公开(公告)号：US20120175026A1

公开(公告)日：2012-07-12

申请号：US13428013

申请日：2012-03-23

申请人： Yasuhiro AGRUGA ,  Katsura Kajihara ,  Takeshi Kudo

发明人： Yasuhiro AGRUGA ,  Katsura Kajihara ,  Takeshi Kudo

IPC分类号： C22F1/08 ,  C22C9/01 ,  C22C9/04 ,  C22C9/02 ,  C22C9/00 ,  C22C9/06

CPC分类号： C22F1/08 ,  B21B2003/005 ,  B22D11/004 ,  B22D21/025 ,  C22C1/06 ,  C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C9/05 ,  C22C9/06

摘要： The present invention provides a Cu—Fe—P alloy which has a high strength, high conductivity and superior bending workability. The copper alloy comprises 0.01 to 1.0% Fe, 0.01 to 0.4% P, 0.1 to 1.0% Mg, and the remainder Cu and unavoidable impurities. The size of oxides and precipitates including Mg in the copper alloy is controlled so that the ratio of the amount of Mg measured by a specified measurement method in the extracted residue by a specified extracted residue method to the Mg content in said copper alloy is 60% or less, thus endowing the alloy with a high strength and superior bending workability.

摘要翻译： 本发明提供一种具有高强度，高导电性和优异的弯曲加工性的Cu-Fe-P合金。 铜合金含有0.01〜1.0％的Fe，0.01〜0.4％的P，0.1〜1.0％的Mg，余量为Cu和不可避免的杂质。 控制铜合金中包含Mg的氧化物和析出物的大小，使得通过规定的提取残渣法，通过规定的测定方法测定的Mg量与所述铜合金中的Mg含量之比为60％ 以下，从而赋予合金高强度和优异的弯曲加工性。

公开(公告)号：US08357248B2

公开(公告)日：2013-01-22

申请号：US13491911

申请日：2012-06-08

申请人： Yasuhiro Aruga ,  Akira Fugono ,  Takeshi Kudo ,  Katsura Kajihara

发明人： Yasuhiro Aruga ,  Akira Fugono ,  Takeshi Kudo ,  Katsura Kajihara

IPC分类号： C22C9/02 ,  C22C9/04 ,  C22C9/06

CPC分类号： H01B1/026 ,  C22C1/06 ,  C22C9/00 ,  C22C9/02 ,  C22C9/06 ,  C22C9/10 ,  C22F1/00 ,  C22F1/08 ,  H01H1/025

摘要： A copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer. According to the invention, it is possible to provide a copper alloy having high strength, high electrical conductivity, and excellent bendability.

摘要翻译： 铜合金具有高强度，高导电性和优异的弯曲性，该铜合金以质量％计含有0.4〜4.0％的Ni; 0.05〜1.0％的Si; 作为元素M，选自0.005〜0.5％的P，0.005〜1.0％的Cr和0.005〜1.0％的Ti，其余为铜和不可避免的杂质，其中原子数比M / 在铜合金的组织中，尺寸为50〜200nm的析出物中含有的元素M和Si的Si平均为0.01〜10，原子数比通过场致发射透射电子显微镜测定，放大率 30,000和能量色散分析仪。 根据本发明，可以提供高强度，高导电性和优异的弯曲性的铜合金。

公开(公告)号：US20090101243A1

公开(公告)日：2009-04-23

申请号：US12297069

申请日：2007-05-23

申请人： Yasuhiro Aruga ,  Akira Fugono ,  Takeshi Kudo ,  Katsura Kajihara

发明人： Yasuhiro Aruga ,  Akira Fugono ,  Takeshi Kudo ,  Katsura Kajihara

IPC分类号： C22C9/02 ,  C22C9/06 ,  C22C9/04

CPC分类号： H01B1/026 ,  C22C1/06 ,  C22C9/00 ,  C22C9/02 ,  C22C9/06 ,  C22C9/10 ,  C22F1/00 ,  C22F1/08 ,  H01H1/025

摘要： The present invention relates to a copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer. According to the invention, it is possible to provide a copper alloy having high strength, high electrical conductivity, and excellent bendability.

