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公开(公告)号:US12099790B1
公开(公告)日:2024-09-24
申请号:US17204431
申请日:2021-03-17
Applicant: Xilinx, Inc.
Inventor: Raghukul B. Dikshit , Tauheed Ashraf , Michael Chyziak
IPC: G06F30/331 , H04J3/06
CPC classification number: G06F30/331 , H04J3/06
Abstract: An emulation system can include a first integrated circuit (IC) including first circuitry and a first transceiver. The first circuitry is configured to emulate a first partition of a circuit design. The first circuitry is clocked by an emulation clock and the first transceiver is clocked by a transceiver clock asynchronous with the emulation clock. The transceiver clock has a higher frequency than the emulation clock. The emulation system can include a second IC configured to emulate a second partition of the circuit design. The second IC includes a second transceiver. The first transceiver is configured to generate multiplexed emulation data by multiplexing a plurality of nets that cross from the first partition to the second partition of the circuit design. The first transceiver is configured to send the multiplexed emulation data over a serial communication channel to the second transceiver. The multiplexed emulation data includes a clock signal of the first transceiver embedded therein.
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公开(公告)号:US11748289B2
公开(公告)日:2023-09-05
申请号:US17455125
申请日:2021-11-16
Applicant: Xilinx, Inc.
Inventor: Michael Chyziak , Raghukul B. Dikshit
CPC classification number: G06F13/4027 , G06F13/4282
Abstract: A system includes a bridge circuit configured for low latency communication among integrated circuits (ICs). The bridge circuit includes a plurality of transceiver circuits. Each transceiver circuit is coupled to a corresponding parallel channel in the IC. Each transceiver circuit is configured to send and receive data over the corresponding parallel channel. Each transceiver circuit includes a transmit channel configured to packetized data received from the corresponding parallel channel for transmission over a serial link to a second IC. Each transceiver circuit includes a receive channel configured to depacketize data received from the serial link from the second IC. The serial link is asynchronous to each of parallel channel coupled to the first bridge circuit.
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公开(公告)号:US20230153260A1
公开(公告)日:2023-05-18
申请号:US17455125
申请日:2021-11-16
Applicant: Xilinx, Inc.
Inventor: Michael Chyziak , Raghukul B. Dikshit
CPC classification number: G06F13/4027 , G06F13/4282
Abstract: A system includes a bridge circuit configured for low latency communication among integrated circuits (ICs). The bridge circuit includes a plurality of transceiver circuits. Each transceiver circuit is coupled to a corresponding parallel channel in the IC. Each transceiver circuit is configured to send and receive data over the corresponding parallel channel. Each transceiver circuit includes a transmit channel configured to packetized data received from the corresponding parallel channel for transmission over a serial link to a second IC. Each transceiver circuit includes a receive channel configured to depacketize data received from the serial link from the second IC. The serial link is asynchronous to each of parallel channel coupled to the first bridge circuit.
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