公开(公告)号：US20090156010A1

公开(公告)日：2009-06-18

申请号：US11959034

申请日：2007-12-18

申请人： Xiang Hu ,  Hai Cong ,  Pradeep Yelehanka ,  Mei Sheng Zhou

发明人： Xiang Hu ,  Hai Cong ,  Pradeep Yelehanka ,  Mei Sheng Zhou

IPC分类号： H01L21/302

CPC分类号： H01J37/32963 ,  H01J37/32935

摘要： A method for etching a thin film and fabricating a semiconductor device includes etching the thin film on a substrate, while monitoring the removal of an endpoint detection layer remotely located from the substrate, such that precise control of the thin film etching is provided by monitoring the removal of the endpoint detection layer. The endpoint detection layer is formed on a surface of an etching apparatus that is exposed to the same etching conditions as the thin film to be etched. The etching of the thin film is stopped when a predetermined amount of the endpoint detection layer has removed from the surface of the etching apparatus.

摘要翻译： 一种用于蚀刻薄膜并制造半导体器件的方法包括：在监测从基板远离的端点检测层的移除的同时，对衬底上的薄膜进行蚀刻，从而通过监测薄膜蚀刻来精确控制薄膜蚀刻 移除端点检测层。 端点检测层形成在暴露于与要蚀刻的薄膜相同的蚀刻条件的蚀刻装置的表面上。 当从蚀刻装置的表面去除预定量的端点检测层时，停止对薄膜的蚀刻。

公开(公告)号：US07879732B2

公开(公告)日：2011-02-01

申请号：US11959034

申请日：2007-12-18

申请人： Xiang Hu ,  Hai Cong ,  Pradeep Yelehanka ,  Mei Sheng Zhou

发明人： Xiang Hu ,  Hai Cong ,  Pradeep Yelehanka ,  Mei Sheng Zhou

IPC分类号： H01L21/302 ,  G01R31/00 ,  B44C1/22

CPC分类号： H01J37/32963 ,  H01J37/32935

摘要： A method for etching a thin film and fabricating a semiconductor device includes etching the thin film on a substrate, while monitoring the removal of an endpoint detection layer remotely located from the substrate, such that precise control of the thin film etching is provided by monitoring the removal of the endpoint detection layer. The endpoint detection layer is formed on a surface of an etching apparatus that is exposed to the same etching conditions as the thin film to be etched. The etching of the thin film is stopped when a predetermined amount of the endpoint detection layer has removed from the surface of the etching apparatus.

摘要翻译： 一种用于蚀刻薄膜并制造半导体器件的方法包括：在监测从基板远离的端点检测层的移除的同时，对衬底上的薄膜进行蚀刻，从而通过监测薄膜蚀刻来精确控制薄膜蚀刻 移除端点检测层。 端点检测层形成在暴露于与要蚀刻的薄膜相同的蚀刻条件的蚀刻装置的表面上。 当从蚀刻装置的表面去除预定量的端点检测层时，停止对薄膜的蚀刻。

公开(公告)号：US08546873B2

公开(公告)日：2013-10-01

申请号：US13241215

申请日：2011-09-23

申请人： Jinping Liu ,  Hai Cong ,  Binbin Zhou ,  Alex Kh See ,  Mei Sheng Zhou ,  Liang Choo Hsia

发明人： Jinping Liu ,  Hai Cong ,  Binbin Zhou ,  Alex Kh See ,  Mei Sheng Zhou ,  Liang Choo Hsia

IPC分类号： H01L29/66

CPC分类号： H01L21/823468 ,  H01L21/823412 ,  H01L21/823418 ,  H01L21/823807 ,  H01L21/823814 ,  H01L21/823864 ,  H01L29/165 ,  H01L29/66636 ,  H01L29/7848

摘要： A method of forming an integrated circuit structure comprising the steps of forming a first and second device region on a surface of a wafer, forming a spacer of a first width on a sidewall of a first gate stack in the first device region, forming a spacer of a second width on a sidewall of a second gate stack in the second device region, with the first width being different from the second width.

