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    Metal-based photonic device package module
    1.
    发明授权
    Metal-based photonic device package module 有权
    基于金属的光子器件封装模块

    公开(公告)号：US08120045B2

    公开(公告)日：2012-02-21

    申请号：US12596888

    申请日：2007-09-18

    申请人： Young-Se Kwon ,  Kyoung-Min Kim ,  Sung-Woo Hyun ,  Bo-In Son

    发明人： Young-Se Kwon ,  Kyoung-Min Kim ,  Sung-Woo Hyun ,  Bo-In Son

    IPC分类号： H01L29/18

    CPC分类号： H01L31/024 ,  H01L27/14618 ,  H01L31/0203 ,  H01L33/483 ,  H01L33/60 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A metal-based photonic device package module that is capable of greatly improving heat releasing efficiency and implementing a thin package is provided. The metal-based photonic device package module includes a metal substrate that is formed the shape of a plate, a metal oxide layer that is formed on the metal substrate to have a mounting cavity, a photonic device that is mounted in the mounting cavity of the metal oxide layer, and a reflecting plane that is formed at an inner surface of the mounting cavity of the metal oxide layer.

    摘要翻译： 提供了能够大大提高放热效率并实现薄包装的基于金属的光子器件封装模块。 金属基光子器件封装模块包括金属基板，其形成为板的形状，金属氧化物层形成在金属基板上以具有安装空腔，光子器件安装在安装空间中 金属氧化物层和形成在金属氧化物层的安装空腔的内表面的反射面。