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1.发明申请SURFACE-MOUNTED ANTENNA, ANTENNA DEVICE USING THE SAME, AND RADIO COMMUNICATION EQUIPMENT 失效表面安装天线，使用该天线的天线设备和无线电通信设备公开(公告)号：US20100103057A1
公开(公告)日：2010-04-29
申请号：US12607229
申请日：2009-10-28
CPC分类号： H01Q1/38 , H01Q1/243 , H01Q1/521 , H01Q9/0407 , H01Q21/28
摘要： A surface-mounted antenna has a base having a substantially rectangular parallelepiped shape, an antenna element formed on the surface of the base and having a first radiation electrode subjected to direct power supply, and an antenna element formed on the surface of the base and having a radiation electrode subjected to capacitive coupling power supply. With this, the smaller surface-mounted antenna of a combo antenna type can be provided.
摘要翻译： 表面安装天线具有基本上具有大致长方体形状的基座，天线元件形成在基座的表面上并具有经受直接供电的第一辐射电极，天线元件形成在基座的表面上，并具有 经受电容耦合电源的辐射电极。 因此，可以提供组合天线类型的较小的表面安装天线。
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2.发明授权Surface-mounted antenna, antenna device using the same, and radio communication equipment 失效表面安装天线，使用其的天线装置和无线电通信设备公开(公告)号：US08384598B2
公开(公告)日：2013-02-26
申请号：US12607229
申请日：2009-10-28
IPC分类号： H01Q1/24
CPC分类号： H01Q1/38 , H01Q1/243 , H01Q1/521 , H01Q9/0407 , H01Q21/28
摘要： A surface-mounted antenna has a base having a substantially rectangular parallelepiped shape, an antenna element formed on the surface of the base and having a first radiation electrode subjected to direct power supply, and an antenna element formed on the surface of the base and having a radiation electrode subjected to capacitive coupling power supply. With this, the smaller surface-mounted antenna of a combo antenna type can be provided.
摘要翻译： 表面安装天线具有基本上具有大致长方体形状的基座，天线元件形成在基座的表面上并具有经受直接供电的第一辐射电极，天线元件形成在基座的表面上，并具有 经受电容耦合电源的辐射电极。 因此，可以提供组合天线类型的较小的表面安装天线。
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公开(公告)号：US09225057B2
公开(公告)日：2015-12-29
申请号：US13637836
申请日：2011-03-30
CPC分类号： H01Q1/38 , H05K1/0243 , H05K2201/10098
摘要： An antenna device includes an antenna element 10 and a printed circuit board 20 on which the antenna element 10 is mounted. The antenna element 10 includes a base 11 which is made of a dielectric material and a radiation conductor formed on at least one surface of the base 11. The printed circuit board 20 includes ground clearance region 23a having substantially a rectangular shape and having one side contacting an edge of the printed circuit board and other three sides surrounded by an edge line of a ground pattern, an antenna mounting region 27 provided within the ground clearance region 23a, and at least one frequency adjusting element 30 provided within the ground clearance region 27. The frequency adjusting element 30 is provided on the far side of the antenna mounting region 27 as viewed from an edge 20e of the printed circuit board 20.
摘要翻译： 天线装置包括天线元件10和安装有天线元件10的印刷电路板20。 天线元件10包括由介电材料制成的基座11和形成在基座11的至少一个表面上的辐射导体。印刷电路板20包括具有大致矩形形状并具有一侧接触的接地间隙区域23a 印刷电路板的边缘和由接地图案的边缘线包围的其他三个边缘，设置在接地间隙区域23a内的天线安装区域27和设置在接地间隙区域27内的至少一个频率调节元件30。 从印刷电路板20的边缘20e观察，频率调整元件30设置在天线安装区域27的远侧。
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公开(公告)号：US20130088398A1
公开(公告)日：2013-04-11
申请号：US13637836
申请日：2011-03-30
IPC分类号： H01Q1/38
CPC分类号： H01Q1/38 , H05K1/0243 , H05K2201/10098
摘要： An antenna device includes an antenna element 10 and a printed circuit board 20 on which the antenna element 10 is mounted. The antenna element 10 includes a base 11 which is made of a dielectric material and a radiation conductor formed on at least one surface of the base 11. The printed circuit board 20 includes ground clearance region 23a having substantially a rectangular shape and having one side contacting an edge of the printed circuit board and other three sides surrounded by an edge line of a ground pattern, an antenna mounting region 27 provided within the ground clearance region 23a, and at least one frequency adjusting element 30 provided within the ground clearance region 27. The frequency adjusting element 30 is provided on the far side of the antenna mounting region 27 as viewed from an edge 20e of the printed circuit board 20.
