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公开(公告)号：US08320761B2
公开(公告)日：2012-11-27
申请号：US11962426
申请日：2007-12-21
CPC分类号： G02B6/2804 , G02B6/29343 , G02B6/29352 , G02B6/43 , G02B2006/1215 , H04J14/0212 , H04Q2213/1301 , H04Q2213/13322
摘要： Embodiments of a bidirectional 3-way optical splitter are described. This bidirectional 3-way optical splitter includes an optical splitter having: a first external node, a second external node, a third external node, and a fourth external node. In one mode of operation, the optical splitter may be configured to receive an external input optical signal on the first external node and to provide external output optical signals on the other external nodes. Moreover, in another mode of operation, the optical splitter may be configured to receive the external input optical signal on the third external node and to provide the external output optical signals on the other external nodes.
摘要翻译： 描述双向3路光分路器的实施例。 这种双向3路光分路器包括具有：第一外部节点，第二外部节点，第三外部节点和第四外部节点的光分路器。 在一种操作模式中，光分路器可以被配置为在第一外部节点上接收外部输入光信号，并且在其它外部节点上提供外部输出光信号。 此外，在另一种操作模式中，光分路器可以被配置为在第三外部节点上接收外部输入光信号，并且在其它外部节点上提供外部输出光信号。
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公开(公告)号：US07865084B2
公开(公告)日：2011-01-04
申请号：US11853316
申请日：2007-09-11
申请人： Ashok V. Krishnamoorthy , Ronald Ho , Brian W. O'Krafka , Ilya A. Sharapov , John E. Cunningham
发明人： Ashok V. Krishnamoorthy , Ronald Ho , Brian W. O'Krafka , Ilya A. Sharapov , John E. Cunningham
IPC分类号： H04B10/00
CPC分类号： H01L25/0657 , G02B6/43 , H01L25/0652 , H01L2225/06513 , H01L2225/06531 , H01L2225/06534 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of a system that includes an array of single-chip modules (CMs) are described. This array includes a first CM, a second CM coupled to the first CM, and a third CM coupled to the second CM. A given CM, which can be the first CM, the second CM or the third CM, includes a semiconductor die that is configured to communicate data signals with other CMs through electromagnetically coupled proximity communication. These proximity connectors are proximate to a surface of the semiconductor die. Moreover, the first CM and the third CM are configured to optically communicate optical signals with each other via the second CM through an optical signal path.
摘要翻译： 描述了包括单芯片模块（CM）阵列的系统的实施例。 该阵列包括第一CM，耦合到第一CM的第二CM和耦合到第二CM的第三CM。 可以是第一CM，第二CM或第三CM的给定CM包括被配置为通过电磁耦合的邻近通信与其他CM通信数据信号的半导体管芯。 这些接近连接器靠近半导体管芯的表面。 此外，第一CM和第三CM被配置为经由第二CM经由光信号路径彼此光学地传送光信号。
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公开(公告)号：US20090067851A1
公开(公告)日：2009-03-12
申请号：US11853316
申请日：2007-09-11
申请人： Ashok V. Krishnamoorthy , Ronald Ho , Brian W. O'Krafka , Ilya A. Sharapov , John E. Cunningham
发明人： Ashok V. Krishnamoorthy , Ronald Ho , Brian W. O'Krafka , Ilya A. Sharapov , John E. Cunningham
IPC分类号： H04B10/00
CPC分类号： H01L25/0657 , G02B6/43 , H01L25/0652 , H01L2225/06513 , H01L2225/06531 , H01L2225/06534 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of a system that includes an array of single-chip modules (CMs) are described. This array includes a first CM, a second CM coupled to the first CM, and a third CM coupled to the second CM. A given CM, which can be the first CM, the second CM or the third CM, includes a semiconductor die that is configured to communicate data signals with other CMs through electromagnetically coupled proximity communication. These proximity connectors are proximate to a surface of the semiconductor die. Moreover, the first CM and the third CM are configured to optically communicate optical signals with each other via the second CM through an optical signal path.
