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    METHOD FOR METALLIZING CERAMIC SURFACE AND METHOD FOR CONNECTING CERAMIC WITH ALUMINUM
    1.
    发明申请
    METHOD FOR METALLIZING CERAMIC SURFACE AND METHOD FOR CONNECTING CERAMIC WITH ALUMINUM 有权

    公开(公告)号：US20120121896A1

    公开(公告)日：2012-05-17

    申请号：US13318332

    申请日：2010-04-30

    申请人： Xiaoshan Ning ,  Bo Wang ,  Sha Li ,  Guocai Li

    发明人： Xiaoshan Ning ,  Bo Wang ,  Sha Li ,  Guocai Li

    IPC分类号： B32B3/00 ,  F27B14/06 ,  B23K1/20 ,  B32B15/04 ,  B05D1/18

    CPC分类号： C04B37/006 ,  C04B37/026 ,  C04B41/009 ,  C04B41/5155 ,  C04B41/88 ,  C04B2235/656 ,  C04B2235/658 ,  C04B2235/6581 ,  C04B2235/96 ,  C04B2237/121 ,  C04B2237/126 ,  C04B2237/128 ,  C04B2237/343 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/40 ,  C04B2237/402 ,  C04B2237/592 ,  C04B2237/708 ,  C23C2/12 ,  Y10T428/265 ,  Y10T428/31678 ,  C04B35/00 ,  C04B41/4517 ,  C04B41/4523 ,  C04B35/565 ,  C04B35/581 ,  C04B35/584

    摘要： A process for metalizing a ceramic surface or attaching a ceramic to a metal is provided. The process may comprise: immersing the ceramic into an aluminum or aluminum alloy melt, making the ceramic move or stay still relative to the melt to adhere the melt to the ceramic; and then removing the ceramic from the melt to unaffectedly cool the film adhered thereto. The process can attach an aluminum or aluminum alloy thin film having a thickness of several to tens of micrometers on a ceramic surface. The thin film is formed by solidification, and does not have microscopic faults such as oxide film inclusions or pores, therefore having proper physical of mechanical properties of aluminum. Ceramics or a ceramic and a metal can be brazed via the surface metalizing film, the bonding strength of their interface can over the strength of aluminum itself.This invention discloses a process for metalizing the surface of a ceramic and a process for attaching a ceramic to a metal. A process for attaching an aluminum or aluminum alloy thin film to a ceramic surface comprises the steps of: immersing a ceramic surface to be metalized into a aluminum or aluminum alloy melt, and making the ceramic move or stay still relative to the melt to adhere the melt of the aluminum or aluminum alloy to the metalizing surface of the ceramic; and then removing the metalizing surface of the ceramic from the melt to unaffectedly cool the aluminum or aluminum alloy liquid film adhered thereto to obtain a ceramic having the aluminum or aluminum alloy thin film attached to the surface. The process to attaching aluminum or aluminum alloy thin film on the surface of a ceramic of the present invention can attach an aluminum or aluminum alloy thin film having a thickness of several micrometers to tens of micrometers on the surface of a ceramic. The thin film is formed by the solidification of the aluminum of aluminum alloy liquid film attached on the surface of a ceramic, and it does not have the microscopic faults such as oxide film inclusions or pores, therefore having the proper physical of mechanical properties of aluminum. Ceramics or a ceramic and a metal can be brazed via the surface metalizing film, the bonding strength of their interface can over the strength of aluminum itself.