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公开(公告)号：US09248504B2
公开(公告)日：2016-02-02
申请号：US13814891
申请日：2011-09-12
CPC分类号： B22F9/24 , B22F1/0014 , B22F1/0018 , B82Y30/00 , C22C1/0425 , C22C9/00 , H01B1/026 , H01B1/22
摘要： There are provided a copper powder for conductive paste, which comprises monodisperse and spherical fine copper particles having a sharp particle size distribution and containing no coarse particles and which can form a thinner electrode film while avoiding a bad influence on electric characteristics thereof, and a method for stably producing such a copper powder for conductive paste. After copper is complexed by adding a complexing agent to an aqueous solution containing copper while blowing air into the solution, the blowing of air is stopped, and then, a reducing agent is added to the solution to deposit copper particles by reduction.
摘要翻译： 提供了一种用于导电浆料的铜粉末，其包括具有尖锐粒度分布且不含粗粒子的单分散球形细铜颗粒，并且可以形成较薄的电极膜，同时避免对其电特性的不良影响，以及方法 用于稳定地生产这种用于导电浆料的铜粉末。 在通过向含有铜的水溶液中加入络合剂而将铜络合的同时，将空气吹入溶液中，停止吹入空气，然后通过还原将还原剂加入到溶液中以沉积铜颗粒。
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公开(公告)号：US20130177471A1
公开(公告)日：2013-07-11
申请号：US13814891
申请日：2011-09-12
IPC分类号： B22F9/24
CPC分类号： B22F9/24 , B22F1/0014 , B22F1/0018 , B82Y30/00 , C22C1/0425 , C22C9/00 , H01B1/026 , H01B1/22
摘要： There are provided a copper powder for conductive paste, which comprises monodisperse and spherical fine copper particles having a sharp particle size distribution and containing no coarse particles and which can form a thinner electrode film while avoiding a bad influence on electric characteristics thereof, and a method for stably producing such a copper powder for conductive paste. After copper is complexed by adding a complexing agent to an aqueous solution containing copper while blowing air into the solution, the blowing of air is stopped, and then, a reducing agent is added to the solution to deposit copper particles by reduction.
摘要翻译： 提供了一种用于导电浆料的铜粉末，其包括具有尖锐粒度分布且不含粗粒子的单分散球形细铜颗粒，并且可以形成较薄的电极膜，同时避免对其电特性的不良影响，以及方法 用于稳定地生产这种用于导电浆料的铜粉末。 在通过向含有铜的水溶液中加入络合剂而将铜络合的同时，将空气吹入溶液中，停止吹入空气，然后通过还原将还原剂加入到溶液中以沉积铜颗粒。
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3.发明申请LOW-TEMPERATURE SINTERED SILVER NANOPARTICLE COMPOSITION AND ELECTRONIC ARTICLES FORMED USING THE SAME 有权低温烧结银纳米颗粒组合物和使用其形成的电子制品公开(公告)号：US20120177897A1
公开(公告)日：2012-07-12
申请号：US13321675
申请日：2010-08-27
申请人： Gregory A. Jablonski , Michael A. Mastropietro , Kimitaka Sato , Hiromasa Miyoshi , Hidefumi Fujita
发明人： Gregory A. Jablonski , Michael A. Mastropietro , Kimitaka Sato , Hiromasa Miyoshi , Hidefumi Fujita
CPC分类号： C22C5/06 , B22F1/0022 , B22F1/0062 , B22F9/24 , B22F2301/255 , B22F2304/054 , B82Y30/00 , C23C24/087 , C23C24/106 , H05K1/097 , H05K2201/0145 , H05K2201/10098 , Y10T428/24802 , Y10T428/24909
摘要： A silver nanoparticle composition is provided which is possible to be sintered through sintering at a low temperature in a short time and to form silver electro conductive film and wiring which is favorable for adhesion to a substrate and low in resistance, and articles using the same are provided. The silver nanoparticle composition is provided, wherein a main component of a solvent is water, a pH of the composition is within a range of 5.3 to 8.0, a silver nanoparticle included in the composition is protected by an organic acid or a derivative thereof, and the content of the organic acid or the derivative thereof with respect to silver is 2 to 20% by mass.