摘要翻译： 一种形成集成电路结构的方法，包括以下步骤：在晶片的表面上形成第一和第二器件区域，在第一器件区域中的第一栅极堆叠的侧壁上形成第一宽度的间隔物，形成间隔物 在第二装置区域中的第二栅极堆叠的侧壁上具有第二宽度，第一宽度不同于第二宽度。

公开(公告)号：US08058123B2

公开(公告)日：2011-11-15

申请号：US11946843

申请日：2007-11-29

申请人： Jinping Liu ,  Hai Cong ,  Binbin Zhou ,  Alex K H See ,  Mei Sheng Zhou ,  Liang Choo Hsia

发明人： Jinping Liu ,  Hai Cong ,  Binbin Zhou ,  Alex K H See ,  Mei Sheng Zhou ,  Liang Choo Hsia

IPC分类号： H01L21/8238

CPC分类号： H01L21/823468 ,  H01L21/823412 ,  H01L21/823418 ,  H01L21/823807 ,  H01L21/823814 ,  H01L21/823864 ,  H01L29/165 ,  H01L29/66636 ,  H01L29/7848

摘要： A method of forming an integrated circuit structure comprising the steps of forming a first and second device region on a surface of a wafer, forming a spacer of a first width on a sidewall of a first gate stack in the first device region, forming a spacer of a second width on a sidewall of a second gate stack in the second device region, with the first width being different from the second width.

摘要翻译： 一种形成集成电路结构的方法，包括以下步骤：在晶片的表面上形成第一和第二器件区域，在第一器件区域中的第一栅极堆叠的侧壁上形成第一宽度的间隔物，形成间隔物 在第二装置区域中的第二栅极堆叠的侧壁上具有第二宽度，第一宽度不同于第二宽度。

公开(公告)号：US07745320B2

公开(公告)日：2010-06-29

申请号：US12124177

申请日：2008-05-21

申请人： Jeff Jianhui Ye ,  Huang Liu ,  Alex K H See ,  Wei Lu ,  Hai Cong ,  Hui Peng Koh ,  Mei Sheng Zhou ,  Liang Choo Hsia

发明人： Jeff Jianhui Ye ,  Huang Liu ,  Alex K H See ,  Wei Lu ,  Hai Cong ,  Hui Peng Koh ,  Mei Sheng Zhou ,  Liang Choo Hsia

IPC分类号： H01L29/00 ,  H01L21/311

CPC分类号： H01L29/665 ,  H01L21/31116 ,  H01L29/6653 ,  H01L29/78

摘要： A method for forming silicide contacts in integrated circuits (ICs) is described. A spacer pull-back etch is performed during the salicidation process to reduce the stress between the spacer and source/drain silicide contact at the spacer undercut. This prevents the propagation of surface defects into the substrate, thereby minimizing the occurrence of silicide pipe defects. The spacer pull-back etch can be performed after a first annealing step to form the silicide contacts.

摘要翻译： 描述了在集成电路（IC）中形成硅化物触点的方法。 在水解过程期间进行间隔物拉回蚀刻以减少间隔物与间隔物底切下的源/漏硅化物接触之间的应力。 这样可以防止表面缺陷进入衬底，从而使硅化物管缺陷的发生最小化。 间隔物拉回蚀刻可以在第一退火步骤之后进行以形成硅化物接触。

公开(公告)号：US08394724B2

公开(公告)日：2013-03-12

申请号：US11843629

申请日：2007-08-22

申请人： Hai Cong ,  Wei Loong Loh ,  Krishan Gopal ,  Xin Zhang ,  Mei Sheng Zhou ,  Pradeep Ramachandramurthy Yelehanka

发明人： Hai Cong ,  Wei Loong Loh ,  Krishan Gopal ,  Xin Zhang ,  Mei Sheng Zhou ,  Pradeep Ramachandramurthy Yelehanka

IPC分类号： H01L21/312

CPC分类号： H01L21/32137 ,  H01L21/32139

摘要： A method for forming device features with reduced line end shortening (LES) includes trimming the device feature to achieve the desired sub-ground rule critical dimension during the etch to form the device feature.

