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公开(公告)号：US20060267494A1
公开(公告)日：2006-11-30
申请号：US11439655
申请日：2006-05-24
申请人： Yasumitsu Tomita , Yutaka Unno
发明人： Yasumitsu Tomita , Yutaka Unno
IPC分类号： H01J61/24
CPC分类号： H01J37/32082 , H01J37/32577
摘要： To provide a plasma processing device in which an amount of heat generated from a power supply member is small when the power supply member is supplied with high frequency current. A substrate heater as the plasma processing device includes a ceramic base including a high frequency electrode and a high frequency electrode power supply member supplying high frequency current to the high frequency electrode. The high frequency electrode power supply member includes a power supply body and a high conductivity metal layer which is formed on the outer peripheral surface of the power supply body and has a conductivity higher than that of the power supply body.
摘要翻译： 提供一种等离子体处理装置，其中当电源构件被供应高频电流时，从电源构件产生的热量小。 作为等离子体处理装置的基板加热器包括具有高频电极的陶瓷基体和向高频电极供给高频电流的高频电极电源部件。 高频电极电源构件包括电源体和形成在电源主体的外周面上的导电性高的导电性金属层，其导电率高于供电体的导电率。
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公开(公告)号：US20060219176A1
公开(公告)日：2006-10-05
申请号：US11375815
申请日：2006-03-15
申请人： Yasumitsu Tomita , Yutaka Unno
发明人： Yasumitsu Tomita , Yutaka Unno
IPC分类号： C23C16/00
CPC分类号： H01L21/67109 , H01L21/67103 , H01L21/68792 , H05B3/143
摘要： A processing device includes a base which holds a processing target. In the base, a gas providing passage circular in cross section, which provides gas to an outer circumference of the base, is formed.
摘要翻译： 处理装置包括保持处理对象的基座。 在基座中形成有将气体提供到基座的外周的横截面为圆形的气体供给通路。
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公开(公告)号：US07632356B2
公开(公告)日：2009-12-15
申请号：US11374529
申请日：2006-03-13
申请人： Yasumitsu Tomita , Yutaka Unno
发明人： Yasumitsu Tomita , Yutaka Unno
IPC分类号： C23C16/455 , C23C16/458 , H01L21/306
CPC分类号： H01L21/68735 , H01L21/67017
摘要： A gas providing member includes a body portion which forms a gas providing passage between the body portion and a processing member which holds the processing target, and the gas providing passage provides gas onto a processing target. In the body portion, a gas reservoir portion located in the gas providing passage is formed.
摘要翻译： 气体供给构件包括主体部分，其在主体部分和保持加工对象物的处理部件之间形成气体提供通道，并且气体供给通道将气体提供到加工对象上。 在主体部分中，形成位于气体供给通道中的气体储存部。
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公开(公告)号：US20060207509A1
公开(公告)日：2006-09-21
申请号：US11374529
申请日：2006-03-13
申请人： Yasumitsu Tomita , Yutaka Unno
发明人： Yasumitsu Tomita , Yutaka Unno
IPC分类号： C23C16/00
CPC分类号： H01L21/68735 , H01L21/67017
摘要： A gas providing member includes a body portion which forms a gas providing passage between the body portion and a processing member which holds the processing target, and the gas providing passage provides gas onto a processing target. In the body portion, a gas reservoir portion located in the gas providing passage is formed.
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公开(公告)号：US08394199B2
公开(公告)日：2013-03-12
申请号：US11375815
申请日：2006-03-15
申请人： Yasumitsu Tomita , Yutaka Unno
发明人： Yasumitsu Tomita , Yutaka Unno
IPC分类号： C23C16/00
CPC分类号： H01L21/67109 , H01L21/67103 , H01L21/68792 , H05B3/143
摘要： A processing device is provided, including a base which holds a processing target. A gas providing passage having a circular cross section is formed in the base, and provides gas to an outer circumference of the base.
摘要翻译： 提供一种处理装置，包括保持处理目标的基座。 在基座上形成具有圆形横截面的气体供给通道，并向基体的外周提供气体。
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公开(公告)号：US07560668B2
公开(公告)日：2009-07-14
申请号：US11443703
申请日：2006-05-31
申请人： Yasumitsu Tomita , Yutaka Unno
发明人： Yasumitsu Tomita , Yutaka Unno
CPC分类号： H01L21/67103 , H01J37/32009 , H01J37/32541 , H01J37/3255 , H01J37/32724 , H01J2237/2001 , H01L21/00
摘要： A substrate processing device is provided, which includes a resistance heating element and a high-frequency electrode, to which a voltage is applied, a power supply member for a resistance heating element, and a power supply member for a high-frequency electrode, which supply power to the resistance heating element and the high-frequency electrode, respectively, a peripheral member disposed close to circumferences of the power supply members, and heat insulators arranged between the power supply members and the peripheral member and having heat resistance to a temperature at least higher than 250° C.
