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公开(公告)号:US4069155A
公开(公告)日:1978-01-17
申请号:US692024
申请日:1976-06-01
CPC分类号: A61M1/1694
摘要: A hemodialysis system for use with any type of dialyzer, such as coil-type, Kiil-type and capillary-type or hollow fiber-type dialyzers, which has a fluid circulation circuit and a bypass circuit short-circuiting the fluid circulation circuit. At one junction between the fluid circulation circuit and the bypass circuit, an ejector is employed. The ejector has a nozzle, a diffuser axially aligned with the nozzle and defining an orifice and a suction chamber communicated with the orifice. During circulation of the dialysate in the circulation circuit and from the nozzle onto the diffuser of the ejector, a negative gauge pressure is developed in the suction chamber so that the dialysate can be drawn through the bypass circuit. The circulation circuit and the bypass circuit have respective coupling assemblies for removable connection with the coil-type dialyzer and with the Kiil-type or capillary-type, or hollow fiber-type, dialyzer.
摘要翻译: 一种用于任何类型的透析器的血液透析系统,例如线圈型,Kiil型和毛细管型或中空纤维型透析器,其具有使流体循环回路短路的流体循环回路和旁路回路。 在流体循环回路和旁路回路之间的一个连接处,采用喷射器。 喷射器具有喷嘴,与喷嘴轴向对准的扩散器,并且限定出孔口和与孔口连通的吸入室。 在将透析液循环到循环回路中并从喷嘴循环到喷射器的扩散器上时,在吸入室中产生负表压,使得透析液可以通过旁路回路被抽吸。 循环回路和旁路回路具有用于与线圈式透析器和Kiil型或毛细管型或中空纤维型透析器可拆卸连接的各自的联接组件。
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公开(公告)号:US4034126A
公开(公告)日:1977-07-05
申请号:US621621
申请日:1975-10-10
CPC分类号: B01J2/006 , A61K9/5089
摘要: A process for coating granular materials particularly applicable in coating granular materials each having a particle size within the range of 100 to 1,000 microns, wherein supply of a coating or binding liquid is effected in response to a specific measured electro-resistance of a fluidized means of the granular materials while supply of a coating powder is continuously effected in a predetermined variable rate. To this end, at least one electrode cooperates with a portion of the wall forming a coating apparatus to detect the specific electro-resistance which is in turn compared with a predetermined value in a comparison circuit.
摘要翻译: 一种用于涂覆颗粒材料的方法,特别适用于涂覆粒度在100至1,000微米范围内的颗粒材料,其中涂层或粘结液体的供应响应于特定测量的电阻 在以预定的可变速率连续地进行供给涂料粉末的颗粒状物质。 为此,至少一个电极与形成涂覆装置的壁的一部分配合,以检测比较电路中的特定电阻,该特定电阻又与比较电路中的预定值进行比较。
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公开(公告)号:US08664316B2
公开(公告)日:2014-03-04
申请号:US13205258
申请日:2011-08-08
申请人: Makoto Kubota , Kaoru Miura , Hisato Yabuta , Yoshihiko Matsumura , Yuichi Shimakawa , Masaki Azuma
发明人: Makoto Kubota , Kaoru Miura , Hisato Yabuta , Yoshihiko Matsumura , Yuichi Shimakawa , Masaki Azuma
CPC分类号: C04B35/453 , C01G53/006 , C01G53/40 , C01P2002/52 , C01P2002/54 , C01P2004/61 , C01P2006/32 , C04B35/50 , C08K3/11 , C08K3/22 , C09K5/06 , C22C1/10
摘要: Provided are resin-based and metal-based anti-thermally-expansive members each having small thermal expansion. More specifically, provided are an anti-thermally-expansive resin and an anti-thermally-expansive metal, each including a resin or a metal having a positive linear expansion coefficient at 20° C. and a solid particle dispersed in the resin or metal, in which the solid particle includes at least an oxide represented by the following general formula (1): (Bi1-xMx)NiO3 (1), where M represents at least one metal selected from the group consisting of La, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Y, and In; and x represents a numerical value of 0.02≦x≦0.15.
摘要翻译: 提供了具有小的热膨胀的树脂基和金属基的抗热膨胀性构件。 更具体地说,提供了一种抗热膨胀树脂和抗热膨胀性金属,其各自包括在20℃具有正线性膨胀系数的树脂或金属和分散在树脂或金属中的固体颗粒, 其中固体颗粒至少包含由以下通式(1)表示的氧化物:(Bi1-xMx)NiO3(1),其中M表示选自La,Pr,Nd,Sm中的至少一种金属 ,Eu,Gd,Tb,Dy,Ho,Er,Tm,Yb,Lu,Y和In; x表示0.02 @ x @ 0.15的数值。
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公开(公告)号:US20120037842A1
公开(公告)日:2012-02-16
申请号:US13205258
申请日:2011-08-08
申请人: Makoto Kubota , Kaoru Miura , Hisato Yabuta , Yoshihiko Matsumura , Yuichi Shimakawa , Masaki Azuma
发明人: Makoto Kubota , Kaoru Miura , Hisato Yabuta , Yoshihiko Matsumura , Yuichi Shimakawa , Masaki Azuma
CPC分类号: C04B35/453 , C01G53/006 , C01G53/40 , C01P2002/52 , C01P2002/54 , C01P2004/61 , C01P2006/32 , C04B35/50 , C08K3/11 , C08K3/22 , C09K5/06 , C22C1/10
摘要: Provided are resin-based and metal-based anti-thermally-expansive members each having small thermal expansion. More specifically, provided are an anti-thermally-expansive resin and an anti-thermally-expansive metal, each including a resin or a metal having a positive linear expansion coefficient at 20° C. and a solid particle dispersed in the resin or metal, in which the solid particle includes at least an oxide represented by the following general formula (1): (Bi1-xMx)NiO3 (1), where M represents at least one metal selected from the group consisting of La, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Y, and In; and x represents a numerical value of 0.02≦x≦0.15.