摘要翻译： 描述了包括单芯片模块（CM）阵列的系统的实施例。 该阵列包括第一CM，耦合到第一CM的第二CM和耦合到第二CM的第三CM。 可以是第一CM，第二CM或第三CM的给定CM包括被配置为通过电磁耦合的邻近通信与其他CM通信数据信号的半导体管芯。 这些接近连接器靠近半导体管芯的表面。 此外，第一CM和第三CM被配置为经由第二CM经由光信号路径彼此光学地传送光信号。
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公开(公告)号：US08346087B2
公开(公告)日：2013-01-01
申请号：US11863815
申请日：2007-09-28
申请人： Brian W. O'Krafka , Ashok V. Krishnamoorthy , John E. Cunningham , Xuehze Zheng , Ilya A. Sharapov , Ronald Ho
发明人： Brian W. O'Krafka , Ashok V. Krishnamoorthy , John E. Cunningham , Xuehze Zheng , Ilya A. Sharapov , Ronald Ho
CPC分类号： G02B6/43 , G02B6/3897 , H01L23/48 , H01L2924/0002 , H04J14/02 , H01L2924/00
摘要： Embodiments of a system that includes an array of chip modules (CMs) is described. In this system, a given CM in the array includes a semiconductor die that is configured to communicate data signals with one or more adjacent CMs through electromagnetic proximity communication using proximity connectors. Note that the proximity connectors are proximate to a surface of the semiconductor die. Moreover, the given CM is configured to communicate optical signals with other CMs through an optical signal path using optical communication, and the optical signals are encoded using wavelength-division multiplexing (WDM).
摘要翻译： 描述了包括芯片模块（CM）阵列的系统的实施例。 在该系统中，阵列中的给定CM包括被配置为通过使用接近连接器的电磁接近通信来将数据信号与一个或多个相邻CM通信的半导体管芯。 注意，接近连接器靠近半导体管芯的表面。 此外，给定CM被配置为通过使用光通信的光信号路径与其他CM通信光信号，并且使用波分复用（WDM）对光信号进行编码。
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5.发明授权公开(公告)号：US07961990B2
公开(公告)日：2011-06-14
申请号：US11962419
申请日：2007-12-21
CPC分类号： G02B6/43 , G02B6/12009 , H01L23/48 , H01L25/0652 , H01L25/0657 , H01L2225/06513 , H01L2225/06531 , H01L2225/06534 , H01L2924/0002 , H01L2924/14 , H01L2924/1433 , H01L2924/00
摘要： Embodiments of a system are described. This system includes an array of chip modules (CMs) and a baseplate, where the baseplate is configured to communicate data signals via optical communication. Moreover, the array includes first CMs mechanically coupled to first alignment features on the baseplate, and adjacent second CMs mechanically coupled to second alignment features on the baseplate. In this array, a given first CM is electrically coupled to a given set of electrical proximity connectors. Additionally, the array includes bridge components, wherein a given bridge component is electrically coupled to the second SCM and another set of electrical proximity connectors, which is electrically coupled to the set of electrical proximity connectors, thereby facilitating communication of other data signals between adjacent first CMs and second CMs via electrical proximity communication. Moreover, the given bridge component is optically coupled to the baseplate, thereby facilitating optical communication of the data signals between CMs via the baseplate.