摘要翻译： 提供了一种基板处理装置，其包括施加电压的电阻加热元件和高频电极，用于电阻加热元件的电源部件和用于高频电极的电源部件，其中 分别向电阻加热元件和高频电极供电，靠近供电元件的周围设置的周边元件，以及布置在电源元件和周边元件之间的热绝缘体，并且具有耐热性 最低250°C
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公开(公告)号：US20060280875A1
公开(公告)日：2006-12-14
申请号：US11443703
申请日：2006-05-31
申请人： Yasumitsu Tomita , Yutaka Unno
发明人： Yasumitsu Tomita , Yutaka Unno
IPC分类号： C08J7/18
CPC分类号： H01L21/67103 , H01J37/32009 , H01J37/32541 , H01J37/3255 , H01J37/32724 , H01J2237/2001 , H01L21/00
摘要： Disclosed is a substrate processing device capable of reducing damage of a peripheral member when a power supply member generates heat. The substrate processing device includes: a resistance heating element and a high-frequency electrode, to which a voltage is applied; a power supply member for a resistance heating element, and a power supply member for a high-frequency electrode, which supply power to the resistance heating element and the high-frequency electrode, respectively; a peripheral member disposed close to circumferences of these power supply members; and heat insulators arranged between the power supply members and the peripheral member and having heat resistance to a temperature at least higher than 250° C.
摘要翻译： 公开了一种能够在供电部件发热的同时减少周边部件的损伤的基板处理装置。 基板处理装置包括：施加电压的电阻加热元件和高频电极; 用于电阻加热元件的电源部件和用于分别向电阻加热元件和高频电极供电的高频电极用电源部件; 靠近这些电源部件的周边设置的周边部件; 以及布置在电源构件和周边构件之间并具有至少高于250℃的温度的耐热性的绝热体。
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公开(公告)号：US20050210974A1
公开(公告)日：2005-09-29
申请号：US11059576
申请日：2005-02-16
申请人： Yutaka Unno , Yoshinobu Goto , Taiji Kiku
发明人： Yutaka Unno , Yoshinobu Goto , Taiji Kiku
IPC分类号： H05B3/06 , G01F1/68 , H01L21/00 , H01L21/02 , H01L21/205 , H01L21/3065 , H01S4/00 , H05B3/10 , H05B3/74
CPC分类号： H01L21/67103 , Y10T29/49002 , Y10T29/49083 , Y10T29/49085 , Y10T29/49087 , Y10T29/49096 , Y10T29/49098
摘要： A manufacturing method for a substrate heating device comprises forming a base plate having a substrate heating surface in which a resistance heating element is buried, forming a tubular member, joining the tubular member to the base plate, measuring temperature distribution in the substrate heating surface by supplying power to the resistance heating element, and grinding the tubular member according to a grinding condition based on a measurement result of the temperature distribution.
摘要翻译： 一种基板加热装置的制造方法，其特征在于，形成具有基板加热面的基板，所述基板加热面埋设有电阻加热元件，形成管状部件，将所述管状部件与所述基板接合，测定所述基板加热面的温度分布， 向电阻加热元件供电，并且根据温度分布的测量结果根据研磨条件研磨管状构件。
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公开(公告)号：US06875960B2
公开(公告)日：2005-04-05
申请号：US10244986
申请日：2002-09-17
CPC分类号： H01L21/67103
摘要： A heating system 25 has a main electric heat-generating element 3 and a heating surface 4a for heating an object, auxiliary electric heat-generating elements 5A to 5D, and a main power source 1 for supplying power to the main heating element. The system 25 further has an auxiliary power source 2 for supplying power to the auxiliary heating elements, and a power source controller for controlling the power supplied to the main heating element and to the auxiliary heating elements respectively and independently. Power supplied to the main heating element 3 is controlled by the controller within a first power range and power supplied to the auxiliary heating elements is controlled by the controller within a second power range. The second power range has a width smaller than that of the first power range so as to control temperature distribution on the heating surface 4a.
摘要翻译： 加热系统25具有主电热元件3和用于加热物体的加热面4a，辅助发热元件5A至5D和用于向主加热元件供电的主电源1。 系统25还具有用于向辅助加热元件供电的辅助电源2和分别独立地控制供给主加热元件和辅助加热元件的电力的电源控制器。 供给主加热元件3的电力由控制器在第一功率范围内控制，并且供给辅助加热元件的功率由控制器在第二功率范围内控制。 第二功率范围的宽度小于第一功率范围的宽度，以便控制加热表面4a上的温度分布。
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公开(公告)号：US08193473B2
公开(公告)日：2012-06-05
申请号：US12366733
申请日：2009-02-06
申请人： Yutaka Unno
发明人： Yutaka Unno
CPC分类号： H05B3/143 , H01L21/67103 , H01L21/68735
摘要： A heating unit includes: a base having an upper surface; a first heating element buried in an upper part of the base, the upper part including the upper surface, the first heating element having a flat shape almost parallel to the upper surface; and a second heating element buried in a lower part of the base and arranged in a location lower than the first heating element with respect to the upper surface, the lower part being joined to the upper part, and the second heating element having a flat shape. First and second projection patterns have an overlapping portion where the first projection pattern and the second projection pattern partially overlap each other, the first projection pattern representing the first heating element projected on the upper surface of the base, and the second projection pattern representing the second heating element projected the upper surface of the base.
摘要翻译： 加热单元包括：具有上表面的基座; 第一加热元件埋设在基座的上部，上部包括上表面，第一加热元件具有几乎平行于上表面的平坦形状; 以及第二加热元件，所述第二加热元件埋设在所述基座的下部，并且相对于所述上表面配置在比所述第一加热元件低的位置，所述下部与所述上部接合，所述第二加热元件具有平坦形状 。 第一和第二投影图案具有重叠部分，其中第一投影图案和第二投影图案部分地彼此重叠，表示第一加热元件的第一投影图案投影在基座的上表面上，第二投影图案表示第二投影图案 加热元件投影到底座的上表面。
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