摘要:
A thermosettable epoxy resin composition comprising 100 parts by weight of an epoxy resin, 5 to 40 parts by weight of polysulfone resin having both a resorcinol moiety and 4,4'-dichlorodiphenylsulfone moiety in the molecular chain, and an effective amount of a curing agent, which gives a cured product excellent in toughness as well as in curability, adhesion, mechanical strength at high temperatures and resistance to chemicals.
摘要:
A low viscosity epoxy resin, i.e., a low viscosity polyglycidyl derivative, of an aminophenol having at least one alkyl group on its aromatic ring of which viscosity is 15 poises or below as measured at 25.degree. C., a resin composition containing said resin, and a fiber-reinforced composite material containing as matrix a cured product of said epoxy resin composition and a fiber as reinforcing material.
摘要:
A low viscosity epoxy resin, i.e., a low viscosity polyglycidyl derivative, of an aminophenol having at least one alkyl group on its aromatic ring of which viscosity is 15 poises or below as measured at 25.degree. C., a resin composition containing said resin, and a fiberreinforced composite material containing as matrix a cured product of said epoxy resin composition and a fiber as reinforcing material.
摘要:
A fiber-reinforced composite material superior in mechanical strength, heat resistance and hot water resistance is provided herein. This composite material is composed of a matrix of a cured product of a resin composition containing as essential components an epoxy resin (A) and an imide compound (B) represented by the following general formula (I), ##STR1## wherein X represents --NH.sub.2 group and/or --OH group, Ar represents an aromatic residue, R.sub.1 represents a hydrogen atom or an alkyl group having from 1 to 10 carbon atoms, R.sub.2 represents a hydrogen atom, an alkyl or alkoxy group having from 1 to 20 carbon atoms or a hydroxyl group, and each of m and n cannot be 0 at the same time, and a fiber (C) as a reinforcing material.
摘要:
An epoxy resin composition comprising (A) an epoxy resin having three or more epoxy groups per a molecule and (B) a reactive oligomer having in its molecule an aromatic residue connected thereto by --O-- or --S-- linkage and having at the terminal of the molecule a phonolic hydroxyl group.
摘要:
A bipedal robot of the present invention has a trunk consisting of an upper trunk and a lower trunk which are rotatable around a rotation axis relative to one another. The upper trunk has shoulders on the right and left sides. An arm is provided at each shoulder. A pair of right and left legs is attached to lower ends of the lower trunk. A storage battery is mounted to the back of the upper trunk, positioned within a shoulder width. The storage battery is positioned below the top of a head mounted on the upper trunk. When the robot walks a narrow passage or corridor having a width slightly larger than the width thereof, for example, this arrangement prevents the storage battery from interfering with the passage or the like.
摘要:
The invention provides an imide compound represented by the general formula (I), ##STR1## wherein X represents a hydroxyl or amino group, Ar.sub.1 and Ar.sub.2 independently represent an aromatic residue, R.sub.1 represents a hydrogen atom or a C.sub.1 -C.sub.10 alkyl group, R.sub.2 represents a hydrogen atom, a C.sub.1 -C.sub.20 alkyl or alkoxy group or a hydroxyl group, and n represents a number of from 0 to 6, and also provides an epoxy resin composition containing the imide compound (B) and epoxy resins (A) as essential components.
摘要:
A composition comprising an epoxy resin having at least two epoxy groups in the molecule and a hardener selected from the group consisting of (1) a resorcinol novolak having an unreacted resorcinol content of 10% by weight or less, (2) a mixed novolak of a resorcinol novolak and a monohydric phenol novolak having a total unreacted resorcinol and monohydric phenol content of 8% by weight or less, and (3) a resorcinol/monohydric phenol polycondensation novolak having a polycondensed resorcinol content of 30 mole % or more and a total unreacted resorcinol and monohydric phenol content of 8% by weight or less.The composition is useful for moldings, laminates, paints, and adhesives with excellent thermal resistance, durability and electrical characteristics.
摘要:
A thermosetting resin composition comprising (i) a polymaleimide compound having at least two maleimide groups in the molecule and (ii) an s-triazine compound having at least two alkenylaryloxy groups in the molecule; a resin-composition for encapsulant comprising said polymaleimide compound, said traizine compound, and an inorganic filler as essential components; and said s-triazine compound.
摘要:
The invention provides an imide compound represented by the general formula (I), ##STR1## wherein X represents a hydroxyl or amino group, Ar.sub.1 and Ar.sub.2 independently represent an aromatic residue, R.sub.1 represents a hydrogen atom or a C.sub.1 -C.sub.10 alkyl group, R.sub.2 represents a hydrogen atom, a C.sub.1 -C.sub.20 alkyl or alkoxy group or a hydroxyl group, and n represents a number of from 0 to 6, and also provides an epoxy resin composition containing the imide compound (B) and epoxy resins (A) as essential components.