Nonvolatile memory device and method of fabricating the same
    2.
    发明授权
    Nonvolatile memory device and method of fabricating the same 失效
    非易失性存储器件及其制造方法

    公开(公告)号:US07642593B2

    公开(公告)日:2010-01-05

    申请号:US11698658

    申请日:2007-01-26

    IPC分类号: H01L21/336

    摘要: a nonvolatile memory device Includes an active region defined in a semiconductor substrate and a control gate electrode crossing over the active region. A gate insulating layer is interposed between the control gate electrode and the active reigon. A floating gate is formed in the active region to penetrate the control gate electrode and extend to a predetermined depth into the semiconductor substrate. A tunnel insulating layer is successively interposed between the control gate electrode and the floating gate, and between the semiconductor substrate and the floating gate. The floating gate may be formed after a trench is formed by sequentially etching a control gate conductive layer and the semiconductor substrate, and a tunnel insulating layer is formed on the trench and sidewalls of the control gate conductive layer. The floating gate is formed in the trench to extend into a predetermined depth into the semiconductor substrate.

    摘要翻译: 非易失性存储器件包括限定在半导体衬底中的有源区和跨越有源区的控制栅电极。 栅极绝缘层介于控制栅极电极和活性电极之间。 在有源区中形成浮栅,以穿透控制栅电极并延伸到预定深度进入半导体衬底。 隧道绝缘层被连续插入在控制栅电极和浮栅之间以及半导体衬底和浮栅之间。 可以在通过顺序蚀刻控制栅极导电层和半导体衬底形成沟槽之后形成浮置栅极,并且在控制栅极导电层的沟槽和侧壁上形成隧道绝缘层。 浮动栅极形成在沟槽中,以延伸到预定深度进入半导体衬底。

    Nonvolatile memory device and method of fabricating the same
    4.
    发明申请
    Nonvolatile memory device and method of fabricating the same 失效
    非易失性存储器件及其制造方法

    公开(公告)号:US20070170491A1

    公开(公告)日:2007-07-26

    申请号:US11698658

    申请日:2007-01-26

    IPC分类号: H01L29/788

    摘要: a nonvolatile memory device Includes an active region defined in a semiconductor substrate and a control gate electrode crossing over the active region. A gate insulating layer is interposed between the control gate electrode and the active reigon. A floating gate is formed in the active region to penetrate the control gate electrode and extend to a predetermined depth into the semiconductor substrate. A tunnel insulating layer is successively interposed between the control gate electrode and the floating gate, and between the semiconductor substrate and the floating gate. The floating gate may be formed after a trench is formed by sequentially etching a control gate conductive layer and the semiconductor substrate, and a tunnel insulating layer is formed on the trench and sidewalls of the control gate conductive layer. The floating gate is formed in the trench to extend into a predetermined depth into the semiconductor substrate.

    摘要翻译: 非易失性存储器件包括限定在半导体衬底中的有源区和跨越有源区的控制栅电极。 栅极绝缘层介于控制栅极电极和活性电极之间。 在有源区中形成浮栅,以穿透控制栅电极并延伸到预定深度进入半导体衬底。 隧道绝缘层被连续插入在控制栅电极和浮栅之间以及半导体衬底和浮栅之间。 可以在通过顺序蚀刻控制栅极导电层和半导体衬底形成沟槽之后形成浮置栅极,并且在控制栅极导电层的沟槽和侧壁上形成隧道绝缘层。 浮动栅极形成在沟槽中,以延伸到预定深度进入半导体衬底。