摘要翻译： 描述系统的实施例。 该系统包括芯片模块（CM）和基板阵列，其中基板配置为通过光通信传送数据信号。 此外，阵列包括机械耦合到基板上的第一对准特征的第一CM，以及与基板上的第二对准特征机械耦合的相邻的第二CM。 在该阵列中，给定的第一CM电耦合到给定的一组电接近连接器。 另外，阵列包括桥组件，其中给定的桥组件电耦合到第二SCM和另一组电接近连接器，其被电耦合到该组电接近连接器，由此有助于在相邻的第一SCM之间的其它数据信号的通信 CM和第二CM通过电气接近通信。 而且，给定的桥式组件光耦合到基板，从而有助于通过基板在CM之间的数据信号的光通信。
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6.发明申请公开(公告)号：US20100266276A1
公开(公告)日：2010-10-21
申请号：US11962426
申请日：2007-12-21
IPC分类号： H04J14/00
CPC分类号： G02B6/2804 , G02B6/29343 , G02B6/29352 , G02B6/43 , G02B2006/1215 , H04J14/0212 , H04Q2213/1301 , H04Q2213/13322
摘要： Embodiments of a bidirectional 3-way optical splitter are described. This bidirectional 3-way optical splitter includes an optical splitter having: a first external node, a second external node, a third external node, and a fourth external node. In one mode of operation, the optical splitter may be configured to receive an external input optical signal on the first external node and to provide external output optical signals on the other external nodes. Moreover, in another mode of operation, the optical splitter may be configured to receive the external input optical signal on the third external node and to provide the external output optical signals on the other external nodes.
摘要翻译： 描述双向3路光分路器的实施例。 这种双向3路光分路器包括具有：第一外部节点，第二外部节点，第三外部节点和第四外部节点的光分路器。 在一种操作模式中，光分路器可以被配置为在第一外部节点上接收外部输入光信号，并且在其它外部节点上提供外部输出光信号。 此外，在另一种操作模式中，光分路器可以被配置为在第三外部节点上接收外部输入光信号，并且在其它外部节点上提供外部输出光信号。
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公开(公告)号：US20120230695A1
公开(公告)日：2012-09-13
申请号：US11863815
申请日：2007-09-28
申请人： Brian W. O'Krafka , Ashok V. Krishnamoorthy , John E. Cunningham , Xuehze Zheng , Ilya A. Sharapov , Ronald Ho
发明人： Brian W. O'Krafka , Ashok V. Krishnamoorthy , John E. Cunningham , Xuehze Zheng , Ilya A. Sharapov , Ronald Ho
IPC分类号： H04J14/02
CPC分类号： G02B6/43 , G02B6/3897 , H01L23/48 , H01L2924/0002 , H04J14/02 , H01L2924/00
摘要： Embodiments of a system that includes an array of chip modules (CMs) is described. In this system, a given CM in the array includes a semiconductor die that is configured to communicate data signals with one or more adjacent CMs through electromagnetic proximity communication using proximity connectors. Note that the proximity connectors are proximate to a surface of the semiconductor die. Moreover, the given CM is configured to communicate optical signals with other CMs through an optical signal path using optical communication, and the optical signals are encoded using wavelength-division multiplexing (WDM).
摘要翻译： 描述了包括芯片模块（CM）阵列的系统的实施例。 在该系统中，阵列中的给定CM包括被配置为通过使用接近连接器的电磁接近通信来将数据信号与一个或多个相邻CM通信的半导体管芯。 注意，接近连接器靠近半导体管芯的表面。 此外，给定CM被配置为通过使用光通信的光信号路径与其他CM通信光信号，并且使用波分复用（WDM）对光信号进行编码。
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8.发明申请公开(公告)号：US20100266240A1
公开(公告)日：2010-10-21
申请号：US11962419
申请日：2007-12-21
CPC分类号： G02B6/43 , G02B6/12009 , H01L23/48 , H01L25/0652 , H01L25/0657 , H01L2225/06513 , H01L2225/06531 , H01L2225/06534 , H01L2924/0002 , H01L2924/14 , H01L2924/1433 , H01L2924/00
摘要： Embodiments of a system are described. This system includes an array of chip modules (CMs) and a baseplate, where the baseplate is configured to communicate data signals via optical communication. Moreover, the array includes first CMs mechanically coupled to first alignment features on the baseplate, and adjacent second CMs mechanically coupled to second alignment features on the baseplate. In this array, a given first CM is electrically coupled to a given set of electrical proximity connectors. Additionally, the array includes bridge components, wherein a given bridge component is electrically coupled to the second SCM and another set of electrical proximity connectors, which is electrically coupled to the set of electrical proximity connectors, thereby facilitating communication of other data signals between adjacent first CMs and second CMs via electrical proximity communication. Moreover, the given bridge component is optically coupled to the baseplate, thereby facilitating optical communication of the data signals between CMs via the baseplate.