摘要翻译： 天线装置包括天线元件10和安装有天线元件10的印刷电路板20。 天线元件10包括由介电材料制成的基座11和形成在基座11的至少一个表面上的辐射导体。印刷电路板20包括具有大致矩形形状并具有一侧接触的接地间隙区域23a 印刷电路板的边缘和由接地图案的边缘线包围的其他三个边缘，设置在接地间隙区域23a内的天线安装区域27和设置在接地间隙区域27内的至少一个频率调节元件30。 从印刷电路板20的边缘20e观察，频率调节元件30设置在天线安装区域27的远侧。
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公开(公告)号：US20110133993A1
公开(公告)日：2011-06-09
申请号：US12963083
申请日：2010-12-08
IPC分类号： H01Q1/38
CPC分类号： H01Q9/0421 , H01Q1/2283 , H01Q1/2291 , H01Q1/243 , H01Q1/38 , H01Q9/0457
摘要： A radiation electrode 132 is printed on the upper surface of the dielectric body, side surface thereof, and bottom surface thereof in a folded configuration. A feeding electrode 130 and ground electrode 134 are printed on the bottom surface of the antenna elements 124. The feeding electrode 130 and radiation electrode 132 on the upper surface are opposed to each other as parallel planes. The ground electrode 134 and radiation electrode 132 are also opposite to each other as parallel planes. No electrode is formed on one of the side surfaces of the antenna element 124 that is opposed to the side surface at the side of which the radiation electrode 132 is folded.
摘要翻译： 辐射电极132以折叠的形式印刷在电介质体的上表面，其侧表面和底表面上。 馈电电极130和接地电极134印刷在天线元件124的底表面上。上表面上的馈电电极130和辐射电极132彼此相对平行。 接地电极134和辐射电极132也是彼此相对的平行平面。 在天线元件124的与辐射电极132折叠侧面的侧面相对的一个侧面上没有形成电极。
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公开(公告)号：US08525732B2
公开(公告)日：2013-09-03
申请号：US12963083
申请日：2010-12-08
IPC分类号： H01Q1/38
CPC分类号： H01Q9/0421 , H01Q1/2283 , H01Q1/2291 , H01Q1/243 , H01Q1/38 , H01Q9/0457
摘要： A radiation electrode 132 is printed on the upper surface of the dielectric body, side surface thereof, and bottom surface thereof in a folded configuration. A feeding electrode 130 and ground electrode 134 are printed on the bottom surface of the antenna elements 124. The feeding electrode 130 and radiation electrode 132 on the upper surface are opposed to each other as parallel planes. The ground electrode 134 and radiation electrode 132 are also opposite to each other as parallel planes. No electrode is formed on one of the side surfaces of the antenna element 124 that is opposed to the side surface at the side of which the radiation electrode 132 is folded.
摘要翻译： 辐射电极132以折叠的形式印刷在电介质体的上表面，其侧表面和底表面上。 馈电电极130和接地电极134印刷在天线元件124的底表面上。上表面上的馈电电极130和辐射电极132彼此相对平行。 接地电极134和辐射电极132也是彼此相对的平行平面。 在天线元件124的与辐射电极132折叠侧面的侧面相对的一个侧面上没有形成电极。
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公开(公告)号：US08421679B2
公开(公告)日：2013-04-16
申请号：US12715887
申请日：2010-03-02
申请人： Kei Suzuki , Masaki Matsushima , Naoaki Utagawa , Tetsuya Shibata
发明人： Kei Suzuki , Masaki Matsushima , Naoaki Utagawa , Tetsuya Shibata
IPC分类号： H01Q1/38
CPC分类号： H01Q1/38 , H01Q1/243 , H01Q9/0421 , H01Q9/045
摘要： An antenna device includes an antenna element and a printed circuit board on which the antenna element is mounted. The antenna element includes a base, a radiation conductor formed on an upper surface of the substrate and one end of the radiation conductor being an open end, a plurality of terminal electrodes formed on a bottom surface of the substrate, and a loop conductor of a substantially U-shape. The loop conductor is arranged to face one of the terminal electrodes via a gap having a predetermined width. An antenna mounting region is provided on a upper surface of the printed circuit board to be adjacent to an edge of a long side of the printed circuit board. A feed line is led in the antenna mounting region along the edge. One and the other end of the loop conductor are connected to the feed line and a ground pattern, respectively.