摘要翻译： 用于形成具有减少的线端缩短（LES）的器件特征的方法包括修整器件特征以在蚀刻期间实现期望的子接地规则临界尺寸以形成器件特征。

公开(公告)号：US07960283B2

公开(公告)日：2011-06-14

申请号：US12825325

申请日：2010-06-28

申请人： Jeff Jianhui Ye ,  Huang Liu ,  Alex K H See ,  Wei Lu ,  Hai Cong ,  Hui Peng Koh ,  Mei Sheng Zhou ,  Liang Choo Hsia

发明人： Jeff Jianhui Ye ,  Huang Liu ,  Alex K H See ,  Wei Lu ,  Hai Cong ,  Hui Peng Koh ,  Mei Sheng Zhou ,  Liang Choo Hsia

IPC分类号： H01L21/28 ,  H01L21/311

CPC分类号： H01L29/665 ,  H01L21/31116 ,  H01L29/6653 ,  H01L29/78

摘要： A method for forming silicide contacts in integrated circuits (ICs) is described. A spacer pull-back etch is performed during the salicidation process to reduce the stress between the spacer and source/drain silicide contact at the spacer undercut. This prevents the propagation of surface defects into the substrate, thereby minimizing the occurrence of silicide pipe defects. The spacer pull-back etch can be performed after a first annealing step to form the silicide contacts.

摘要翻译： 描述了在集成电路（IC）中形成硅化物触点的方法。 在水解过程期间进行间隔物拉回蚀刻以减少间隔物与间隔物底切下的源/漏硅化物接触之间的应力。 这样可以防止表面缺陷进入衬底，从而使硅化物管缺陷的发生最小化。 间隔物拉回蚀刻可以在第一退火步骤之后进行以形成硅化物接触。

公开(公告)号：US20130187202A1

公开(公告)日：2013-07-25

申请号：US13353684

申请日：2012-01-19

申请人： Xuesong Rao ,  Chim Seng Seet ,  Hai Cong ,  Zheng Zou ,  Alex See ,  Yun Ling Tan ,  Wen Zhan Zhou ,  Lup San Leong

发明人： Xuesong Rao ,  Chim Seng Seet ,  Hai Cong ,  Zheng Zou ,  Alex See ,  Yun Ling Tan ,  Wen Zhan Zhou ,  Lup San Leong

IPC分类号： H01L29/78 ,  H01L21/28

CPC分类号： H01L29/6653 ,  H01L29/6656

摘要： Interlayer dielectric gap fill processes are enhanced by forming gate spacers with a tapered profile. Embodiments include forming a gate electrode on a substrate, depositing a spacer material over the gate electrode and substrate, the spacer layer having a first surface nearest the gate electrode and substrate, a second surface furthest from the gate electrode and substrate, and a continuously increasing etch rate from the first surface to the second surface, and etching the spacer layer to form a spacer on each side of the gate electrode. Embodiments further include forming the spacer layer by depositing a spacer material and continuously decreasing the density of the spacer material during deposition or depositing a carbon-containing spacer material and causing a gradient of carbon content in the spacer layer.

