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    BROADBAND AND WAVELENGTH-SELECTIVE BIDIRECTIONAL 3-WAY OPTICAL SPLITTER
    3.
    发明申请
    BROADBAND AND WAVELENGTH-SELECTIVE BIDIRECTIONAL 3-WAY OPTICAL SPLITTER 有权
    宽带和波长选择性双向3路光学分路器

    公开(公告)号：US20100266276A1

    公开(公告)日：2010-10-21

    申请号：US11962426

    申请日：2007-12-21

    申请人： Xuehze Zheng ,  Brian W. O'Krafka ,  Ashok V. Krishnamoorthy ,  John E. Cunningham

    发明人： Xuehze Zheng ,  Brian W. O'Krafka ,  Ashok V. Krishnamoorthy ,  John E. Cunningham

    IPC分类号： H04J14/00

    CPC分类号： G02B6/2804 ,  G02B6/29343 ,  G02B6/29352 ,  G02B6/43 ,  G02B2006/1215 ,  H04J14/0212 ,  H04Q2213/1301 ,  H04Q2213/13322

    摘要： Embodiments of a bidirectional 3-way optical splitter are described. This bidirectional 3-way optical splitter includes an optical splitter having: a first external node, a second external node, a third external node, and a fourth external node. In one mode of operation, the optical splitter may be configured to receive an external input optical signal on the first external node and to provide external output optical signals on the other external nodes. Moreover, in another mode of operation, the optical splitter may be configured to receive the external input optical signal on the third external node and to provide the external output optical signals on the other external nodes.

    摘要翻译： 描述双向3路光分路器的实施例。 这种双向3路光分路器包括具有：第一外部节点，第二外部节点，第三外部节点和第四外部节点的光分路器。 在一种操作模式中，光分路器可以被配置为在第一外部节点上接收外部输入光信号，并且在其它外部节点上提供外部输出光信号。 此外，在另一种操作模式中，光分路器可以被配置为在第三外部节点上接收外部输入光信号，并且在其它外部节点上提供外部输出光信号。

    Multi-chip systems with optical bypass
    4.
    发明授权
    Multi-chip systems with optical bypass 有权
    具有光学旁路功能的多芯片系统

    公开(公告)号：US07865084B2

    公开(公告)日：2011-01-04

    申请号：US11853316

    申请日：2007-09-11

    申请人： Ashok V. Krishnamoorthy ,  Ronald Ho ,  Brian W. O'Krafka ,  Ilya A. Sharapov ,  John E. Cunningham

    发明人： Ashok V. Krishnamoorthy ,  Ronald Ho ,  Brian W. O'Krafka ,  Ilya A. Sharapov ,  John E. Cunningham

    IPC分类号： H04B10/00

    CPC分类号： H01L25/0657 ,  G02B6/43 ,  H01L25/0652 ,  H01L2225/06513 ,  H01L2225/06531 ,  H01L2225/06534 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Embodiments of a system that includes an array of single-chip modules (CMs) are described. This array includes a first CM, a second CM coupled to the first CM, and a third CM coupled to the second CM. A given CM, which can be the first CM, the second CM or the third CM, includes a semiconductor die that is configured to communicate data signals with other CMs through electromagnetically coupled proximity communication. These proximity connectors are proximate to a surface of the semiconductor die. Moreover, the first CM and the third CM are configured to optically communicate optical signals with each other via the second CM through an optical signal path.

    摘要翻译： 描述了包括单芯片模块（CM）阵列的系统的实施例。 该阵列包括第一CM，耦合到第一CM的第二CM和耦合到第二CM的第三CM。 可以是第一CM，第二CM或第三CM的给定CM包括被配置为通过电磁耦合的邻近通信与其他CM通信数据信号的半导体管芯。 这些接近连接器靠近半导体管芯的表面。 此外，第一CM和第三CM被配置为经由第二CM经由光信号路径彼此光学地传送光信号。

    MULTI-CHIP SYSTEMS WITH OPTICAL BYPASS
    5.
    发明申请
    MULTI-CHIP SYSTEMS WITH OPTICAL BYPASS 有权
    带光学旁路的多芯片系统

