摘要:
A semiconductor integrated circuit device includes a semiconductor integrated circuit formed in a semiconductor chip, and a switching element that is formed in the semiconductor chip and has a current path whose one end and the other end are both connected to the semiconductor integrated circuit. The switching element receives a control signal produced by a control circuit and causes a current to flow from the one end to the other end of the current path by a bipolar operation. The semiconductor integrated circuit device further includes the control circuit that is formed in the semiconductor chip and configured to control a conductive/non-conductive state of the current path of the switching element.
摘要:
A semiconductor integrated circuit device includes a semiconductor integrated circuit formed in a semiconductor chip, and a switching element that is formed in the semiconductor chip and has a current path whose one end and the other end are both connected to the semiconductor integrated circuit. The switching element receives a control signal produced by a control circuit and causes a current to flow from the one end to the other end of the current path by a bipolar operation. The semiconductor integrated circuit device further includes the control circuit that is formed in the semiconductor chip and configured to control a conductive/non-conductive state of the current path of the switching element.
摘要:
The present invention relates to a semicustom ASIC, in which a plurality of standard cell rows are arranged. The standard cell and basic cells used in a gate array are mixedly mounted on the same chip. Respective cell rows are composed of a plurality of standard cells with an empty space. The basic cells used in the gate array are arranged as dummy cells. They are disposed in wiring channel regions between the plurality of standard cells or empty spaces between the standard cells in a same standard cell row. Only the latter may be used if the channelless type standard cells are employed. A changing request can be satisfied by forming metal wiring layers on the gate array basic cells when there is a necessity of changing circuit design or pattern. Since the circuit can be modified without change of gate polysilicon regions and source/drain regions underlying the metal wiring layers, design and manufacture can be effected in a short period of time.
摘要:
A bipolar transistor/insulated gate transistor hybrid semiconductor device comprises a well region formed on a semiconductor substrate to serve as a first active region of a bipolar transistor, an insulated gate transistor having source and drain regions formed in the well region, which acts as a back gate of the insulated gate transistor, and second and third active regions of the bipolar transistor formed in the well region. At least one of the second and third active regions is used in common to one of the source and drain regions of the insulated gate transistor. A plurality of well regions is regularly arranged to constitute a gate array.
摘要:
A semiconductor integrated circuit includes a first data holding section, a first pull-up circuit, a first pull-down circuit, a first feedback circuit, and a second feedback circuit. The first data holding section holds first output data. The first pull-up circuit takes in input data as a pull-up control signal and, when the pull-up control signal takes one value, pulls up the first output data. The first pull-down circuit takes in the input data as a pull-down control signal and, when the pull-down control signal takes the other value, pulls down the first output data. The first feedback circuit feeds back a first feedback signal corresponding to the first output data as the pull-up control signal to the first pull-up circuit. The second feedback circuit feeds back a second feedback signal corresponding to the first output data as the pull-down control signal to the first pull-down circuit.
摘要:
A semiconductor integrated circuit which is capable of being manufactured with a higher packing density and a small-size structure of standard cells is described. In the semiconductor integrated circuit, substrate regions and source regions are shared by adjacent standard cells as well as common contact regions which are located inward displaced respectively from the centers of the substrate regions.
摘要:
A master slice layout technology is provided to improve integration density of a semiconductor integrated circuit such as ASIC. In particular, a plurality of gate basic cells are arranged on a semiconductor chip and then a wiring channel grid having non-uniform pitches is defined on the gate basic cells. If a layout of metal wirings is designed along the wiring channel grid, miniaturizable patterns can be set to smaller values while maintaining line widths of predetermined metal wirings such as power supply wirings at preselected values. Since flexibility for the layout of the metal wiring layers is large, miniaturization of the patterns can be attained even if design rules for basic cell process and wiring process are different.
摘要:
The present invention relates to a semicustom ASIC, in which a plurality of standard cell rows are arranged. The standard cell and basic cells used in a gate array are mixedly mounted on the same chip. Respective cell rows are composed of a plurality of standard cells with an empty space. The basic cells used in the gate array are arranged as dummy cells. They are disposed in wiring channel regions between the plurality of standard cells or empty spaces between the standard cells in a same standard cell row. Only the latter may be used if the channelless type standard cells are employed. A changing request can be satisfied by forming metal wiring layers on the gate array basic cells when there is a necessity of changing circuit design or pattern. Since the circuit can be modified without change of gate polysilicon regions and source/drain regions underlying the metal wiring layers, design and manufacture can be effected in a short period of time.
摘要:
A semiconductor integrated circuit device includes cells, each of the cells including a gate electrode, which is provided on the well, and first diffusion layers of a second conductivity type which are provided in the well such that the first diffusion layers sandwich the gate electrode, the first diffusion layers functioning as sources/drains. The device further includes sub-regions which are arranged in a non-occupied area of the logic circuit structure region, each of the sub-regions including a conductive layer, which is provided on the well and has the same pattern shape as the gate electrode, and second diffusion layers of the first conductivity type, which have the same pattern shape as the first diffusion layers and are disposed spaced apart to sandwich the conductive layer, the second diffusion layers being electrically connected to the well.
摘要:
A semiconductor integrated circuit includes a first data holding section, a first pull-up circuit, a first pull-down circuit, a first feedback circuit, and a second feedback circuit. The first data holding section holds first output data. The first pull-up circuit takes in input data as a pull-up control signal and, when the pull-up control signal takes one value, pulls up the first output data. The first pull-down circuit takes in the input data as a pull-down control signal and, when the pull-down control signal takes the other value, pulls down the first output data. The first feedback circuit feeds back a first feedback signal corresponding to the first output data as the pull-up control signal to the first pull-up circuit. The second feedback circuit feeds back a second feedback signal corresponding to the first output data as the pull-down control signal to the first pull-down circuit.