摘要:
A semiconductor device for controlling entry to and exit from a power down mode (DPD) of a semiconductor memory, comprising a plurality of voltage generators for providing operating voltages to the semiconductor memory; a DPD controller for detecting a DPD condition and for generating a DPD signal to control the application of the operating voltages to the semiconductor memory; and circuitry for controlling the timing of turning on/off the plurality of voltage generators upon entry/exit of DPD mode to reduce surge current through the semiconductor memory to less than maximum current level.
摘要:
A semiconductor device is provided for controlling entry to and exit from a power down (DPD) mode of a semiconductor memory comprising; a plurality of voltage generators for providing operating voltages to the semiconductor memory; a DPD controller for detecting a DPD condition and generating a DPD signal to control the application of the operating voltages to the semiconductor memory; and biasing circuitry for biasing a plurality of nodes of at least one of the plurality of voltage generators to at least one predetermined voltage potential to prevent false triggering of circuits upon entry/exit of DPD mode. Also provided is a semiconductor device, comprising: a plurality of input buffers for buffering a plurality of DPD-type signals for signaling a power down (DPD) condition including a DPD enter/exit signal: an auxiliary buffer for separately buffering the DPD enter/exit signal; a plurality of voltage generators for supplying operating voltages to internal circuit; DPD control circuit for receiving the DPD-type signals to decode DPD enter and exit commands and for outputting a voltage generator control signal to turn off the voltage generators when DPD enter command is decoded, and to turn off the plurality of buffers excluding the auxiliary buffer; and an auto-pulse generator for generating a voltage pulse upon receiving the DPD exit command to initialize internal circuits of the semiconductor device.
摘要:
A voltage control circuit is used to control the voltage levels on input and output lines of a semiconductor memory device. A load transistor is controlled by feeding back an output voltage of the input and output lines in order to increase data access speed. The input and output lines are separately controlled by clamp devices that clamp low voltage levels on the input and output lines to voltages between a ground potential and a power supply voltage. The clamping devices are enabled during read operations by feeding back the output data from a sense amplifier coupled to the input and output lines. The sense amplifier senses and amplifies the voltage difference of the input and output lines. The feedback control signal from the sense amplifier eliminates DC current paths while the voltage of the input and output lines are toggled between high and low states. The voltage control circuit increases operation speed and reduces current consumption in the memory device.
摘要:
Integrated circuit memory devices include one or more input receivers that have a reference voltage input terminal. A conductor electrically couples the reference voltage input terminals to a reference voltage, and a capacitor is connected between the conductor and a first ground voltage. Preferably, the location of the connection between the capacitor and the conductor is selected in accordance with the electrical characteristics of the input receivers. Accordingly, the capacitor may reduce fluctuations or noise in the reference voltage applied to the reference voltage input terminals of the input receivers. The fluctuations or noise in the reference voltage may cause the input characteristics and/or the set-up and hold times of the input receivers to vary with respect to one another. A reduction in fluctuations or noise in the reference voltage may result in more consistent input characteristics among the input receivers and more consistency in the set-up and hold times.
摘要:
Integrated circuit memory devices include first and second spaced-apart memory banks in an integrated circuit substrate. A pad block in the integrated circuit substrate is located between the first and second spaced-apart memory banks. An input/output block in the integrated circuit substrate is connected to the pad block to receive input data from external of the integrated circuit memory device via the pad block and to transmit output data to external of the integrated circuit memory device via the pad block. A delay locked loop in the integrated circuit substrate is responsive to an external clock signal to generate an internal clock signal. An interface logic block in the integrated circuit substrate is responsive to the internal clock signal to control the first and second memory banks and the input/output block in response to the internal clock signal. A single data shift block in the integrated circuit substrate is located between the pad block and one of the first and second spaced-apart memory banks. The single data shift block is connected to the input/output block by a first plurality of lines and to both of the first and second memory banks by a second plurality of lines that is an integer multiple of the first plurality. The single data shift block converts serial data on the first plurality of lines to parallel data on the second plurality of lines and converts parallel data on the second plurality of lines to serial data on the first plurality of lines. The invention may be used in any integrated circuit memory device. However, the invention is preferably used in a packet type integrated circuit memory device that operates on packets of data address and control signals, such as a Rambus integrated circuit memory device.
