is not proximate to an antenna modulation marker or when the antenna modulation marker has a first orientation relative to the tag; and performing operations by the tag to wirelessly communicate a second signal at a second frequency spectrum that does not allow the tag reader to detect the first signal, when the tag is proximate to the antenna modulation marker or when the antenna modulation marker has a second different orientation relative to the tag.
Abstract:
A device includes a backplane having multiple output terminals arranged in an array on an output surface of the backplane. The device further includes an active matrix array comprising thin film solid state optical switches coupled respectively between an input terminal of the backplane and the output terminals. Storage capacitors may be coupled respectively to the output terminals. A pixelated light source provides pixelated light that controls the optical switches.
Abstract:
Disclosed herein are implementations of a particles-transferring system, particle transferring unit, and method of transferring particles in a pattern. In one implementation, a particles-transferring system includes a first substrate including a first surface to support particles in a pattern, particle transferring unit including an outer surface to be offset from the first surface by a first gap, and second substrate including a second surface to be offset from the outer surface by a second gap. The particle transferring unit removes the particles from the first surface in response to the particles being within the first gap, secures the particles in the pattern to the outer surface, and transports the particles in the pattern. The second substrate removes the particles in the pattern from the particle transferring unit in response to the particles being within the second gap. The particles are to be secured in the pattern to the second surface.
Abstract:
A method of forming an electronic field emission rectifier involves depositing a first metal layer, a dielectric, and a second metal layer on a substrate in that order. The dielectric layer and the second metal layer are patterned. Patterning the dielectric and second metal layers involves depositing a nanostructuring layer on the second metal layer. The nanostructuring layer self-assembles into removable regions embedded within a matrix. When the removable regions are removed, a pattern is formed in the matrix.
Abstract:
An apparatus includes a sensor array with a plurality of active pixels. Each active pixel in the sensor array includes: a three transistor (3T) sensor with a source follower transistor, and a detection diode coupled in series to a parasitic capacitor at a sensing junction. A gate of the source follower transistor amplifier is coupled to the sensing junction. The apparatus includes an insulator layer over the sensor array. The insulator layer provides a variable capacitance to the sensing junctions of underlying active pixels in response to portions of an object being proximate to the insulator layer. The variable capacitance is used to detect an image of the object.
Abstract:
An article includes a support substrate bonded to heterostructure epitaxial layers that include one or more electronic devices. The support substrate has a bonding surface and the heterostructure epitaxial layers have a surface with the epitaxial growth direction of the heterostructure epitaxial layers towards the surface. The surface of the heterostructure epitaxial layers is bonded at the bonding surface of the support substrate by ion exchange between the surface of the heterostructure epitaxial layers and the bonding surface of the support substrate.
Abstract:
An electronic test plate includes a test plate comprising plurality of wells, each well configured to contain a substance to be analyzed. Sensors are arranged to sense characteristics of the substance and to generate sensor signals based on the sensed characteristics over time. The sensors are arranged so that multiple sensors are associated with each well. At least one sensor of the multiple sensors senses a characteristic of the substance that is different from a characteristic sensed by another sensor of the multiple sensors. Sensor select circuitry is arranged on a backplane disposed along the test plate. The sensor select circuitry is coupled to the sensors and enable the sensor signals of selected sensors to be accessed at a data output of the backplane.
Abstract:
A thin film optical switch includes a layer of photosensitive material that extends laterally with first and second electrodes are spaced apart laterally from one another along the layer of photo sensitive material. The first and second electrodes contact the photo sensitive material at first and second junctions, respectively. At least one field plate is electrically insulated from the photo sensitive material and extends laterally along the layer of photo sensitive material over the first or the second junction. The field plate is electrically connected to the first electrode or the second electrode.
Abstract:
An impedance readout circuit receives an input signal from a pixel, or an array of pixels. The circuit includes an amplifier to amplify the input signal and detects a DC component of the input signal. The circuit establishes an AC sampling voltage at the output of the amplifier enabling a filter of the circuit to determine an AC current component of the amplifier output. The AC current component is inversely proportional to the output impedance of the pixel.