摘要:
The present invention provides a method for solving the need for layer management with double-layer overlay accuracy control, a calibration mark structure which realizes the method and a measurement system with the calibration mark structure. The method modifies the layout of the overlay calibration marks such that overlay information of two layers is contained in one combined calibration mark, has realized the overlay accuracy data collection for the two previous layers in the current layer by one-time measurement, and can treat the overlay accuracies of the two layers as different control accuracies. Thus, the method can complete the automatic feedback optimization of the overlay accuracy compensation, is simple and easy, and can better help the enterprises for production quality assurance and cost control.
摘要:
The present invention provides methods and apparatuses for a non-volatile semiconductor memory device. A non-volatile semiconductor memory device having multiple layers to provide a source, a drain, and a floating gate, comprising a plurality of metal layers to provide interconnects to the non-volatile memory wherein at least two of the plurality of metal areas on one or more layers are configured to provide a capacitor having a capacitance that is capacitively coupled to the floating gate.
摘要:
Memory methods and apparatuses providing for refresh and bandwidth enhancements for a dual-port memory array (e.g. a DRAM memory array) with balanced read and write timing specifications are disclosed. A port allocation for dual-port memory cell is adopted such that one port is assigned and shared for both read and refresh and the other port is assigned for write only. Double bandwidth is achieved by overlapping simultaneous read or refresh and write port access during the same cycle. No external refresh command is required and external accesses (reads and writes) are not interrupted or delayed under any circumstance. A high-speed SRAM compatible device can be fabricated from a dual-port DRAM or 3-Transistor cells or 2-Transistors and 1 capacitor cells. The preferred embodiments include a multi-bank dual-port memory array and a look-up-table logic which records the accessed word address and generates hit logic and idle cycles when a refresh stall is asserted by a refresh-jammed bank. A dual-port memory data lodge which temporarily detours the data flow is provided to store the data flow and to allow for refresh to occur in the refresh-jammed bank. Each of dual-port DRAM banks has its independent read, write and refresh decoder control. Therefore, simultaneous refresh and read-write operations are allowed in different banks. The size of data lodge is determined by guaranteeing that the refresh operations can be executed without pausing ongoing indefinite read and write operations.
摘要:
The present invention discloses semiconductor devices that can be manufactured utilizing standard process of manufacturing and that can hold information. In accordance with a presently preferred embodiment of the present invention, one or more semiconductor devices can be formed in a well on a substrate where isolation trenches surround one or more devices to create storage regions (floating wells) that is capable of holding a charge. Depending on the charge in the storage region (floating well), it can represent information. The semiconductor devices of the present invention can be manufactured using the standard process of manufacturing (bulk cmos processing).
摘要:
The present invention discloses semiconductor devices that can be manufactured utilizing standard process of manufacturing and that can hold information. In accordance with a presently preferred embodiment of the present invention, one or more semiconductor devices can be formed in a well on a substrate where isolation trenches surround one or more devices to create storage regions (floating wells) that is capable of holding a charge. Depending on the charge in the storage region (floating well), it can represent information. The semiconductor devices of the present invention can be manufactured using the standard process of manufacturing (bulk cmos processing).