摘要翻译： 提供了一种银纳米颗粒组合物，其可以在短时间内在低温下烧结而烧结，并形成银导电膜和布线，其有利于对基片的粘附和低电阻，并且使用该银导电膜和布线 提供。 提供了银纳米颗粒组合物，其中溶剂的主要组分是水，组合物的pH在5.3至8.0的范围内，组合物中包含的银纳米颗粒被有机酸或其衍生物保护，并且 有机酸或其衍生物相对于银的含量为2〜20质量％。
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4.发明授权公开(公告)号：US07618475B2
公开(公告)日：2009-11-17
申请号：US11340652
申请日：2006-01-27
IPC分类号： B22F1/00
CPC分类号： B22F1/0007 , B22F1/0055 , B22F2998/00 , F28F13/00 , F28F2013/006 , H05K1/092 , B22F1/0011
摘要： A metal powder for a conductive paste has an average particle diameter D50 not greater than 5 μm and an X value defined by equation (1) not greater than 0.5: X value=D50 (μm)/BET specific surface area (m2/g) (1) The metal powder for a conductive paste is particularly preferable when wart-like projections of a diameter not greater than 150 nm are present on the particle surfaces. Typical types of the metal powder include Cu, Ag, Au, Pd, Pt, Ni, Al and alloys thereof. The metal powder for a conductive paste enables fabrication of a conductor having a low void ratio after the paste is fired.
摘要翻译： 用于导电糊的金属粉末的平均粒径D50不大于5μm，由式（1）定义的X值不大于0.5：X值= D50（mum）/ BET比表面积（m2 / g） （1）颗粒表面上存在直径不大于150nm的疣状突起时，导电性糊剂用金属粉末是特别优选的。 金属粉末的典型类型包括Cu，Ag，Au，Pd，Pt，Ni，Al及其合金。 用于导电浆料的金属粉末可以在糊料烧制后制造具有低空隙率的导体。
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5.发明申请公开(公告)号：US20060179975A1
公开(公告)日：2006-08-17
申请号：US11340652
申请日：2006-01-27
IPC分类号： B22F1/00
CPC分类号： B22F1/0007 , B22F1/0055 , B22F2998/00 , F28F13/00 , F28F2013/006 , H05K1/092 , B22F1/0011
摘要： A metal powder for a conductive paste has an average particle diameter D50 not greater than 5 μm and an X value defined by equation (1) not greater than 0.5: X value=D50 (μm)/BET specific surface area (m2/g) (1). The metal powder for a conductive paste is particularly preferable when wart-like projections of a diameter not greater than 150 nm are present on the particle surfaces. Typical types of the metal powder include Cu, Ag, Au, Pd, Pt, Ni, Al and alloys thereof. The metal powder for a conductive paste enables fabrication of a conductor having a low void ratio after the paste is fired.
摘要翻译： 用于导电糊的金属粉末的平均粒径D50不大于5μm，由式（1）定义的X值不大于0.5：<线内公式描述=“在线公式”结束= “铅”→X值= D50（母）/ BET比表面积（m 2 SUP / g）（1）。 <？in-line-formula description =“In-line Formulas”end =“tail”？>导电浆料的金属粉末特别优选在颗粒上存在直径不大于150nm的疣形突起 表面。 金属粉末的典型类型包括Cu，Ag，Au，Pd，Pt，Ni，Al及其合金。 用于导电浆料的金属粉末可以在糊料烧制后制造具有低空隙率的导体。
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6.发明授权Low-temperature sintered silver nanoparticle composition and electronic articles formed using the same 有权低温烧结银纳米颗粒组合物和使用其形成的电子制品公开(公告)号：US08673049B2
公开(公告)日：2014-03-18
申请号：US13321675
申请日：2010-08-27
申请人： Gregory A. Jablonski , Michael A. Mastropietro , Kimitaka Sato , Hiromasa Miyoshi , Hidefumi Fujita
发明人： Gregory A. Jablonski , Michael A. Mastropietro , Kimitaka Sato , Hiromasa Miyoshi , Hidefumi Fujita
IPC分类号： C22C5/00
CPC分类号： C22C5/06 , B22F1/0022 , B22F1/0062 , B22F9/24 , B22F2301/255 , B22F2304/054 , B82Y30/00 , C23C24/087 , C23C24/106 , H05K1/097 , H05K2201/0145 , H05K2201/10098 , Y10T428/24802 , Y10T428/24909
摘要： A silver nanoparticle composition is provided which is possible to be sintered through sintering at a low temperature in a short time and to form silver electro conductive film and wiring which is favorable for adhesion to a substrate and low in resistance, and articles using the same are provided. The silver nanoparticle composition is provided, wherein a main component of a solvent is water, a pH of the composition is within a range of 5.3 to 8.0, a silver nanoparticle included in the composition is protected by an organic acid or a derivative thereof, and the content of the organic acid or the derivative thereof with respect to silver is 2 to 20% by mass.
摘要翻译： 提供了一种银纳米颗粒组合物，其可以在短时间内在低温下烧结而烧结，并形成银导电膜和布线，其有利于对基片的粘附和低电阻，并且使用该银导电膜和布线 提供。 提供了银纳米颗粒组合物，其中溶剂的主要组分是水，组合物的pH在5.3至8.0的范围内，组合物中包含的银纳米颗粒被有机酸或其衍生物保护，并且 有机酸或其衍生物相对于银的含量为2〜20质量％。
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