摘要翻译： 天线装置包括天线元件和安装天线元件的印刷电路板。 天线元件包括基底，形成在基底的上表面上的辐射导体，辐射导体的一端是开口端，形成在基底的底表面上的多个端子电极和 大致U形。 环形导体被布置为经由具有预定宽度的间隙面对一个端子电极。 在印刷电路板的上表面设置有与印刷电路板的长边的边缘相邻的天线安装区域。 馈电线沿着边缘被引导到天线安装区域中。 环形导体的一端和另一端分别连接到馈电线和接地图案。
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公开(公告)号：US20100225542A1
公开(公告)日：2010-09-09
申请号：US12715887
申请日：2010-03-02
申请人： Kei SUZUKI , Masaki Matsushima , Naoaki Utagawa , Tetsuya Shibata
发明人： Kei SUZUKI , Masaki Matsushima , Naoaki Utagawa , Tetsuya Shibata
IPC分类号： H01Q1/38
CPC分类号： H01Q1/38 , H01Q1/243 , H01Q9/0421 , H01Q9/045
摘要： An antenna device includes an antenna element and a printed circuit board on which the antenna element is mounted. The antenna element includes a base, a radiation conductor formed on an upper surface of the substrate and one end of the radiation conductor being an open end, a plurality of terminal electrodes formed on a bottom surface of the substrate, and a loop conductor of a substantially U-shape. The loop conductor is arranged to face one of the terminal electrodes via a gap having a predetermined width. An antenna mounting region is provided on a upper surface of the printed circuit board to be adjacent to an edge of a long side of the printed circuit board. A feed line is led in the antenna mounting region along the edge. One and the other end of the loop conductor are connected to the feed line and a ground pattern, respectively.
摘要翻译： 天线装置包括天线元件和安装天线元件的印刷电路板。 天线元件包括基底，形成在基底的上表面上的辐射导体，辐射导体的一端是开放端，形成在基底的底表面上的多个端电极，以及环形导体 大致U形。 环形导体被布置为经由具有预定宽度的间隙面对一个端子电极。 在印刷电路板的上表面设置有与印刷电路板的长边的边缘相邻的天线安装区域。 馈电线沿着边缘被引导到天线安装区域中。 环形导体的一端和另一端分别连接到馈电线和接地图案。
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9.发明授权Semiconductor device producing apparatus and producing method of semiconductor device 有权半导体装置的制造装置及半导体装置的制造方法公开(公告)号：US07198447B2
公开(公告)日：2007-04-03
申请号：US10360597
申请日：2003-02-06
申请人： Kazuhiro Morimitsu , Tatsuhisa Matsunaga , Masanori Kaneko , Kouichi Noto , Hidehiro Yanagawa , Masaki Matsushima
发明人： Kazuhiro Morimitsu , Tatsuhisa Matsunaga , Masanori Kaneko , Kouichi Noto , Hidehiro Yanagawa , Masaki Matsushima
IPC分类号： H01L21/677 , B65B21/02 , B65B69/00 , B65G65/34
CPC分类号： H01L21/67757 , Y10S414/137 , Y10S414/139
摘要： A semiconductor device producing apparatus is disclosed. The apparatus includes a carrier-holding stage for placing a carrier; first, second and third stages each for holding first and second boats one at a time, each boat holding one or more substrates; a boat transfer mechanism for transferring the boats among the first, second and third stages; and a substrate transfer mechanism for transferring the substrate(s) from the carrier to the boat held by the first stage. A controller controls the first stage, the boat transfer mechanism and the substrate transfer mechanism so that the boat transfer mechanism transfers one of the boats from the second stage to the first stage, the substrate transfer mechanism then transfers the substrate(s) from the carrier to the boat held by the first stage, and the first stage then moves the boat into the processing chamber for processing.
摘要翻译： 公开了一种半导体器件制造装置。 该装置包括用于放置载体的载体保持台; 第一，第二和第三阶段各自用于一次一个地保持第一和第二船，每个船保持一个或多个基底; 在第一，第二和第三阶段转运船只的船只转运机构; 以及用于将基板从载体转移到由第一级保持的船的基板传送机构。 控制器控制第一阶段，船只传送机构和基板传送机构，使得船只传送机构将其中一个船从第二阶段转移到第一阶段，然后基板传送机构将载体从载体 到第一阶段所持有的船，然后第一阶段将船移动到处理室中进行处理。
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