摘要翻译： 本发明涉及一种具有高强度，高导电性和优异的弯曲性的铜合金，铜合金以质量％计含有0.4〜4.0％的Ni; 0.05〜1.0％的Si; 作为元素M，选自0.005〜0.5％的P，0.005〜1.0％的Cr和0.005〜1.0％的Ti，其余为铜和不可避免的杂质，其中原子数比M / 在铜合金的组织中，尺寸为50〜200nm的析出物中含有的元素M和Si的Si平均为0.01〜10，原子数比通过场致发射透射电子显微镜测定，放大率 30,000和能量色散分析仪。 根据本发明，可以提供高强度，高导电性和优异的弯曲性的铜合金。

公开(公告)号：US09177686B2

公开(公告)日：2015-11-03

申请号：US13491942

申请日：2012-06-08

申请人： Yasuhiro Aruga ,  Akira Fugono ,  Takeshi Kudo ,  Katsura Kajihara

发明人： Yasuhiro Aruga ,  Akira Fugono ,  Takeshi Kudo ,  Katsura Kajihara

IPC分类号： C22C1/06 ,  C22C9/00 ,  C22C9/02 ,  C22C9/06 ,  C22F1/00 ,  H01B1/02 ,  C22C9/10 ,  C22F1/08 ,  H01H1/025

CPC分类号： H01B1/026 ,  C22C1/06 ,  C22C9/00 ,  C22C9/02 ,  C22C9/06 ,  C22C9/10 ,  C22F1/00 ,  C22F1/08 ,  H01H1/025

摘要： The present invention relates to a copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer.

摘要翻译： 本发明涉及一种具有高强度，高导电性和优异的弯曲性的铜合金，铜合金以质量％计含有0.4〜4.0％的Ni; 0.05〜1.0％的Si; 作为元素M，选自0.005〜0.5％的P，0.005〜1.0％的Cr和0.005〜1.0％的Ti，其余为铜和不可避免的杂质，其中原子数比M / 在铜合金的组织中，尺寸为50〜200nm的析出物中含有的元素M和Si的Si平均为0.01〜10，原子数比通过场致发射透射电子显微镜测定，放大率 30,000和能量色散分析仪。

公开(公告)号：US07824607B2

公开(公告)日：2010-11-02

申请号：US11957825

申请日：2007-12-17

申请人： Katsura Kajihara ,  Takeshi Kudo ,  Yasuhiro Aruga ,  Katsushi Matsumoto

发明人： Katsura Kajihara ,  Takeshi Kudo ,  Yasuhiro Aruga ,  Katsushi Matsumoto

IPC分类号： C22C21/00 ,  C22C21/02 ,  C22C21/06 ,  C22C21/12

CPC分类号： C22C21/02 ,  C22C21/06 ,  C22C21/08 ,  C22F1/04 ,  C22F1/043 ,  C22F1/047 ,  C22F1/05

摘要： Disclosed is an aluminum alloy sheet resistant to deterioration through natural aging. The aluminum alloy sheet is an Al—Mg—Si aluminum alloy sheet containing 0.35 to 1.0 percent by mass of magnesium; 0.5 to 1.5 percent by mass of silicon; 0.01 to 1.0 percent by mass of manganese; and 0.001 to 1.0 percent by mass of copper, with the remainder being aluminum and inevitable impurities, in which the amount of dissolved silicon is 0.55 to 0.80 percent by mass, the amount of dissolved magnesium is 0.35 to 0.60 percent by mass, and the ratio of the former to the latter is 1.1 to 2. The aluminum alloy sheet may further contain 0.005 to 0.2 percent by mass of titanium with or without 0.0001 to 0.05 percent by mass of boron.

摘要翻译： 公开了一种耐天然老化劣化的铝合金板。 铝合金板是含有0.35〜1.0质量％的镁的Al-Mg-Si铝合金板; 0.5〜1.5质量％的硅; 0.01〜1.0质量％的锰; 和0.001〜1.0质量％的铜，其余为铝和不可避免的杂质，其中溶解的硅的量为0.55〜0.80质量％，溶解的镁的含量为0.35〜0.60质量％ 前者为1.1〜2.铝合金板还可以含有0.005〜0.2质量％的钛，其含有或不含有0.0001〜0.05质量％的硼。

公开(公告)号：US20090084473A1

公开(公告)日：2009-04-02

申请号：US11994136

申请日：2006-06-19

申请人： Yasuhiro Aruga ,  Katsura Kajihara ,  Takeshi Kudo

发明人： Yasuhiro Aruga ,  Katsura Kajihara ,  Takeshi Kudo

IPC分类号： C22F1/08 ,  C22C9/00

CPC分类号： C22F1/08 ,  B21B2003/005 ,  B22D11/004 ,  B22D21/025 ,  C22C1/06 ,  C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C9/05 ,  C22C9/06

