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    HONEYCOMB FILTER
    4.
    发明公开
    HONEYCOMB FILTER 审中-公开

    公开(公告)号：US20230356131A1

    公开(公告)日：2023-11-09

    申请号：US18068741

    申请日：2022-12-20

    申请人： NGK Insulators, Ltd.

    发明人： Yudai KURIMOTO ,  Fumihiko YOSHIOKA

    IPC分类号： B01D46/24 ,  C04B38/00

    CPC分类号： B01D46/2429 ,  B01D46/24491 ,  B01D46/24492 ,  B01D46/2474 ,  B01D46/2482 ,  B01D46/2484 ,  B01D46/249 ,  B01D46/2498 ,  C04B38/0009 ,  C04B38/0012 ,  B01D2279/30

    摘要： A honeycomb filter comprising a pillar-shaped honeycomb structure body having a porous partition wall and a plugging portion, wherein a thickness of the partition wall is 0.257 mm or less, a porosity of the partition wall is 52 to 57%, an average pore diameter of the partition wall is 6 to 13 µm, a number per unit area of pores which exist at a surface of the partition wall and which have equivalent circle opening diameters exceeding 3 µm is 800 to 1500 /mm2, an average equivalent circle opening diameter of pores which exist at a surface of the partition wall and which have equivalent circle opening diameters exceeding 3 µm is 8.0 to 12.0 µm, and in a pore diameter distribution of the partition wall,

    D10 is 2.0 to 5.5 µm,
    D90 is 13.0 to 25.5 µm, and
    (Log(D90)-Log(D10))/Log(D50) is 0.84 or less.

    Honeycomb structure
    7.
    发明授权
    Honeycomb structure 有权

    公开(公告)号：US11673131B2

    公开(公告)日：2023-06-13

    申请号：US17169838

    申请日：2021-02-08

    申请人： NGK INSULATORS, LTD.

    发明人： Yoshiki Konno

    IPC分类号： B01J35/04 ,  C04B38/00 ,  B01D53/88

    CPC分类号： B01J35/04 ,  B01D53/885 ,  C04B38/0009 ,  B01D2255/92

    摘要： A honeycomb structure, including: a plurality of pillar shaped honeycomb segments, each of the pillar shaped honeycomb segments including a partition wall and a plugged portion; and a joining layer arranged so as to join side surfaces of the pillar shaped honeycomb segments to each other. The honeycomb structure satisfies the following equations (1) to (3):

    y≤1000  (1);

    y≤717.92x−0.095  (2); and

    y≥462.4x−0.153  (3),

    in which y is a maximum temperature (° C.) at which the use of the honeycomb structure is accepted, and x is a thermal conduction factor represented by the following equation:

    thermal conduction factor=(thermal conductivity of the partition wall×thermal conductivity of the joining layer)/(average thickness of the joining layer×porosity of the partition wall).