摘要翻译： 描述系统的实施例。 该系统包括芯片模块（CM）和基板阵列，其中基板配置为通过光通信传送数据信号。 此外，阵列包括机械耦合到基板上的第一对准特征的第一CM，以及与基板上的第二对准特征机械耦合的相邻的第二CM。 在该阵列中，给定的第一CM电耦合到给定的一组电接近连接器。 另外，阵列包括桥组件，其中给定的桥组件电耦合到第二SCM和另一组电接近连接器，其被电耦合到该组电接近连接器，由此有助于在相邻的第一SCM之间的其它数据信号的通信 CM和第二CM通过电气接近通信。 而且，给定的桥式组件光耦合到基板，从而有助于通过基板在CM之间的数据信号的光通信。
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公开(公告)号：US20100014852A1
公开(公告)日：2010-01-21
申请号：US12176293
申请日：2008-07-18
IPC分类号： H04J14/00
CPC分类号： H04L12/413 , H04Q11/0062 , H04Q2011/0064 , H04Q2011/009
摘要： A method of detecting transmission collisions in an optical data interconnect system including a transmitting node, a plurality of receiving nodes, and one or more remaining nodes connected through an optical data channel. The method includes initiating a data transmission of a data signal from the transmitting node over the optical data channel, transmitting a first collision detect signal from the transmitting node throughout a duration of the data transmission where the first collision detect signal is transmitted over an optical detection channel corresponding to the transmitting node, monitoring at the transmitting node of the optical data interconnect system for a predetermined period of time, where the optical data interconnect system further includes a plurality of optical collision detection channels corresponding to each of the plurality of receiving nodes and the one or more remaining nodes, and identifying a transmission collision when a second collision signal is received through one of the plurality of optical collision detection channels at the transmitting node during the predetermined period of time.
摘要翻译： 一种检测包括发送节点，多个接收节点以及通过光数据信道连接的一个或多个剩余节点的光数据互连系统中的传输冲突的方法。 该方法包括通过光数据信道发起来自发射节点的数据信号的数据传输，在数据传输的持续时间内，通过光学检测发送第一冲突检测信号，从发射节点发送第一冲突检测信号 信道，在光学数据互连系统的发送节点处监视预定时间段，其中光学数据互连系统还包括与多个接收节点中的每一个对应的多个光学冲突检测信道，以及 所述一个或多个剩余节点，并且在所述预定时间段期间通过所述发射节点的所述多个光学冲突检测信道之一接收到第二冲突信号时，识别传输冲突。
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公开(公告)号：US20100014427A1
公开(公告)日：2010-01-21
申请号：US12176294
申请日：2008-07-18
IPC分类号： G01R31/08
CPC分类号： H04L12/413
摘要： A method of arbitrating data transmissions to prevent data collisions in an optical data interconnect system including a transmitting node, a plurality of receiving nodes, and one or more remaining nodes connected through an optical data channel. The method involves transmitting a transmission request signal from the transmitting node over an arbitration channel corresponding to the transmitting node, monitoring, at the transmitting node, a plurality of arbitration channels corresponding to each of the plurality of receiving nodes and the one or more remaining nodes at the transmitting node for a predetermined period of time, determining a start time for a data transmission from the transmitting node based on the monitored signals to prevent a data collision, and initiating a data transmission of a data signal from the transmitting node over the optical data channel at the determined start time.
摘要翻译： 一种仲裁数据传输的方法，以防止包括发送节点，多个接收节点以及通过光数据信道连接的一个或多个剩余节点的光数据互连系统中的数据冲突。 该方法涉及通过对应于发送节点的仲裁信道从发送节点发送发送请求信号，在发送节点处监视与多个接收节点中的每一个对应的多个仲裁信道，以及一个或多个剩余节点 在发送节点预定的时间段内，基于所监视的信号确定来自发送节点的数据传输的开始时间，以防止数据冲突，以及通过光学发送来自发送节点的数据信号的数据传输 数据通道在确定的开始时间。
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