    公开(公告)号：US20090067851A1

    公开(公告)日：2009-03-12

    申请号：US11853316

    申请日：2007-09-11

    申请人： Ashok V. Krishnamoorthy ,  Ronald Ho ,  Brian W. O'Krafka ,  Ilya A. Sharapov ,  John E. Cunningham

    发明人： Ashok V. Krishnamoorthy ,  Ronald Ho ,  Brian W. O'Krafka ,  Ilya A. Sharapov ,  John E. Cunningham

    IPC分类号： H04B10/00

    CPC分类号： H01L25/0657 ,  G02B6/43 ,  H01L25/0652 ,  H01L2225/06513 ,  H01L2225/06531 ,  H01L2225/06534 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Embodiments of a system that includes an array of single-chip modules (CMs) are described. This array includes a first CM, a second CM coupled to the first CM, and a third CM coupled to the second CM. A given CM, which can be the first CM, the second CM or the third CM, includes a semiconductor die that is configured to communicate data signals with other CMs through electromagnetically coupled proximity communication. These proximity connectors are proximate to a surface of the semiconductor die. Moreover, the first CM and the third CM are configured to optically communicate optical signals with each other via the second CM through an optical signal path.

    摘要翻译： 描述了包括单芯片模块（CM）阵列的系统的实施例。 该阵列包括第一CM，耦合到第一CM的第二CM和耦合到第二CM的第三CM。 可以是第一CM，第二CM或第三CM的给定CM包括被配置为通过电磁耦合的邻近通信与其他CM通信数据信号的半导体管芯。 这些接近连接器靠近半导体管芯的表面。 此外，第一CM和第三CM被配置为经由第二CM经由光信号路径彼此光学地传送光信号。

    Multi-chip system including capacitively coupled and optical communication
    6.
    发明授权
    Multi-chip system including capacitively coupled and optical communication 有权
    多芯片系统包括电容耦合和光通信

    公开(公告)号：US07961990B2

    公开(公告)日：2011-06-14

    申请号：US11962419

    申请日：2007-12-21

    申请人： Ashok V. Krishnamoorthy ,  James G. Mitchell ,  John E. Cunningham ,  Brian W. O'Krafka

    发明人： Ashok V. Krishnamoorthy ,  James G. Mitchell ,  John E. Cunningham ,  Brian W. O'Krafka

    IPC分类号： G02B6/10 ,  G02B6/12

    CPC分类号： G02B6/43 ,  G02B6/12009 ,  H01L23/48 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2225/06513 ,  H01L2225/06531 ,  H01L2225/06534 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/00

    摘要： Embodiments of a system are described. This system includes an array of chip modules (CMs) and a baseplate, where the baseplate is configured to communicate data signals via optical communication. Moreover, the array includes first CMs mechanically coupled to first alignment features on the baseplate, and adjacent second CMs mechanically coupled to second alignment features on the baseplate. In this array, a given first CM is electrically coupled to a given set of electrical proximity connectors. Additionally, the array includes bridge components, wherein a given bridge component is electrically coupled to the second SCM and another set of electrical proximity connectors, which is electrically coupled to the set of electrical proximity connectors, thereby facilitating communication of other data signals between adjacent first CMs and second CMs via electrical proximity communication. Moreover, the given bridge component is optically coupled to the baseplate, thereby facilitating optical communication of the data signals between CMs via the baseplate.

    摘要翻译： 描述系统的实施例。 该系统包括芯片模块（CM）和基板阵列，其中基板配置为通过光通信传送数据信号。 此外，阵列包括机械耦合到基板上的第一对准特征的第一CM，以及与基板上的第二对准特征机械耦合的相邻的第二CM。 在该阵列中，给定的第一CM电耦合到给定的一组电接近连接器。 另外，阵列包括桥组件，其中给定的桥组件电耦合到第二SCM和另一组电接近连接器，其被电耦合到该组电接近连接器，由此有助于在相邻的第一SCM之间的其它数据信号的通信 CM和第二CM通过电气接近通信。 而且，给定的桥式组件光耦合到基板，从而有助于通过基板在CM之间的数据信号的光通信。

    Broadband and wavelength-selective bidirectional 3-way optical splitter
    7.
    发明授权
    Broadband and wavelength-selective bidirectional 3-way optical splitter 有权
    宽带和波长选择性双向3路光分路器