摘要： The present invention provides a Cu—Fe—P alloy which has a high strength, high conductivity and superior bending workability. The copper alloy comprises 0.01 to 1.0% Fe, 0.01 to 0.4% P, 0.1 to 1.0% Mg, and the remainder Cu and unavoidable impurities. The size of oxides and precipitates including Mg in the copper alloy is controlled so that the ratio of the amount of Mg measured by a specified measurement method in the extracted residue by a specified extracted residue method to the Mg content in said copper alloy is 60% or less, thus endowing the alloy with a high strength and superior bending workability.

摘要翻译： 本发明提供一种具有高强度，高导电性和优异的弯曲加工性的Cu-Fe-P合金。 铜合金含有0.01〜1.0％的Fe，0.01〜0.4％的P，0.1〜1.0％的Mg，余量为Cu和不可避免的杂质。 控制铜合金中包含Mg的氧化物和析出物的大小，使得通过规定的提取残渣法，通过规定的测定方法测定的Mg量与所述铜合金中的Mg含量之比为60％ 以下，从而赋予合金高强度和优异的弯曲加工性。

公开(公告)号：US20080175747A1

公开(公告)日：2008-07-24

申请号：US11957825

申请日：2007-12-17

申请人： Katsura Kajihara ,  Takeshi Kudo ,  Yasuhiro Aruga ,  Katsushi Matsumoto

发明人： Katsura Kajihara ,  Takeshi Kudo ,  Yasuhiro Aruga ,  Katsushi Matsumoto

IPC分类号： C22C21/00

CPC分类号： C22C21/02 ,  C22C21/06 ,  C22C21/08 ,  C22F1/04 ,  C22F1/043 ,  C22F1/047 ,  C22F1/05

摘要： Disclosed is an aluminum alloy sheet resistant to deterioration through natural aging. The aluminum alloy sheet is an Al—Mg—Si aluminum alloy sheet containing 0.35 to 1.0 percent by mass of magnesium; 0.5 to 1.5 percent by mass of silicon; 0.01 to 1.0 percent by mass of manganese; and 0.001 to 1.0 percent by mass of copper, with the remainder being aluminum and inevitable impurities, in which the amount of dissolved silicon is 0.55 to 0.80 percent by mass, the amount of dissolved magnesium is 0.35 to 0.60 percent by mass, and the ratio of the former to the latter is 1.1 to 2. The aluminum alloy sheet may further contain 0.005 to 0.2 percent by mass of titanium with or without 0.0001 to 0.05 percent by mass of boron.

摘要翻译： 公开了一种耐天然老化劣化的铝合金板。 铝合金板是含有0.35〜1.0质量％的镁的Al-Mg-Si铝合金板; 0.5〜1.5质量％的硅; 0.01〜1.0质量％的锰; 和0.001〜1.0质量％的铜，其余为铝和不可避免的杂质，其中溶解的硅的量为0.55〜0.80质量％，溶解的镁的含量为0.35〜0.60质量％ 前者为1.1〜2.铝合金板还可以含有0.005〜0.2质量％的钛，其含有或不含有0.0001〜0.05质量％的硼。

公开(公告)号：US08268098B2

公开(公告)日：2012-09-18

申请号：US12297069

申请日：2007-05-23

申请人： Yasuhiro Aruga ,  Akira Fugono ,  Takeshi Kudo ,  Katsura Kajihara

发明人： Yasuhiro Aruga ,  Akira Fugono ,  Takeshi Kudo ,  Katsura Kajihara

IPC分类号： C22C9/02 ,  C22C9/04 ,  C22C9/06

CPC分类号： H01B1/026 ,  C22C1/06 ,  C22C9/00 ,  C22C9/02 ,  C22C9/06 ,  C22C9/10 ,  C22F1/00 ,  C22F1/08 ,  H01H1/025

摘要： The present invention relates to a copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer. According to the invention, it is possible to provide a copper alloy having high strength, high electrical conductivity, and excellent bendability.

