摘要:
A method of programming addresses of failed memory locations in a memory device can be provided by generating a plurality of fail address signals corresponding to a plurality of addresses of failed memory locations in the memory device and then programming the plurality of addresses of failed memory locations to programming cells for use by a redundant circuit during read or write operations to the plurality of addresses of failed memory locations.
摘要:
A method of programming addresses of failed memory locations in a memory device can be provided by generating a plurality of fail address signals corresponding to a plurality of addresses of failed memory locations in the memory device and then programming the plurality of addresses of failed memory locations to programming cells for use by a redundant circuit during read or write operations to the plurality of addresses of failed memory locations.
摘要:
A fuse box for a semiconductor device is disclosed and includes a first fuse group comprising a plurality of first fuses, arranged in a first direction and having a first cutting axis, each first fuse comprising a first portion having a first fuse pitch, a second portion having a second fuse pitch smaller than the first fuse pitch, and a third portion connecting the first and second portions, a second fuse group comprising a plurality of second fuses, arranged in the first direction and having a second cutting axis, each second fuse comprising a first portion having a first fuse pitch, a second portion having a second fuse pitch smaller than the first fuse pitch, and a third portion connecting the first portion and the second portion, and a third fuse group comprising a plurality of third fuses, wherein each third fuse has either the first cutting axis or the second cutting axis, comprises a first pattern arranged in the first direction and having a first fuse pitch, and a second pattern arranged in a second direction and having a second fuse pitch smaller than the first fuse pitch, and is arranged to bypass the first fuse or the second fuse.
摘要:
A semiconductor memory device is shown that includes a normal memory cell array including a plurality of memory cells specified by 2.sup.n word lines and a plurality of column bit lines where an externally input n-bit row address is decoded to activate one of the 2.sup.n word lines. The semiconductor memory device further includes a redundant row fuse decoder that includes a plurality of n-bit address fuse portions each of which can be selectively coded to respond to an n-bit defective row address value in the externally input n-bit row address which corresponds to a word line in the normal memory cell array that includes a defective memory cell. The semiconductor memory device further includes a redundant memory cell array including a plurality of rows of memory cells which can be activated by one of the n-bit address fuse portions in response to the defective row address coded into the n-bit address fuse portion.
摘要:
A semiconductor device includes a DRAM and a temperature sense circuit. The DRAM has a refresh period that varies responsive to a temperature signal. The temperature sense circuit is configured to generate the temperature signal having a first binary value in response to sensing a temperature of the DRAM of at least a first temperature level, and to generate the temperature signal having a second binary value in response to sensing a temperature of the DRAM of less than a second temperature level, wherein the second temperature value is less than the first temperature value.
摘要:
A semiconductor device includes a DRAM and a temperature sense circuit. The DRAM has a refresh period that varies responsive to a temperature signal. The temperature sense circuit is configured to generate the temperature signal having a first binary value in response to sensing a temperature of the DRAM of at least a first temperature level, and to generate the temperature signal having a second binary value in response to sensing a temperature of the DRAM of less than a second temperature level, wherein the second temperature value is less than the first temperature value.
摘要:
Provided are a reference voltage generating circuit and an internal voltage generating circuit for controlling an internal voltage level, where the reference voltage generating circuit includes a distributing unit, a clamping control unit, and a control unit; the distributing unit has a voltage level lower than that of an external power supply voltage in response to the external power supply voltage, and outputs via an output terminal a reference voltage which varies according to an operating mode; the clamping control unit is connected between the output terminal and a ground voltage, and clamps the voltage level of the reference voltage at a constant level in response to a control voltage having a voltage level which is lower than that of the reference voltage; the control unit increases or decreases the voltage level of the reference voltage in response to first and second operating mode signals; the control unit includes a first control transistor and a second control transistor; and the reference voltage generating circuit controls a reference voltage level according to an operating mode of the semiconductor memory device such that the operating characteristics of the semiconductor memory device can be improved in some operating modes and power dissipation can be minimized in other operating modes.
摘要:
A semiconductor device is provided for controlling entry to and exit from a power down (DPD) mode of a semiconductor memory comprising; a plurality of voltage generators for providing operating voltages to the semiconductor memory; a DPD controller for detecting a DPD condition and generating a DPD signal to control the application of the operating voltages to the semiconductor memory; and biasing circuitry for biasing a plurality of nodes of at least one of the plurality of voltage generators to at least one predetermined voltage potential to prevent false triggering of circuits upon entry/exit of DPD mode. Also provided is a semiconductor device, comprising: a plurality of input buffers for buffering a plurality of DPD-type signals for signaling a power down (DPD) condition including a DPD enter/exit signal: an auxiliary buffer for separately buffering the DPD enter/exit signal; a plurality of voltage generators for supplying operating voltages to internal circuit; DPD control circuit for receiving the DPD-type signals to decode DPD enter and exit commands and for outputting a voltage generator control signal to turn off the voltage generators when DPD enter command is decoded, and to turn off the plurality of buffers excluding the auxiliary buffer; and an auto-pulse generator for generating a voltage pulse upon receiving the DPD exit command to initialize internal circuits of the semiconductor device.
摘要:
An apparatus and a method are disclosed for package level burn-in test circuit in semiconductor devices. The apparatus includes a package burn-in register, a test voltage generator for the package level burn-in test, a burn-in master signal generator, and a burn-in test circuit. The package burn-in register stores a package burn-in set-order from the outside and generates a package burn-in set-signal. The test voltage generator generates burn-in test voltages in response to the package burn-in set-signal and to address signals through first address terminals from the outside. The burn-in master signal generator generates a burn-in master signal by combining and receiving the second address signal form first address terminals, a wafer burn-in enable signal from a control signal input terminal, and the package burn-in set-signal. After receiving the burn-in master signal, multiple address signals from multiple third address terminals, and the test voltages for the package level burn-in test, the burn-in test circuit performs a package level burn-in test.
摘要:
A dynamic random access memory (DRAM) including a plurality of memory banks is capable of selectively performing a self-refresh operation with respect to only a subset of the banks. The DRAM includes a plurality of row decoders for selecting word lines of the memory cells of the memory banks, an address generator for generating internal addresses which sequentially vary during a self-refresh mode, a refresh bank designating circuit for generating refresh bank designating signals for designating a memory bank to be refreshed, and a bank selection decoder for designating one or more memory banks to be refreshed by the refresh bank designating signals and supplying refresh addresses to the row decoders corresponding to the designated memory banks according to the information of the internal addresses. The self-refresh operation is performed for only selected memory banks, or alternatively, only in those memory banks in which data is stored, thereby minimizing power consumption.