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    Method of fabrication of hermetically sealed glass package
    1.
    发明申请
    Method of fabrication of hermetically sealed glass package 审中-公开
    密封玻璃包装的制造方法

    公开(公告)号：US20050199599A1

    公开(公告)日：2005-09-15

    申请号：US10796752

    申请日：2004-03-09

    申请人： Xinghua Li ,  Sujanto Widjaja

    发明人： Xinghua Li ,  Sujanto Widjaja

    IPC分类号： B23K26/00 ,  B23K26/20

    CPC分类号： B23K26/0006 ,  B23K2103/54 ,  H01L51/5246

    摘要： A method of sealing an OLED structure includes providing a top glass substrate and a bottom glass substrate, and at least one layer of organic material between the glass substrates. The illustrative method also includes focusing a relatively high power, a relatively short-duration laser radiation onto a region of one glass substrate, thereby heating a focal volume through multiphoton absorption. The intense heat causes the interface of the glass to swell and bond onto the other glass substrate. An apparatus for sealing the structure and a sealed package are also disclosed.

    摘要翻译： 密封OLED结构的方法包括提供顶部玻璃基板和底部玻璃基板，以及玻璃基板之间的至少一层有机材料。 该说明性方法还包括将相对高功率的相对较短的激光辐射聚焦到一个玻璃基底的区域上，从而通过多光子吸收加热聚焦体积。 强烈的热会导致玻璃的界面膨胀并粘结到另一个玻璃基底上。 还公开了一种用于密封结构和密封包装的设备。

    BEZEL PACKAGING FOR SEALED GLASS ASSEMBLIES AND A GLASS ASSEMBLY THEREFOR
    2.
    发明申请
    BEZEL PACKAGING FOR SEALED GLASS ASSEMBLIES AND A GLASS ASSEMBLY THEREFOR 有权
    密封玻璃组件的贝类包装及其玻璃组件

    公开(公告)号：US20110019351A1

    公开(公告)日：2011-01-27

    申请号：US12922987

    申请日：2009-03-30

    申请人： John Frederick Bayne ,  Yabei Gu ,  Glenn Vertner Morgan ,  Butchi Reddy Vaddi ,  Jamie Todd Westbrook ,  Sujanto Widjaja

    发明人： John Frederick Bayne ,  Yabei Gu ,  Glenn Vertner Morgan ,  Butchi Reddy Vaddi ,  Jamie Todd Westbrook ,  Sujanto Widjaja

    IPC分类号： H05K7/00 ,  H01J5/02

    CPC分类号： G02F1/133308 ,  F21Y2105/00 ,  F21Y2115/15 ,  H01L51/5237

    摘要： Methods and assemblies related to frame or bezel packaging of a sealed glass assembly, such as a fit-sealed OLED device, such as an OLED display panel. The frame or bezel packaging may have one or more of (a) rounded or chamfered corners, (a) a cover, (b) a reinforced lead edge, (c) openings or cutouts in the back panel to conserve material and lighten the bezel, and (d) a shock absorbent intermediate layer of low modulus of elasticity material applied between the sealed glass assembly and the back and/or sides of the frame or bezel. The frame or bezel design may include a gap between the sealed glass assembly and the back panel of the bezel. The gap may be filled at least in part with low modulus of elasticity backing material. The glass package may have one or more of (a) rounded or chamfered corners, (b) rounded or chamfered edges, (c) a low modulus of elasticity material applied around its periphery or portions of its periphery, such as on the corners only, (d) a shortened lead end, and (e) a thickened lead end.

    摘要翻译： 与密封玻璃组件的框架或边框包装相关的方法和组件，例如适合密封的OLED装置，例如OLED显示面板。 框架或边框包装可以具有（a）圆形或倒角的一个或多个，（a）盖，（b）加强的引线边缘，（c）后面板中的开口或切口以节省材料并减轻边框 ，和（d）在密封的玻璃组件和框架或表圈的背面和/或侧面之间施加低弹性材料材料的吸震中间层。 框架或边框设计可以包括密封的玻璃组件和边框的后面板之间的间隙。 间隙可以至少部分地用低弹性背衬材料填充。 玻璃包装可以具有一个或多个（a）圆形或倒角，（b）圆形或倒角边缘，（c）围绕其周边或其周边部分施加的低弹性材料，例如仅在拐角上 ，（d）缩短的引线端，（e）增厚的引线端。

    Bezel packaging of frit-sealed OLED devices
    3.
    发明授权
    Bezel packaging of frit-sealed OLED devices 有权
    玻璃料密封OLED器件的边框包装

    公开(公告)号：US07786559B2

    公开(公告)日：2010-08-31

    申请号：US11594487

    申请日：2006-11-08

    申请人： John F Bayne ,  Jamie T Westbrook ,  Sujanto Widjaja

    发明人： John F Bayne ,  Jamie T Westbrook ,  Sujanto Widjaja

    IPC分类号： H01L21/00

    CPC分类号： B65D81/05 ,  C03C27/048 ,  H01L51/5237

    摘要： Methods and assemblies relate to bezel packaging of a sealed glass assembly, such as a frit-sealed OLED device. The bezel packaging includes a shock absorbent intermediate layer of low modulus of elasticity material applied between the sealed glass assembly and the bezel. A bonding agent, which may include the low modulus of elasticity material and/or a separate bonding material, affixes the sealed glass assembly to the bezel. Bezel modifications may be made to stabilize the bezel. Exemplary bezel modifications include reinforced bezel side walls and supporting straps attached between bezel walls. The bezel design may include a gap between the edges of the sealed glass assembly and the bezel walls, so as to avoid direct contact therewith. The gap may be filled at least in part with low modulus of elasticity organic adhesive to provide additional shock absorbency. The low modulus of elasticity material may include foam, ceramic fiber cloth and/or a low modulus of elasticity polymeric organic coating.

