摘要:
The present invention provides a positive photosensitive resin composition, including an alkali soluble phenolic resin; an alkali soluble acrylic resin; and a photosensitive compound having quinone diazide. The positive photosensitive resin composition is applicable to a semi-additive process for forming tiny and fine wirings.
摘要:
A developer composition with low metal corrosiveness is provided. The developer composition includes 1 to 10 weight parts of tetraalkylammonium hydroxide; 0.01 to 3 weight parts of a metal corrosion inhibiting agent; 0.1 to 5 weight parts of a pH control agent; 0.1 to 5 weight parts of a surfactant; and water in balance. The developer composition of the present invention has a metal corrosion prevents corrosiveness to metals such as aluminum and copper during a resist development.
摘要:
A detergent composition is disclosed, which comprises: (A) an alkali metal hydroxyl compound in an amount of 0.1 to 20 parts by weight; (B) a nonionic surfactant represented by the following formula (I) in an amount of 0.1 to 30 parts by weight: wherein R1 is hydrogen or methyl; R2 is hydrogen or methyl; n is an integer from 0 to 10; and m is an integer from 4 to 20; (C) an anionic surfactant in an amount of 0.1 to 10 parts by weight; (D) a chelating agent in an amount of 0.1 to 20 parts by weight; (E) an additive in an amount of 0.1 to 20 parts by weight; and (F) water of remaining parts based on 100 parts by weight of the detergent composition.
摘要:
The present invention relates to a polymerizable water-soluble or alcohol-soluble ultraviolet absorber, which is represented by the following formula (I): wherein R1 is H or C1˜5 alkyl; R2 is H, Cl, Br or I; R3 is H or methyl; and m each is an integer in the range from 3 to 12. The above-mentioned compounds are suitable for copolymerizing with one or more monomers to form copolymers so that the UV-light resistance of the copolymer can be efficiently promoted. For example, the polymer made by copolymerizing the above-mentioned compound with acrylate monomers can be applied to the production of optical medical materials, especially contact lenses or intraocular lenses.
摘要:
The present invention relates to a polymerizable water-soluble or alcohol-soluble ultraviolet absorber, which is represented by the following formula (I): wherein R1 is H or C1˜5 alkyl; R2 is H, Cl, Br or I; R3 is H or methyl; and m each is an integer in the range from 3 to 12. The above-mentioned compounds are suitable for copolymerizing with one or more monomers to form copolymers so that the UV-light resistance of the copolymer can be efficiently promoted. For example, the polymer made by copolymerizing the above-mentioned compound with acrylate monomers can be applied to the production of optical medical materials, especially contact lenses or intraocular lenses.
摘要:
The present invention provides a positive-tone photosensitivity resin composition comprising (A) an alkali-soluble acrylic resin, the alkali-soluble acrylic resin containing at least one structure unit selected from the group consisting of the following structure unit (1), structure unit (2), and structure unit (3), wherein R1, R2, R3, R4, R5, R, U, V, X, Y and Z are defined the same as the specification; (B) a naphthoquinone-diazide group containing compound; and (C) an solvent, the solvent is selected from the group consisting of ethers, ketones, esters, aromatic hydrocarbons and acetoacetates.
摘要:
A chemical amplified photoresist composition comprising a photosensitive polymer containing the following structure unit of formula (II): Wherein R is hydrogen or C1-C4 alkyl group; R′ is C1-C4 alkyl group; n is an integer of 2, 3, 4, 5 or 6. This chemical amplified photoresist composition can be applied to general lithography processes, especially in 193 nm lithography and the patterns formed from the photoresist exhibit excellent resolution and photosensitivity.
摘要:
A positive photoresist composition comprising a polymer, a photoactived agent and an dissolution inhibitor represented by the following formula (1): wherein R1 and R2 each independently is a hydroxyl group, a C1-8 hydroxyalkyl group, or a C3-8 hydroxycycloalkyl group; R3, R4 and R5 each independently is a hydrogen, a C1-8 hydroxyalkyl group, a C1-6 carboxylic acid or a C3-8 carboxylic acid ester; k is an integer of 0, 1, 2, 3, 4, 5 or 6. The photoresist composition has high transparency to deep UV light and is capable of forming good fine patterns, roughness and high sensitivity, thus being useful as a chemically amplified type resist when exposed to deep UV light from an KrF and ArF excimer laser.
摘要翻译:一种正型光致抗蚀剂组合物,其包含聚合物,光活化剂和由下式(1)表示的溶解抑制剂:其中R1和R2各自独立地为羟基,C1-8羟基烷基或C3-8羟基环烷基; R 3,R 4和R 5各自独立地为氢,C 1-8羟基烷基,C 1-6羧酸或C 3-8羧酸酯; k为0,1,2,3,4,5或6的整数。光致抗蚀剂组合物对深紫外光具有高透明度,并且能够形成良好的精细图案,粗糙度和高灵敏度,因此可用作化学放大 当暴露于来自KrF和ArF准分子激光器的深紫外光下时,抗蚀剂。
摘要:
The present invention relates to a silicone containing encapsulant composition. One embodiment of the encapsulant composition comprises (a) 30˜60 weight % of an epoxy resin; (b) 30˜60 weight % of an acid anhydride curing agent; (c) 0.1˜30 weight % of a Carbinol function silicone resin which can form a homogeneous mixture with (a) and (b) described above; and (d) 0.1˜5 weight % of a reactive UV absorber or HALS; and reactive anti-oxidant and/or phosphor containing flame retardant. The encapsulant composition can be used for a solid state light emitting device to achieve low internal stress and better-anti-yellowing performance.
摘要:
The present invention provides a photosensitive polymer containing the following structure unit of formula (II): Wherein R is hydrogen or C1-C4 alkyl group; R′ is C1-C4 alkyl group; n is an integer of 2, 3, 4, 5 or 6. This photosensitive polymer also relates to chemical amplified photoresist composition. This chemical amplified photoresist composition can be applied to general lithography processes, especially in 193 nm lithography and the patterns formed from the photoresist composition exhibit excellent resolution and photosensitivity.