摘要翻译: 提供了具有小的热膨胀的树脂基和金属基的抗热膨胀性构件。 更具体地说,提供了一种抗热膨胀树脂和抗热膨胀性金属,其各自包括在20℃具有正线性膨胀系数的树脂或金属和分散在树脂或金属中的固体颗粒, 其中固体颗粒至少包含由以下通式(1)表示的氧化物:(Bi1-xMx)NiO3(1),其中M表示选自La,Pr,Nd,Sm中的至少一种金属 ,Eu,Gd,Tb,Dy,Ho,Er,Tm,Yb,Lu,Y和In; x表示数值为0.02≦̸ x≦̸ 0.15。
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5.
公开(公告)号:US20120040196A1
公开(公告)日:2012-02-16
申请号:US13205272
申请日:2011-08-08
申请人: Makoto Kubota , Kaoru Miura , Hisato Yabuta , Yoshihiko Matsumura , Yuichi Shimakawa , Masaki Azuma
发明人: Makoto Kubota , Kaoru Miura , Hisato Yabuta , Yoshihiko Matsumura , Yuichi Shimakawa , Masaki Azuma
IPC分类号: B32B15/04 , C04B35/453 , C04B35/50
CPC分类号: B32B7/02 , B32B2307/734 , C01G53/40 , C04B35/50 , C04B35/505 , H01L23/3731 , H01L2924/0002 , H01L2924/09701 , H05K3/0058 , H05K2201/068 , H01L2924/00
摘要: Provided are a thermal expansion suppressing member having negative thermal expansion properties and a metal-based anti-thermally-expansive member having small thermal expansion. More specifically, provided are a thermal expansion suppressing member, including at least an oxide represented by the following general formula (1), and an anti-thermally-expansive member, including a metal having a positive linear expansion coefficient at 20° C., and a solid body including at least an oxide represented by the following general formula (1), the metal and solid being joined to each other: (Bi1-xMx)NiO3 (1) where M represents at least one metal selected from the group consisting of La, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Y, and In; and x represents a numerical value of 0.02≦x≦0.15.
摘要翻译: 提供具有负热膨胀性的热膨胀抑制构件和具有小的热膨胀的金属基防热膨胀构件。 更具体地说,提供了至少包含由以下通式(1)表示的氧化物的热膨胀抑制构件和包括在20℃具有正线性膨胀系数的金属的抗热膨胀性构件, 和包含至少一种由以下通式(1)表示的氧化物的固体,金属和固体彼此连接:(Bi1-xMx)NiO3(1)其中M表示选自以下的至少一种金属: 的La,Pr,Nd,Sm,Eu,Gd,Tb,Dy,Ho,Er,Tm,Yb,Lu,Y和In; x表示数值为0.02≦̸ x≦̸ 0.15。
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6.
公开(公告)号:US08753749B2
公开(公告)日:2014-06-17
申请号:US13205272
申请日:2011-08-08
申请人: Makoto Kubota , Kaoru Miura , Hisato Yabuta , Yoshihiko Matsumura , Yuichi Shimakawa , Masaki Azuma
发明人: Makoto Kubota , Kaoru Miura , Hisato Yabuta , Yoshihiko Matsumura , Yuichi Shimakawa , Masaki Azuma
IPC分类号: B32B15/04 , C04B35/453 , C04B35/50
CPC分类号: B32B7/02 , B32B2307/734 , C01G53/40 , C04B35/50 , C04B35/505 , H01L23/3731 , H01L2924/0002 , H01L2924/09701 , H05K3/0058 , H05K2201/068 , H01L2924/00
摘要: Provided are a thermal expansion suppressing member having negative thermal expansion properties and a metal-based anti-thermally-expansive member having small thermal expansion. More specifically, provided are a thermal expansion suppressing member, including at least an oxide represented by the following general formula (1), and an anti-thermally-expansive member, including a metal having a positive linear expansion coefficient at 20° C., and a solid body including at least an oxide represented by the following general formula (1), the metal and solid being joined to each other: (Bi1-xMx)NiO3 (1) where M represents at least one metal selected from the group consisting of La, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Y, and In; and x represents a numerical value of 0.02≦x≦0.15.
摘要翻译: 提供具有负热膨胀性的热膨胀抑制构件和具有小的热膨胀的金属基防热膨胀构件。 更具体地说,提供了至少包含由以下通式(1)表示的氧化物的热膨胀抑制构件和包括在20℃具有正线性膨胀系数的金属的抗热膨胀性构件, 和包含至少一种由以下通式(1)表示的氧化物的固体,金属和固体彼此连接:(Bi1-xMx)NiO3(1)其中M表示选自以下的至少一种金属: 的La,Pr,Nd,Sm,Eu,Gd,Tb,Dy,Ho,Er,Tm,Yb,Lu,Y和In; x表示数值为0.02≦̸ x≦̸ 0.15。
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