公开(公告)号：US20120236461A1

公开(公告)日：2012-09-20

申请号：US13419545

申请日：2012-03-14

申请人： Yoji YAMAMOTO ,  Akihiro MOTOKI ,  Syunsuke TAKEUCHI ,  Makoto OGAWA ,  Toshiyuki IWANAGA

发明人： Yoji YAMAMOTO ,  Akihiro MOTOKI ,  Syunsuke TAKEUCHI ,  Makoto OGAWA ,  Toshiyuki IWANAGA

IPC分类号： H01G4/008 ,  H01C7/13 ,  H01L41/047 ,  H01F5/00

CPC分类号： H01C7/008 ,  H01C1/14 ,  H01G4/005 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12

摘要： A ceramic electronic component includes a substantially rectangular ceramic element assembly, a first external electrode, and a second external electrode. The first external electrode includes at least one plating film including a first plating film disposed directly on the ceramic element assembly from outside. Likewise, the second external electrode includes at least one plating film including a second plating film disposed directly on the ceramic element assembly from outside. The first and second plating films each have a surface area per unit area equal to or larger than about 1.02 in plan view.

摘要翻译： 陶瓷电子部件包括大致矩形的陶瓷元件组件，第一外部电极和第二外部电极。 第一外部电极包括至少一个镀膜，其包括从外部直接设置在陶瓷元件组件上的第一镀膜。 类似地，第二外部电极包括至少一个镀膜，其包括从外部直接设置在陶瓷元件组件上的第二镀膜。 在平面图中，第一和第二电镀膜的每单位面积的表面积等于或大于约1.02。

公开(公告)号：US20120169180A1

公开(公告)日：2012-07-05

申请号：US13337445

申请日：2011-12-27

申请人： Masahito SARUBAN ,  Makoto OGAWA ,  Wataru OGAWA ,  Akihiro MOTOKI ,  Syunsuke TAKEUCHI ,  Yoji YAMAMOTO

发明人： Masahito SARUBAN ,  Makoto OGAWA ,  Wataru OGAWA ,  Akihiro MOTOKI ,  Syunsuke TAKEUCHI ,  Yoji YAMAMOTO

IPC分类号： H01L41/00 ,  H01F5/00 ,  B05D3/02 ,  H01C7/10 ,  B05D5/12 ,  H01G4/12 ,  H01C7/13

CPC分类号： H01G4/232 ,  H01G4/012 ,  H01G4/30

摘要： In a method of manufacturing a laminate type electronic component, when a heat treatment is carried out after plating films, which at least partially define external electrodes, are formed by growing plated depositions deposited on exposed ends of a plurality of internal electrodes in a component main body, the presence of the plating films may not only interfere with moisture release, but may also cause blisters or bulge defects in the plating films, while moisture such as a plating solution in the component main body is removed by evaporation. To avoid such problems, cuts to divide exposed ends into multiple sections are formed in extending sections of internal electrodes. Thus, plating films include slits extending in the stacking direction at locations corresponding to positions of the cuts.

摘要翻译： 在层压型电子部件的制造方法中，在通过使成膜主体中的多个内部电极的露出端上沉积的镀层析出来形成至少部分地限定外部电极的镀膜之后进行热处理 电镀膜的存在不仅可以干扰湿气的释放，而且还可能导致镀膜中的起泡或凸起缺陷，同时通过蒸发除去组分主体中的电镀溶液等水分。 为了避免这种问题，在内部电极的延伸部分中形成将暴露端分割为多个部分的切割。 因此，电镀膜包括在与切口的位置相对应的位置沿堆叠方向延伸的狭缝。

公开(公告)号：US20110235234A1

公开(公告)日：2011-09-29

申请号：US13072932

申请日：2011-03-28

申请人： Yoji YAMAMOTO ,  Syunsuke TAKEUCHI ,  Akihiro MOTOKI ,  Makoto OGAWA ,  Masahito SARUBAN

发明人： Yoji YAMAMOTO ,  Syunsuke TAKEUCHI ,  Akihiro MOTOKI ,  Makoto OGAWA ,  Masahito SARUBAN

IPC分类号： H01G4/00 ,  H01G4/12

CPC分类号： H01G4/30 ,  H01G4/232 ,  Y10T29/435

摘要： A laminate includes ceramic layers laminated to each other. Internal conductors are embedded in the laminate and include exposed portions that are exposed between the ceramic layers at a lower surface and an upper surface of the laminate. External electrodes are directly plated on the lower surface and the upper surface so as to cover the respective exposed portions. Regions of the lower surface at which the exposed portions are provided are arranged to protrude from the other regions of the lower surface, and regions of the upper surface at which the exposed portions are provided are arranged to protrude from the other regions of the upper surface.

摘要翻译： 层压体包括彼此层叠的陶瓷层。 内部导体嵌入在层压体中，并且包括在层压体的下表面和上表面处暴露在陶瓷层之间的暴露部分。 外部电极被直接电镀在下表面和上表面上以覆盖相应的暴露部分。 设置有暴露部分的下表面的区域被布置成从下表面的其它区域突出，并且设置暴露部分的上表面的区域布置成从上表面的其它区域突出 。