    摘要翻译： 方法和组件涉及密封玻璃组件的边框包装，例如玻璃料密封的OLED装置。 表圈包装包括施加在密封玻璃组件和表圈之间的低弹性材料材料的减震中间层。 可以包括低弹性模量材料和/或单独的粘合材料的粘合剂将密封的玻璃组件固定在边框上。 可以进行挡板修改以使挡板稳定。 示例性的边框修改包括加强的边框侧壁和附接在边框壁之间的支撑带。 边框设计可以包括密封玻璃组件的边缘与边框壁之间的间隙，以避免与其直接接触。 间隙可以至少部分地由低弹性有机粘合剂填充以提供额外的冲击吸收性。 低弹性材料材料可以包括泡沫，陶瓷纤维布和/或低弹性聚合物有机涂层。

    Seal for light emitting display device, method, and apparatus
    8.
    发明授权
    Seal for light emitting display device, method, and apparatus 有权
    用于发光显示装置，方法和装置的密封件

    公开(公告)号：US08134293B2

    公开(公告)日：2012-03-13

    申请号：US12857984

    申请日：2010-08-17

    申请人： Stephan Lvovich Logunov ,  Kamjula Pattabhirami Reddy ,  Sujanto Widjaja

    发明人： Stephan Lvovich Logunov ,  Kamjula Pattabhirami Reddy ,  Sujanto Widjaja

    IPC分类号： H01L51/50 ,  H01L51/52 ,  H01L51/56

    CPC分类号： C03C3/066 ,  B32B17/06 ,  C03C3/091 ,  C03C3/093 ,  C03C3/21 ,  C03C8/04 ,  C03C8/08 ,  C03C8/24 ,  C03C27/06 ,  C03C27/10 ,  H01L51/5246

    摘要： A glass package is disclosed comprising a first substrate and a second substrate, where the substrates are attached in at least two locations, at least one attachment comprising a frit, and at least one attachment comprising a polymeric adhesive and wherein the frit comprises a glass portion comprising: a base component comprising and at least one absorbing component. Also disclosed is a method of sealing a light emitting display device comprising providing a light emitting layer, a first substrate and a second substrate, where a frit is deposited between the substrates and a polymeric adhesive is deposited either between the substrates or around the edge of the device, and where the frit is sealed with a radiation source and the polymeric adhesive is cured.

    摘要翻译： 公开了一种玻璃包装，其包括第一基底和第二基底，其中基底在至少两个位置附着，至少一个附着物包含玻璃料，至少一个附着物包含聚合物粘合剂，其中玻璃料包括玻璃部分 包括：包含至少一个吸收组分的基础组分。 还公开了一种密封发光显示装置的方法，包括提供发光层，第一基板和第二基板，其中玻璃料沉积在基板之间，并且聚合物粘合剂沉积在基板之间或周围的 该装置以及用辐射源密封玻璃料并且聚合物粘合剂固化的位置。

    Systems and methods for measuring the specific modulus of cellular ceramic bodies
    9.
    发明授权
    Systems and methods for measuring the specific modulus of cellular ceramic bodies 有权
    用于测量细胞陶瓷体的比模量的系统和方法

    公开(公告)号：US08074518B2

    公开(公告)日：2011-12-13

    申请号：US12197429

    申请日：2008-08-25

    申请人： John David Helfinstine ,  Robert A McIntosh ,  Lisa M Noni ,  Zhiqiang Shi ,  Sujanto Widjaja ,  David John Worthey

    发明人： John David Helfinstine ,  Robert A McIntosh ,  Lisa M Noni ,  Zhiqiang Shi ,  Sujanto Widjaja ,  David John Worthey

    IPC分类号： G01N29/07

    CPC分类号： G01H5/00

    摘要： Systems (50) and methods for measuring and displaying a visual and/or graphical representation of the specific modulus (E/ρ) of a cellular ceramic body (10), such as those used to form particulate filters, are disclosed. The ultrasonic measurement system employs an ultrasonic transmitter (52T) and an ultrasonic receiver (52R) adjacent to, but spaced apart from respective ends (16, 18) of the ceramic body. Multiple ultrasonic waves (80) are sent through corresponding multiple longitudinal portions (12P) of the honeycomb structure (12), where adjacent longitudinal portions overlap. Time of flight (TOF) measurements (TOF1, TOF2), along with other parameters describing the ceramic body, allow for the measurement of the sonic speed (cmat) of the ultrasonic waves that pass through the ceramic body as well as the attenuation (IR). The specific modulus is then calculated from the square of the sonic speed (C2mat). The high resolution of the ultrasonic measurements allows for improved evaluation of the manufacturing process.

    摘要翻译： 公开了用于测量和显示细胞陶瓷体（10）的比模量（E /＆rgr）的视觉和/或图形表示的系统（50）和方法，例如用于形成微粒过滤器的那些。 超声波测量系统采用与陶瓷体的相应端部（16,18）相邻但间隔开的超声波发射器（52T）和超声波接收器（52R）。 多个超声波（80）通过蜂窝结构（12）的相应的多个纵向部分（12P）发送，其中相邻的纵向部分重叠。 飞行时间（TOF1，TOF2）以及描述陶瓷体的其他参数允许测量通过陶瓷体的超声波的声速（cmat）以及衰减（IR ）。 然后根据声速（C2mat）的平方来计算比模量。 超声波测量的高分辨率允许改进制造过程的评估。