摘要:
The electrostatic protection device includes a semiconductor substrate having a well formed therein. At least two sets of transistor fingers, for example the NMOS type, are spaced apart from each other. Each set of the MOS fingers includes multiple gates arranged in parallel to each other in one direction, and sources and drains alternately arranged at both sides of the gates in the semiconductor substrate. A well pickup surrounding every set of the transistor fingers and extending between any two set of the fingers is formed. Metal wires are connected to at least two portions of each of the drains and are also connected to an input/output pad to which Electrostatic Discharge (ESD) excessive current is introduced.
摘要:
The present invention discloses an electrostatic discharge protection circuit. The electrostatic discharge protection circuit of the present invention includes a transfer unit that transfers electrostaticity from at least one of a plurality of input/output pads to a boost bus line, a trigger unit that responds to the electrostaticity transferred via the boost bus line to detect a trigger voltage and apply it to a trigger bus line, and a plurality of clamp units that are connected between the input/output pads and an internal circuit. The clamp units are triggered by the trigger voltage of the trigger unit to discharge electrostaticity of the input/output pads to a first or second power supply voltage line, thereby safely protecting the internal circuit from electrostatic damage and lowering the operating voltage of the clamp unit with minimum costs without increasing an area of the electrostatic discharge protective circuit within a semiconductor integrated circuit.
摘要:
A diode comprises a P-type well formed in a semiconductor substrate, at least one N-type impurity doping area formed in the P-type well, an isolation area formed to surround the N-type impurity doping area, a P-type impurity doping area formed to surround the isolation area, first contacts formed in the N-type impurity doping area in a single row or a plurality of rows, and second contacts formed in the P-type impurity doping area in a single row or a plurality of rows, wherein pin resistance can be adjusted through changing any one of a distance between the N-type impurity doping area and the P-type impurity doping area, a contact pitch between the first contacts, and a contact pitch between the second contacts.
摘要:
A diode comprises a P-type well formed in a semiconductor substrate, at least one N-type impurity doping area formed in the P-type well, an isolation area formed to surround the N-type impurity doping area, a P-type impurity doping area formed to surround the isolation area, first contacts formed in the N-type impurity doping area in a single row or a plurality of rows, and second contacts formed in the P-type impurity doping area in a single row or a plurality of rows, wherein pin resistance can be adjusted through changing any one of a distance between the N-type impurity doping area and the P-type impurity doping area, a contact pitch between the first contacts, and a contact pitch between the second contacts.
摘要:
The present invention discloses an electrostatic discharge protection circuit. The electrostatic discharge protection circuit of the present invention includes a transfer unit that transfers electrostaticity from at least one of a plurality of input/output pads to a boost bus line, a trigger unit that responds to the electrostaticity transferred via the boost bus line to detect a trigger voltage and apply it to a trigger bus line, and a plurality of clamp units that are connected between the input/output pads and an internal circuit. The clamp units are triggered by the trigger voltage of the trigger unit to discharge electrostaticity of the input/output pads to a first or second power supply voltage line, thereby safely protecting the internal circuit from electrostatic damage and lowering the operating voltage of the clamp unit with minimum costs without increasing an area of the electrostatic discharge protective circuit within a semiconductor integrated circuit.
摘要:
An electrostatic discharge (ESD) protection circuit protects a gate oxide of elements in an internal circuit against ESD. During an ESD test, if the sum of driving voltages of ESD protectors connected between a power pad and a ground pad is higher than the gate oxide breakdown voltage of elements in the internal circuit, the structure of the ESD protector is changed or another ESD protector is additionally provided so as to protect the gate oxide of the elements in the internal circuit against ESD.
摘要:
An electrostatic discharge (ESD) protection circuit protects a gate oxide of elements in an internal circuit against ESD. During an ESD test, if the sum of driving voltages of ESD protectors connected between a power pad and a ground pad is higher than the gate oxide breakdown voltage of elements in the internal circuit, the structure of the ESD protector is changed or another ESD protector is additionally provided so as to protect the gate oxide of the elements in the internal circuit against ESD.
摘要:
A diode comprises a P-type well formed in a semiconductor substrate, at least one N-type impurity doping area formed in the P-type well, an isolation area formed to surround the N-type impurity doping area, a P-type impurity doping area formed to surround the isolation area, first contacts formed in the N-type impurity doping area in a single row or a plurality of rows, and second contacts formed in the P-type impurity doping area in a single row or a plurality of rows, wherein pin resistance can be adjusted through changing any one of a distance between the N-type impurity doping area and the P-type impurity doping area, a contact pitch between the first contacts, and a contact pitch between the second contacts.
摘要:
A diode comprises a P-type well formed in a semiconductor substrate, at least one N-type impurity doping area formed in the P-type well, an isolation area formed to surround the N-type impurity doping area, a P-type impurity doping area formed to surround the isolation area, first contacts formed in the N-type impurity doping area in a single row or a plurality of rows, and second contacts formed in the P-type impurity doping area in a single row or a plurality of rows, wherein pin resistance can be adjusted through changing any one of a distance between the N-type impurity doping area and the P-type impurity doping area, a contact pitch between the first contacts, and a contact pitch between the second contacts.
摘要:
Disclosed is an electrostatic discharge protection device that has a low trigger voltage and protects an internal circuit from electrostatic discharge. The ESD protection device includes an NMOS transistor in which a first pad and a drain are connected to each other and a second pad and a source are connected to each other. A capacitor in which an end is connected to the first pad and the other end is connected to a gate of the NMOS transistor and a substrate contact of the NMOS transistor. The ESD protection devices also includes a resistor in which an end is connected to the second pad and the other end is connected to the capacitor. The first pad may be a power pad and the second pad may be a ground pad. Alternately, the first pad may be an input/output pad and the second pad may be a ground pad.