摘要:
The following processing is performed when a line gang pickup head can simultaneously pick up a maximum of n (here, 4) components. First, groupings of components of the same type, out of all of the components to be optimized, are set as component tapes and the component tapes are arranged descending order of the number of components to produce a component histogram (406a). Next, a partial histogram (400), which is part of the component histogram (406a), is taken from the component histogram (406a), and is arranged at two-dimensional coordinates where a horizontal axis (the Z-axis) represents an arrangement of component cassettes and a vertical axis represents a number of pickup operations by the line gang pickup head. After this, the component tapes are lined up, by arranging the partial histograms (401a and 401b), so as to produce a diagram (406b) whose width (number of components) in the horizontal axis is n (=4).
摘要:
The following processing is performed when a line gang pickup head can simultaneously pick up a maximum of n (here, 4) components. First, groupings of components of the same type, out of all of the components to be optimized, are set as component tapes and the component tapes are arranged descending order of the number of components to produce a component histogram (406a). Next, a partial histogram (400), which is part of the component histogram (406a), is taken from the component histogram (406a), and is arranged at two-dimensional coordinates where a horizontal axis (the Z-axis) represents an arrangement of component cassettes and a vertical axis represents a number of pickup operations by the line gang pickup head. After this, the component tapes are lined up, by arranging the partial histograms (401a and 401b), so as to produce a diagram (406b) whose width (number of components) in the horizontal axis is n (=4).
摘要:
A controller optimizes an arrangement of component supply parts installed in a component supply unit while position information of mounting points on a circuit board is taken into account, and then optimizes a mounting path to the circuit board under the arrangement. Since the position information of mounting points is taken into account in obtaining the arrangement of component supply parts, wasteful mounting paths are reduced in comparison with the case of optimizing the mounting path on only the circuit board as in the conventional art, so that the mounting time can be shortened.
摘要:
There are provided a method and device for generating component mounting data in view of productivity, quality assurance, safety, or the like, when components are mounted onto a mounting target, and a component mounting method and device by which a mounting operation can be performed based on the data. Rules that must be observed, or are desired to be observed, based on various conditions such as mounting apparatus and component information and the like are automatically generated in view of productivity, quality assurance, safety, or the like and can be utilized for generation of component mounting data.
摘要:
To provide a component mounting order optimizing method and a component mounting order optimizing apparatus by which it is easy to change a preparatory plan and it is possible to shorten time necessary for a change of substrates to be produced.An optimization program storage section 16 has a placement list preparing section 17 which obtains component placement data to be obtainable by a component information reading device 5 reading identification information of a component cassette, and prepares a component placement list in which identification information of component cassettes and positions which are loaded in a component supply section were associated, and a mounting order deciding section 18 which decides mounting order of components in such a state that an array of the component cassettes is fixed, on the basis of the component placement list.
摘要:
A component verification method for a mounter (100) that is capable of performing component verification with less labor, is comprised of: a position specification step (S12A) of specifying a placement position in the mounter (100) where a component tape is placed; a read step (S13) of reading component information from an IC tag (426b) that is attached to the component tape or a reel (426); and a verification step (S14) of verifying the component information and the placement position against component arrangement data that indicates components that should be mounted onto the board as well a position where the component tape should be placed.
摘要:
A method of optimizing an order of component mounting which includes optimizing an order of component mounting for any one pattern among the plurality of patterns, calculating a quotient and a remainder by dividing the total number of the patterns included in the board by the number of mounters, determining the quotient as the number of patterns to be allocated in a case where the remainder is zero. The optimization method also includes determining a number, which is the quotient plus one, as the number of patterns to be allocated to the same number of the mounters as the remainder, starting from the mounter in a process farthest upstream, determining the quotient as the number of patterns to be allocated to the rest of the mounters, in the case where the remainder is one or greater, and allocating the allocated number of patterns, to each of the mounters.
摘要:
A method for identifying apparatuses to be recalled that enables identifying the locations of the products to be recalled, the method including: collecting steps (S2 and S4) of collecting the information items stored in IC tags from the apparatuses with the IC tag via a communication network, a checking step (S6) of checking the information items collected in the collecting step with the information items related to the apparatuses to be recalled, and an identifying step (S8) of identifying the apparatuses to be recalled in the apparatuses with the IC tag based on the checking results.
摘要:
The present invention provides a component mounting sequence optimizing method, a component mounting device, a program for executing the component mounting sequence optimizing method, and recording medium in which the program is recorded, in the component mounting device with a component holding head capable of holding a plurality of components and having a component recognition camera. The invention includes a component mounting sequence optimizing device (300) and a mounting sequence for components is determined on basis of a result of comparison between conveyance times for the components and recognition times required for recognitions of the components. Thus cycle time for mounting can be reduced, in comparison with conventional arts, in mounting of components with a component holding head having a plurality of component holding members and having a component recognition camera.
摘要:
A component verification method for a mounter (100) that is capable of performing component verification with less labor. The method includes a position specification step (S12A) of specifying a placement position in the mounter (100) where a component tape is placed; a read step (S13) of reading component information from an IC tag (426b) that is attached to the component tape or a reel (426); and a verification step (S14) of verifying the component information and the placement position against component arrangement data that indicates components that should be mounted onto the board as well a position where the component tape should be placed.