摘要:
The present invention provides a flip chip mounting substrate which comprises an electronic circuit composed of a circuit line and plural mounting pads connected to both ends of the circuit line formed on one surface of a base sheet, wherein the plural mounting pads are faced each other and spaced a pad clearance gap apart, and one or more semiconductor mounting paste guide paths are formed in the mounting pads. The flip chip mounting substrate can reduce voids that might be produced in the semiconductor mounting paste, when flip-chip-mounting an IC chip on a flip chip mounting substrate.
摘要:
The present invention provides a flip chip mounting substrate which comprises an electronic circuit composed of a circuit line and plural mounting pads connected to both ends of the circuit line formed on one surface of a base sheet, wherein the plural mounting pads are faced each other and spaced a pad clearance gap apart, and one or more semiconductor mounting paste guide paths are formed in the mounting pads. The flip chip mounting substrate can reduce voids that might be produced in the semiconductor mounting paste, when flip-chip-mounting an IC chip on a flip chip mounting substrate.
摘要:
The present invention discloses:an IC inlet 110 which comprises a substrate 2, a surface circuit including a plain coil circuit portion 6 formed on the substrate and opposed electrodes 8 and 12 individually connected with the two ends of the plain coil circuit portion 6, and an IC chip 16 mounted in connection with the opposed electrodes, wherein a cut-away broken line 22 formed in at least a portion of the surface circuit so as to pass through the substrate and the surface circuit, and IC tag which is produced by the use of the IC inlet.
摘要:
The present invention provides an IC tag which has a structure comprising a first adhesive layer laminated on a surface of a substrate sheet, an electronic circuit containing a circuit line having a bypass line and an IC chip connecting to the electronic circuit which are formed on a surface of the first adhesive layer, a second adhesive layer laminated for covering the electronic circuit and the IC chip, and a release agent layer formed partly at the position corresponding to a circuit section consisting of the electronic circuit and the IC chip and located at the interface between the substrate sheet and the first adhesive layer, wherein the angle formed by the tangent of the bypass line at the connection between the bypass line and the circuit line and the tangent of the circuit line at the connection is 10 degree or greater. When the IC tag attached to an article is peeled off, the built-in electronic circuit is surely broken.
摘要:
To present the ID tag including flat coil component, and characteristic adjusting method of ID tag capable of suppressing product fluctuations about the desired characteristic. The flat coil component of the ID tag of the invention comprises a flat coil composed of a conductive material provided continuously and spirally on an insulating substrate, and a jumper disposed on the flat coil with insulation, from one of inner end or outer end of this flat coil to the outside or inside of the flat coil where other end is positioned, in which the jumper is composed of a plurality of jumpers variable in the number of pieces in arrangement. The characteristic is adjusted by varying the number of effective pieces for forming the parallel arrangement.
摘要:
The present invention discloses: an IC inlet 110 which comprises a substrate 2, a surface circuit including a plain coil circuit portion 6 formed on the substrate and opposed electrodes 8 and 12 individually connected with the two ends of the plain coil circuit portion 6, and an IC chip 16 mounted in connection with the opposed electrodes, wherein a cut-away broken line 22 formed in at least a portion of the surface circuit so as to pass through the substrate and the surface circuit, and IC tag which is produced by the use of the IC inlet.
摘要:
The present invention provides an IC tag which has a structure comprising a first adhesive layer laminated on a surface of a substrate sheet, an electronic circuit containing a circuit line having a bypass line and an IC chip connecting to the electronic circuit which are formed on a surface of the first adhesive layer, a second adhesive layer laminated for covering the electronic circuit and the IC chip, and a release agent layer formed partly at the position corresponding to a circuit section consisting of the electronic circuit and the IC chip and located at the interface between the substrate sheet and the first adhesive layer, wherein the angle formed by the tangent of the bypass line at the connection between the bypass line and the circuit line and the tangent of the circuit line at the connection is 10 degree or greater. When the IC tag attached to an article is peeled off, the built-in electronic circuit is surely broken.
摘要:
A light transmissible solar cell module including: solar cell units, which include a transparent substrate, a mirror electrode layer provided on a part of a surface of the transparent substrate, and a solar cell section provided on the mirror electrode layer, arranged in multi-levels; a first connecting wire electrically connected to an electrode provided on a surface side of the solar cell section; and a second connecting wire electrically connected to the mirror electrode layer, wherein the solar cell units are arranged so that a light entering from one side hits the solar cell section of an arbitrary solar cell unit and is reflected, and the reflected light reaches another side by being reflected by the mirror electrode layer of a solar cell unit arranged adjacent to the arbitrary solar cell unit.
摘要:
Provided are a phosphorescent material which is excellent in horizontal orientation and the like when a thin film is formed, a process for efficiently producing the phosphorescent material, and a light emitting element using the phosphorescent material.The present invention provides a phosphorescent material represented by the following general formula (1), a process for producing the phosphorescent material, and a light emitting element using the phosphorescent material, wherein the phosphorescent material has a straight-chain conjugated structure, a 2-phenylpyridine ligand, a central metal and a β-diketone-type ligand, In the general formula (1), end substituents R1 and R2 each is a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or the like, substituents a to l and o to s each is a hydrogen atom or the like, the central metal M is platinum or the like, and repetition numbers m and n each is an integer of 0 to 4.
摘要:
A light transmissible solar cell module including: solar cell units, which include a transparent substrate, a minor electrode layer provided on a part of a surface of the transparent substrate, and a solar cell section provided on the minor electrode layer, arranged in multi-levels; a first connecting wire electrically connected to an electrode provided on a surface side of the solar cell section; and a second connecting wire electrically connected to the mirror electrode layer, wherein the solar cell units are arranged so that a light entering from one side hits the solar cell section of an arbitrary solar cell unit and is reflected, and the reflected light reaches another side by being reflected by the minor electrode layer of a solar cell unit arranged adjacent to the arbitrary solar cell unit.