摘要翻译： 本发明涉及一种具有高强度，高导电性和优异的弯曲性的铜合金，铜合金以质量％计含有0.4〜4.0％的Ni; 0.05〜1.0％的Si; 作为元素M，选自0.005〜0.5％的P，0.005〜1.0％的Cr和0.005〜1.0％的Ti，其余为铜和不可避免的杂质，其中原子数比M / 在铜合金的组织中，尺寸为50〜200nm的析出物中含有的元素M和Si的Si平均为0.01〜10，原子数比通过场致发射透射电子显微镜测定，放大率 30,000和能量色散分析仪。 根据本发明，可以提供高强度，高导电性和优异的弯曲性的铜合金。

公开(公告)号：US20100101748A1

公开(公告)日：2010-04-29

申请号：US12529030

申请日：2008-02-20

申请人： Hideo Hata ,  Katsura Kajihara ,  Shigenobu Namba ,  Hiroyuki Takeda ,  Mamoru Nagao

发明人： Hideo Hata ,  Katsura Kajihara ,  Shigenobu Namba ,  Hiroyuki Takeda ,  Mamoru Nagao

IPC分类号： B22D23/00 ,  C22C21/10

CPC分类号： B22D21/007 ,  C22C1/0416 ,  C22C21/10 ,  C22F1/002 ,  C22F1/053

摘要： An object of the present invention is to provide an Al—Zn—Mg—Cu 7000-series Al alloy having high ductility as well as having high strength. For attaining this purpose, an Al alloy having a structure in which an inclusion is not included is produced by reducing an amount of oxygen contained in an Al alloy that is obtained by solidifying a preform resulting from rapid solidification by preferably spray forming a molten metal of an Al—Zn—Mg—Cu 7000-series Al alloy with an inert gas. This Al alloy has, as mechanical properties at an ordinary temperature, a tensile strength of 600 MPa or more, and an elongation of 15% or more when the tensile strength is from 600 MPa or more and less than 800 MPa or an elongation of 10% or more when the tensile strength is 800 MPa or more, and is excellent in cold workability such as rollability.

摘要翻译： 本发明的目的是提供具有高延展性和高强度的Al-Zn-Mg-Cu 7000系Al合金。 为了达到这个目的，通过减少Al合金中所含的氧的量，通过使由快速凝固而形成的预成型体固化而得到的氧的量优选地喷射形成熔融金属 具有惰性气体的Al-Zn-Mg-Cu 7000系Al合金。 当该拉伸强度为600MPa以上且小于800MPa时，拉伸强度为600MPa以上，伸长率为15％以上时，作为常温下的机械特性， 拉伸强度为800MPa以上时的％以上，冷加工性，例如滚动性优异。

公开(公告)号：US08641837B2

公开(公告)日：2014-02-04

申请号：US11469648

申请日：2006-09-01

申请人： Yasuhiro Aruga ,  Katsura Kajihara

发明人： Yasuhiro Aruga ,  Katsura Kajihara

IPC分类号： C22C9/06

CPC分类号： C22C9/02 ,  C22C9/06 ,  C22F1/08

摘要： A Cu—Ni—Sn—P alloy is provided, which is excellent in stress relaxation property in a direction perpendicular to a rolling direction, and has any of high strength, high conductivity, and excellent bendability. A copper alloy contains 0.1 to 3.0% of Ni, 0.1 to 3.0% of Sn, and 0.01 to 0.3% of P in mass percent respectively, and includes copper and inevitable impurities as the remainder; wherein in a radial distribution function around a Ni atom according to a XAFS analysis method, a first peak position is within a range of 2.16 to 2.35 Å, the position indicating a distance between a Ni atom in Cu and an atom nearest to the Ni atom. Thus, distances to atoms around the Ni atom in Cu are comparatively increased, so that the stress relaxation property in a direction perpendicular to the rolling direction of the copper alloy is improved.

摘要翻译： 提供了一种Cu-Ni-Sn-P合金，其在与轧制方向垂直的方向上的应力松弛性优异，并且具有高强度，高导电性和优异的弯曲性。 铜合金分别含有0.1〜3.0％的Ni，0.1〜3.0％的Sn和0.01〜0.3％的P，以及其余的铜和不可避免的杂质; 其中，根据XAFS分析方法在围绕Ni原子的径向分布函数中，第一峰位置在2.16〜2.35的范围内，该位置表示Cu中的Ni原子和最接近Ni原子的原子之间的距离 。 因此，Cu中的Ni原子周围的原子的距离相对增加，从而提高了与铜合金的轧制方向垂直的方向上的应力松弛性。