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    Copper powder for conductive paste and method for producing same
    1.
    发明授权
    Copper powder for conductive paste and method for producing same 有权
    导电浆用铜粉及其制造方法

    公开(公告)号：US09248504B2

    公开(公告)日：2016-02-02

    申请号：US13814891

    申请日：2011-09-12

    申请人： Yuki Kaneshiro ,  Shinichi Suenaga ,  Hidefumi Fujita ,  Minoru Kishida

    发明人： Yuki Kaneshiro ,  Shinichi Suenaga ,  Hidefumi Fujita ,  Minoru Kishida

    IPC分类号： B22F9/24 ,  B22F1/00 ,  C22C9/00 ,  H01B1/02 ,  H01B1/22 ,  C22C1/04 ,  B82Y30/00

    CPC分类号： B22F9/24 ,  B22F1/0014 ,  B22F1/0018 ,  B82Y30/00 ,  C22C1/0425 ,  C22C9/00 ,  H01B1/026 ,  H01B1/22

    摘要： There are provided a copper powder for conductive paste, which comprises monodisperse and spherical fine copper particles having a sharp particle size distribution and containing no coarse particles and which can form a thinner electrode film while avoiding a bad influence on electric characteristics thereof, and a method for stably producing such a copper powder for conductive paste. After copper is complexed by adding a complexing agent to an aqueous solution containing copper while blowing air into the solution, the blowing of air is stopped, and then, a reducing agent is added to the solution to deposit copper particles by reduction.

    摘要翻译： 提供了一种用于导电浆料的铜粉末，其包括具有尖锐粒度分布且不含粗粒子的单分散球形细铜颗粒，并且可以形成较薄的电极膜，同时避免对其电特性的不良影响，以及方法 用于稳定地生产这种用于导电浆料的铜粉末。 在通过向含有铜的水溶液中加入络合剂而将铜络合的同时，将空气吹入溶液中，停止吹入空气，然后通过还原将还原剂加入到溶液中以沉积铜颗粒。

    COPPER POWDER FOR CONDUCTIVE PASTE AND METHOD FOR PRODUCING SAME
    2.
    发明申请
    COPPER POWDER FOR CONDUCTIVE PASTE AND METHOD FOR PRODUCING SAME 有权
    用于导电胶的铜粉及其生产方法

    公开(公告)号：US20130177471A1

    公开(公告)日：2013-07-11

    申请号：US13814891

    申请日：2011-09-12

    申请人： Yuki Kaneshiro ,  Shinichi Suenaga ,  Hidefumi Fujita ,  Minoru Kishida

    发明人： Yuki Kaneshiro ,  Shinichi Suenaga ,  Hidefumi Fujita ,  Minoru Kishida

    IPC分类号： B22F9/24

    CPC分类号： B22F9/24 ,  B22F1/0014 ,  B22F1/0018 ,  B82Y30/00 ,  C22C1/0425 ,  C22C9/00 ,  H01B1/026 ,  H01B1/22

    摘要： There are provided a copper powder for conductive paste, which comprises monodisperse and spherical fine copper particles having a sharp particle size distribution and containing no coarse particles and which can form a thinner electrode film while avoiding a bad influence on electric characteristics thereof, and a method for stably producing such a copper powder for conductive paste. After copper is complexed by adding a complexing agent to an aqueous solution containing copper while blowing air into the solution, the blowing of air is stopped, and then, a reducing agent is added to the solution to deposit copper particles by reduction.

    摘要翻译： 提供了一种用于导电浆料的铜粉末，其包括具有尖锐粒度分布且不含粗粒子的单分散球形细铜颗粒，并且可以形成较薄的电极膜，同时避免对其电特性的不良影响，以及方法 用于稳定地生产这种用于导电浆料的铜粉末。 在通过向含有铜的水溶液中加入络合剂而将铜络合的同时，将空气吹入溶液中，停止吹入空气，然后通过还原将还原剂加入到溶液中以沉积铜颗粒。

    CUPROUS OXIDE POWDER AND METHOD FOR PRODUCING SAME
    3.
    发明申请
    CUPROUS OXIDE POWDER AND METHOD FOR PRODUCING SAME 有权
    氧化铝粉及其制造方法

    公开(公告)号：US20140199204A1

    公开(公告)日：2014-07-17

    申请号：US14240069

    申请日：2012-09-13

    申请人： Yuki Kaneshiro ,  Shinichi Suenaga ,  Akihiro Asano

    发明人： Yuki Kaneshiro ,  Shinichi Suenaga ,  Akihiro Asano

    IPC分类号： C01G3/02 ,  B22F9/20 ,  C22C9/00

    CPC分类号： B22F9/20 ,  B22F9/24 ,  C01G3/02 ,  C01P2002/50 ,  C01P2004/03 ,  C01P2004/51 ,  C01P2004/62 ,  C22C9/00 ,  C22C29/12