摘要:
A semiconductor memory device including a redundancy circuit having latch cells is provided. In the semiconductor memory device, memory cells are selected in memory cell blocks each having a plurality of memory cells arrayed in columns and rows. Data of the selected memory cells is input to or output from the memory cell blocks via data lines. The semiconductor memory device includes a row decoder, a sub word line driver, latch cells, fuse boxes, a latch cell control unit, and a switch unit. The row decoder decodes a row address and generates a word line enable signal for selecting the word lines of a group of memory cells among memory cells. The sub word line driver is connected to the word line enable signal, and drives the selected memory cells. The latch cells are arranged along the data lines. Each of the fuse boxes has a plurality of fuses which are programmed in accordance with a defective cell address in the memory cell block. The latch cell control unit generates a latch cell selection signal in response to the output signal of each of the fuse boxes, and selects latch cells. The switch units connect the selected latch cells to the data lines in response to the latch cell selection signal.
摘要:
A semiconductor memory device having a row redundancy scheme in which the time to enable a word line during a normal path is less than that of a conventional device, to enhance the operation speed of a memory chip, and the number of common redundancies are maximized to enhance the redundancy capability, and a method for curing a defective cell. The semiconductor memory device has a plurality of global blocks, each of which includes a plurality of unit matrixes having a normal block and a redundancy block, a normal division word line driver, a redundancy division word line driver, a main decoder and an auxiliary decoder. In the main decoder, an output signal is selectively activated according to a row address signal regardless of using the redundancy cell. Also, in the auxiliary decoder, when a corresponding global block is selected according to the row address signal for selecting a global block in a normal operation mode or a redundancy scheme of the corresponding block is used in the redundancy operation mode, an output signal is selectively activated according to the row address signal.
摘要:
Integrated circuit memory devices can reduce write time during a write cycle of a parallel bit test mode. The memory devices include a simultaneous column select line activation circuit that simultaneously activates at least two of the plurality of column select lines during a write cycle of a parallel bit test mode. Therefore, during the write cycle, at least two bit lines are simultaneously connected to one input and output line since at least two column select lines are simultaneously activated by the simultaneous column select line activation circuit. Accordingly, data is simultaneously written to the memory cells connected to at least two bit lines through the input and output line.
摘要:
A semiconductor memory device includes a sub-wordline and a bit line connected to a memory cell, a sub-wordline driver for signaling the sub-wordline, and a main word decoder and a sub-word decoder, for selecting the sub-wordline driver in response to an external input address signal, wherein the wordline driver includes an NMOS transistor switch connected between a main wordline which is an output of the main word decoder and the sub-wordline, and wherein the logic "high" voltage level of a first control signal which controls the switch is lower than that of a signal output to the sub-wordline. The semiconductor memory device having the sub-wordline driver allows the internal power supply voltage to be used as the power supply voltage of the main word decoder. Accordingly, the reliability of a gate oxide film of a transistor constituting the main word decoder is improved, which lengthens the life of the semiconductor memory device.
摘要:
A circuit and method are shown for controlling a redundant memory cell of an integrated memory circuit. The circuit includes a decoder, a precharge enable unit, a redundant controller, a redundant enable signal generator, and a redundant memory cell array. The precharge enable unit is connected to the decoder, and responds to a precharge enable signal by precharging the output terminal of decoder. The decoder responds to a first row address signal by discharging the output terminal of the decoder unless the value of the row address signal corresponds to a programmed address of the decoder. The redundant enable signal generator samples the voltage level of the output terminal of the decoder under control of a redundant control signal of the redundant controller in order to generate a redundant cell enable signal. The redundant controller generates the redundant control signal in response to a second row address signal, where the redundant controller delays the redundant control signal by a predetermined time interval in response to a stress test signal which is active during a stress test in order to allow the decoder sufficient time to discharge the output terminal during the stress test. The redundant memory cell array is connected to the redundant enable signal generator and responds to the redundant enable signal.