    公开(公告)号：US08320761B2

    公开(公告)日：2012-11-27

    申请号：US11962426

    申请日：2007-12-21

    申请人： Xuezhe Zheng ,  Brian W. O'Krafka ,  Ashok V. Krishnamoorthy ,  John E. Cunningham

    发明人： Xuezhe Zheng ,  Brian W. O'Krafka ,  Ashok V. Krishnamoorthy ,  John E. Cunningham

    IPC分类号： H04J14/00 ,  G02B6/26 ,  G02B6/42

    CPC分类号： G02B6/2804 ,  G02B6/29343 ,  G02B6/29352 ,  G02B6/43 ,  G02B2006/1215 ,  H04J14/0212 ,  H04Q2213/1301 ,  H04Q2213/13322

    摘要： Embodiments of a bidirectional 3-way optical splitter are described. This bidirectional 3-way optical splitter includes an optical splitter having: a first external node, a second external node, a third external node, and a fourth external node. In one mode of operation, the optical splitter may be configured to receive an external input optical signal on the first external node and to provide external output optical signals on the other external nodes. Moreover, in another mode of operation, the optical splitter may be configured to receive the external input optical signal on the third external node and to provide the external output optical signals on the other external nodes.

    摘要翻译： 描述双向3路光分路器的实施例。 这种双向3路光分路器包括具有：第一外部节点，第二外部节点，第三外部节点和第四外部节点的光分路器。 在一种操作模式中，光分路器可以被配置为在第一外部节点上接收外部输入光信号，并且在其它外部节点上提供外部输出光信号。 此外，在另一种操作模式中，光分路器可以被配置为在第三外部节点上接收外部输入光信号，并且在其它外部节点上提供外部输出光信号。

    MULTI-CHIP SYSTEM INCLUDING CAPACITIVELY COUPLED AND OPTICAL COMMUNICATION
    8.
    发明申请
    MULTI-CHIP SYSTEM INCLUDING CAPACITIVELY COUPLED AND OPTICAL COMMUNICATION 有权
    多芯片系统，包括电容耦合和光通信

    公开(公告)号：US20100266240A1

    公开(公告)日：2010-10-21

    申请号：US11962419

    申请日：2007-12-21

    申请人： Ashok V. Krishnamoorthy ,  James G. Mitchell ,  John E. Cunningham ,  Brian W. O'Krafka

    发明人： Ashok V. Krishnamoorthy ,  James G. Mitchell ,  John E. Cunningham ,  Brian W. O'Krafka

    IPC分类号： G02B6/34 ,  G02B6/42

    CPC分类号： G02B6/43 ,  G02B6/12009 ,  H01L23/48 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2225/06513 ,  H01L2225/06531 ,  H01L2225/06534 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/00

    摘要： Embodiments of a system are described. This system includes an array of chip modules (CMs) and a baseplate, where the baseplate is configured to communicate data signals via optical communication. Moreover, the array includes first CMs mechanically coupled to first alignment features on the baseplate, and adjacent second CMs mechanically coupled to second alignment features on the baseplate. In this array, a given first CM is electrically coupled to a given set of electrical proximity connectors. Additionally, the array includes bridge components, wherein a given bridge component is electrically coupled to the second SCM and another set of electrical proximity connectors, which is electrically coupled to the set of electrical proximity connectors, thereby facilitating communication of other data signals between adjacent first CMs and second CMs via electrical proximity communication. Moreover, the given bridge component is optically coupled to the baseplate, thereby facilitating optical communication of the data signals between CMs via the baseplate.

    摘要翻译： 描述系统的实施例。 该系统包括芯片模块（CM）和基板阵列，其中基板配置为通过光通信传送数据信号。 此外，阵列包括机械耦合到基板上的第一对准特征的第一CM，以及与基板上的第二对准特征机械耦合的相邻的第二CM。 在该阵列中，给定的第一CM电耦合到给定的一组电接近连接器。 另外，阵列包括桥组件，其中给定的桥组件电耦合到第二SCM和另一组电接近连接器，其被电耦合到该组电接近连接器，由此有助于在相邻的第一SCM之间的其它数据信号的通信 CM和第二CM通过电气接近通信。 而且，给定的桥式组件光耦合到基板，从而有助于通过基板在CM之间的数据信号的光通信。