    摘要： There are provided a cuprous oxide powder having a smaller particle diameter than that of conventional cuprous oxide powders, and a method for producing the cuprous oxide powder by a chemical reducing process. In a method for producing a cuprous oxide powder by adding a reducing agent, such as a reducing sugar, to a solution containing copper hydroxide, which is formed by adding one of an alkali solution and a copper ion containing solution to the other thereof, to deposit cuprous oxide particles by reduction, 0.00001 to 0.04 moles (10 to 40000 ppm) of ferrous ions with respect to the amount of copper ions in the copper ion containing solution are added to the copper ion containing solution before forming copper hydroxide, to produce a cuprous oxide powder which has a mean primary particle diameter of not greater than 0.5 micrometers when it is measured by a scanning electron microscope (SEM), the cuprous oxide powder having a 50% particle diameter (D50 diameter) of not greater than 0.8 micrometers when it is calculated by a laser diffraction type particle size distribution measurement, the cuprous oxide powder containing 0.30 ppm or more of iron.

    摘要翻译： 提供了比常规氧化亚铜粉末小的粒径的氧化亚铜粉末，以及通过化学还原方法制造氧化亚铜粉末的方法。 在通过将还原糖等还原剂添加到通过将碱溶液和含有铜离子的溶液中的一种添加到另一方而形成的含有氢氧化铜的溶液的方法中， 在形成氢氧化铜之前，将含有铜离子的溶液中的铜离子的量，通过还原，将0.00001〜0.04摩尔（10〜40000ppm）的亚铁离子沉积在含铜离子的溶液中， 当通过扫描电子显微镜（SEM）测量时，平均一次粒径不大于0.5微米的氧化亚铜粉末，氧化亚铜粉末的直径为50％（D50直径）不大于0.8微米，当 通过激光衍射型粒度分布测定法计算出含有0.30ppm以上铁的氧化亚铜粉末。

    Cuprous oxide powder and method for producing same
    4.
    发明授权
    Cuprous oxide powder and method for producing same 有权
    氧化亚铜粉及其制造方法

    公开(公告)号：US09211587B2

    公开(公告)日：2015-12-15

    申请号：US14240069

    申请日：2012-09-13

    申请人： Yuki Kaneshiro ,  Shinichi Suenaga ,  Akihiro Asano

    发明人： Yuki Kaneshiro ,  Shinichi Suenaga ,  Akihiro Asano

    IPC分类号： B22F9/00 ,  B22F9/20 ,  C01G3/02 ,  C22C9/00 ,  B22F9/24 ,  C22C29/12

    CPC分类号： B22F9/20 ,  B22F9/24 ,  C01G3/02 ,  C01P2002/50 ,  C01P2004/03 ,  C01P2004/51 ,  C01P2004/62 ,  C22C9/00 ,  C22C29/12

    摘要： There are provided a cuprous oxide powder having a smaller particle diameter than that of conventional cuprous oxide powders, and a method for producing the cuprous oxide powder by a chemical reducing process. In a method for producing a cuprous oxide powder by adding a reducing agent, such as a reducing sugar, to a solution containing copper hydroxide, which is formed by adding one of an alkali solution and a copper ion containing solution to the other thereof, to deposit cuprous oxide particles by reduction, 0.00001 to 0.04 moles (10 to 40000 ppm) of ferrous ions with respect to the amount of copper ions in the copper ion containing solution are added to the copper ion containing solution before forming copper hydroxide, to produce a cuprous oxide powder which has a mean primary particle diameter of not greater than 0.5 micrometers when it is measured by a scanning electron microscope (SEM), the cuprous oxide powder having a 50% particle diameter (D50 diameter) of not greater than 0.8 micrometers when it is calculated by a laser diffraction particle size analysis, the cuprous oxide powder containing 30 ppm or more of iron.

    摘要翻译： 提供了比常规氧化亚铜粉末小的粒径的氧化亚铜粉末，以及通过化学还原方法制造氧化亚铜粉末的方法。 在通过将还原糖等还原剂添加到通过将碱溶液和含有铜离子的溶液中的一种添加到另一方而形成的含有氢氧化铜的溶液的方法中， 在形成氢氧化铜之前，将含有铜离子的溶液中的铜离子的量，通过还原，将0.00001〜0.04摩尔（10〜40000ppm）的亚铁离子沉积在含铜离子的溶液中， 当通过扫描电子显微镜（SEM）测量时，平均一次粒径不大于0.5微米的氧化亚铜粉末，氧化亚铜粉末的直径为50％（D50直径）不大于0.8微米，当 通过激光衍射粒度分析计算出氧化亚铁粉末含有30ppm以上的铁。