摘要翻译： 通过形成具有锥形轮廓的栅极间隔物来增强层间电介质间隙填充工艺。 实施例包括在衬底上形成栅电极，在栅电极和衬底上沉积间隔物材料，间隔层具有最靠近栅电极和衬底的第一表面，离栅电极和衬底最远的第二表面，以及连续增加 从第一表面到第二表面的蚀刻速率，并且蚀刻间隔层以在栅电极的每一侧上形成间隔物。 实施例还包括通过沉积间隔物材料形成间隔层，并在沉积期间连续降低间隔物材料的密度或沉积含碳间隔物材料并引起间隔层中的碳含量梯度。

公开(公告)号：US20130181259A1

公开(公告)日：2013-07-18

申请号：US13348766

申请日：2012-01-12

申请人： Xuesong Rao ,  Chim Seng Seet ,  Hai Cong ,  Zheng Zou ,  Alex See ,  Yun Ling Tan ,  Wen Zhan Zhou ,  Lup San Leong ,  Huang Liu

发明人： Xuesong Rao ,  Chim Seng Seet ,  Hai Cong ,  Zheng Zou ,  Alex See ,  Yun Ling Tan ,  Wen Zhan Zhou ,  Lup San Leong ,  Huang Liu

IPC分类号： H01L29/78 ,  H01L21/28

CPC分类号： H01L29/6656 ,  H01L29/78

摘要： Interlayer dielectric gap fill processes are enhanced by forming gate spacers with a step-like or tapered profile. Embodiments include forming a gate electrode on a substrate, depositing a spacer material over the gate electrode, etching the spacer material to form a first spacer on each side of the gate electrode, and pulling back the first spacers to form second spacers which have a step-like profile. Embodiments further include depositing a second spacer material over the gate electrode and the second spacers, and etching the second spacer material to form a third spacer on each second spacer, the second and third spacers forming an outwardly tapered composite spacer.

摘要翻译： 通过形成具有阶梯状或锥形轮廓的栅极间隔物来增强层间电介质间隙填充工艺。 实施例包括在衬底上形成栅电极，在栅电极上沉积间隔物材料，蚀刻间隔物材料以在栅电极的每一侧上形成第一间隔物，并拉回第一间隔物以形成第二间隔物， 像个人资料 实施例还包括在栅极电极和第二间隔物上沉积第二间隔物材料，并蚀刻第二间隔物材料以在每个第二间隔物上形成第三间隔物，第二和第三间隔物形成向外锥形的复合间隔物。

公开(公告)号：US20050170625A1

公开(公告)日：2005-08-04

申请号：US10767292

申请日：2004-01-29

申请人： Hai Cong ,  Yong Siew ,  Liang Hsia

发明人： Hai Cong ,  Yong Siew ,  Liang Hsia

IPC分类号： H01L21/44 ,  H01L21/768

CPC分类号： H01L21/76808

摘要： A method of forming trench openings in a dual damascene trench and via etch process by using a two component hard mask layer, termed a bi-layer, over different intermetal dielectrics, IMD, to solve dual damascene patterning problems, such as, fencing and sub-trench formation. Via first patterning in dual damascene processing is one of the major integration schemes for copper backend of line (BEOL) integration. Via first dual damascene scheme usually uses a hard mask layer deposited on top of an inter-metal dielectric (IMD) film stack. The dual damascene trench etch requires uniform trench depth across wafer after etch. In addition, via top corner profiles need to be well maintained without any fencing or faceting. The present method solves these problems by using a two component hard mask layer, termed a bi-layer, deposited directly on top of an inter-metal dielectric (IMD) film stack.

摘要翻译： 一种在双镶嵌沟槽和通孔蚀刻工艺中形成沟槽开口的方法，其通过使用称为双层的双组分硬掩模层在不同的金属间电介质IMD之间，以解决双镶嵌图案化问题，例如栅栏和子 螺旋形成。 通过在双镶嵌处理​​中的首次图案化是铜后端（BEOL）集成的主要集成方案之一。 通过第一双镶嵌方案通常使用沉积在金属间电介质（IMD）膜堆叠顶部上的硬掩模层。 双镶嵌沟槽蚀刻需要在蚀刻后跨晶片的均匀沟槽深度。 此外，通过顶角型材需要维护良好，没有任何围栏或小面。 本方法通过使用直接沉积在金属间电介质（IMD）膜堆叠的顶部上的双组分硬掩模层来解决这些问题。