摘要:
An inspection apparatus of a disk-shaped substrate able to precisely quantitatively inspect positions of formation of film layers formed on the surface of a disk-shaped substrate is provided, that is, an inspection apparatus of a disk-shaped substrate on which film layers are formed designed to generate captured image data expressing a captured image corresponding to a field of view based on image signals successively output from an image capturing unit capturing an image of a predetermined surface at an outer circumference part of the disk-shaped substrate and to generate film layer edge position information Y4E24 (θ) expressing longitudinal direction positions at corresponding positions (θ) along the circumferential direction of an edge line E24 of a film layer image part ISa (24) corresponding to the film layer 24 on the surface image ISa with reference to, from the captured image data, longitudinal direction positions YE15aL (θ) at the different positions (θ) along the circumferential direction of a boundary line E15a between a surface image part ISa corresponding to the predetermined surface on the captured image and its outer image part IBKL.
摘要:
An inspection apparatus to precisely quantitatively inspect positions of formation of film layers formed on the surface of a disk-shaped substrate. It generates captured image data expressing a captured image corresponding to a field of vie based on image signals successively output from an image capturing unit capturing an image of a predetermined surface at an outer circumference part of the disk-shaped substrate and generates film layer edge position information expressing longitudinal direction positions at corresponding positions along the circumferential direction of an edge line of a film layer image pan corresponding to the film layer on the surface image with reference to, from the captured image data, longitudinal direction positions at the different positions along the circumferential direction of a boundary line between a surface image part corresponding to the predetermined surface on the captured image and its outer image part.
摘要:
A feature analysis apparatus which enables visual confirmation of features of an inspected object and which enables limitations on the degree of freedom of classification based on the features to made relatively smaller is provided. It acquires inspected object information of an inspected object (S1), analyzes the inspection information to determine values of feature parameters of each of the plurality of layers (S2 to S5), uses values of the plurality of feature parameters and their corresponding directions for each of the plurality of layers to generate a single parameter vector (S2 to S5), converts the parameter vector to a layer vector which is a 3D vector in a predetermined (S2 to S5), and couples the plurality of layer vectors obtained for the plurality of layers in the order of the layers and generates a set of coordinate values of the plurality of nodes obtained in the 3D space as feature information of the inspected object (S6).
摘要:
A substrate surface inspection apparatus and method enabling judgment and analysis of the state of even portions of a substrate supported by supports using a captured image are provided. A support mechanism 20 is used where positions of arrangement of substrate support positions along the direction perpendicular to a scan direction by a plurality of first supports 23a to 23d are set outside the image capturing ranges of the substrate 10 by the imaging units 30a, 30b at the first relative position and inside the common image capturing range and where positions of arrangement of substrate support positions along the direction perpendicular to the scan direction by the plurality of second supports 24a to 24d are set outside the image capturing ranges of the substrate by the imaging units at the second relative position and inside the common image capturing range. The surface of the substrate 10 supported by the plurality of first supports is scanned and captured by the imaging units at the first relative position, the imaging units are moved to the second relative position, then the surface of the substrate 10 supported by the plurality of second supports is scanned and captured by the imaging units at the second relative position.
摘要:
A method of inspection and inspection apparatus able to use a captured image to more precisely inspect the state of film, defect parts, etc. at a surface of an object under inspection are provided.A method of inspection and inspection apparatus illuminating a surface of an object under inspection 10 by white light from an illumination unit LO while scanning the surface of the object under inspection 10 by an image capturing unit 100 to acquire a captured image and using the captured image to inspect a state of the surface of the object under inspection 10, which changes a state of polarization of light LR striking the image capturing unit 100 from an illuminated location of the object under inspection 10 and obtains a plurality of captured images based on light of different polarization states LR striking the image capturing unit 100.
摘要:
A substrate surface inspection apparatus and method enabling judgment and analysis of the state of even portions of a substrate supported by supports using a captured image are provided. A support mechanism 20 is used where positions of arrangement of substrate support positions along the direction perpendicular to a scan direction by a plurality of first supports 23a to 23d are set outside the image capturing ranges of the substrate 10 by the imaging units 30a, 30b at the first relative position and inside the common image capturing range and where positions of arrangement of substrate support positions along the direction perpendicular to the scan direction by the plurality of second supports 24a to 24d are set outside the image capturing ranges of the substrate by the imaging units at the second relative position and inside the common image capturing range. The surface of the substrate 10 supported by the plurality of first supports is scanned and captured by the imaging units at the first relative position, the imaging units are moved to the second relative position, then the surface of the substrate 10 supported by the plurality of second supports is scanned and captured by the imaging units at the second relative position.
摘要:
A feature analysis apparatus which enables visual confirmation of features of an inspected object and which enables limitations on the degree of freedom of classification based on the features to made relatively smaller is provided. It acquires inspected object information of an inspected object (S1), analyzes the inspection information to determine values of feature parameters of each of the plurality of layers (S2 to S5), uses values of the plurality of feature parameters and their corresponding directions for each of the plurality of layers to generate a single parameter vector (S2 to S5), converts the parameter vector to a layer vector which is a 3D vector in a predetermined (S2 to S5), and couples the plurality of layer vectors obtained for the plurality of layers in the order of the layers and generates a set of coordinate values of the plurality of nodes obtained in the 3D space as feature information of the inspected object (S6).
摘要:
A method of inspection and inspection apparatus able to use a captured image to more precisely inspect the state of film, defect parts, etc. at a surface of an object under inspection are provided.A method of inspection and inspection apparatus illuminating a surface of an object under inspection 10 by white light from an illumination unit LO while scanning the surface of the object under inspection 10 by an image capturing unit 100 to acquire a captured image and using the captured image to inspect a state of the surface of the object under inspection 10, which changes a state of polarization of light LR striking the image capturing unit 100 from an illuminated location of the object under inspection 10 and obtains a plurality of captured images based on light of different polarization states LR striking the image capturing unit 100.
摘要:
[Problem] To provide a surface roughness inspection system enabling suitable inspection even when the surface of the object being inspected is curved.[Means for Solution] A system having an imaging unit 20 having a line sensor 22 and scanning the surface of an object being inspected 101 in a direction perpendicular to the direction of extension of the line sensor 22 and outputting a density signal for each pixel from the line sensor 22 and a processing unit 50 processing the density signal from the line sensor 22 of the imaging unit 20, the processing unit 50 having a means for acquiring a pixel density value based on a density signal from the line sensor 22 (S2) and a density state generating means for generating a density state information Pf showing the density state in the scan direction of the object surface based on all of the pixel density values acquired for the object surface 101 being inspected (S7).
摘要:
A semiconductor wafer inspection apparatus for inspecting an outer circumference edge part of a semiconductor wafer. The apparatus has a camera lens arranged facing an outer circumference edge part of a semiconductor wafer, an imaging surface arranged facing an outer circumference end face of a semiconductor wafer via the camera lens, a mirror forming an image of a first outer circumference bevel surface of the semiconductor wafer on the imaging surface via the camera lens, a mirror forming an image of a second outer circumference bevel surface of the semiconductor wafer on the imaging surface via the camera lens, a correction lens forming an image of an outer circumference end face of the semiconductor wafer on the imaging surface via the center part of the camera lens, and an illumination light guide lamp part illuminating the surfaces. With use of the apparatus the first outer circumference bevel surface and second outer circumference bevel surface become brighter compared with the outer circumference end face.