Plasma processing apparatus
    1.
    发明授权
    Plasma processing apparatus 有权
    等离子体处理装置

    公开(公告)号:US08940128B2

    公开(公告)日:2015-01-27

    申请号:US12853427

    申请日:2010-08-10

    摘要: The invention aims at suppressing the self bias generated at the surface of the inner wall of the vacuum processing chamber, to thereby suppress the chipping of the inner wall surface of the vacuum processing chamber or the consumption of the inner parts of the vacuum processing chamber. The present invention provides a plasma processing apparatus comprising a vacuum processing chamber, a vacuum processing chamber lid sealing an upper portion of the vacuum processing chamber, an induction antenna, a Faraday shield disposed between the induction antenna and the vacuum processing chamber lid, and a high frequency power supply for supplying high frequency power to the induction antenna, wherein the induction antenna is divided into two or more parts, the Faraday shield is divided into a division number corresponding to the division number of the induction antenna, and high frequency voltages are applied thereto via a matching box from the one high frequency power supply.

    摘要翻译: 本发明旨在抑制在真空处理室的内壁表面产生的自偏压,从而抑制真空处理室的内壁表面的碎裂或真空处理室的内部部分的消耗。 本发明提供一种等离子体处理装置,其包括真空处理室,密封真空处理室的上部的真空处理室盖,感应天线,设置在感应天线和真空处理室盖之间的法拉第屏蔽,以及 用于向感应天线提供高频电力的高频电源,其中感应天线被分成两部分或更多部分,法拉第屏蔽被分成对应于感应天线的分割数的分频数,高频电压是 通过匹配盒从一个高频电源施加到其上。

    PLASMA PROCESSING APPARATUS
    2.
    发明申请
    PLASMA PROCESSING APPARATUS 有权
    等离子体加工设备

    公开(公告)号:US20110297320A1

    公开(公告)日:2011-12-08

    申请号:US12853427

    申请日:2010-08-10

    IPC分类号: H01L21/3065

    摘要: The invention aims at suppressing the self bias generated at the surface of the inner wall of the vacuum processing chamber, to thereby suppress the chipping of the inner wall surface of the vacuum processing chamber or the consumption of the inner parts of the vacuum processing chamber. The present invention provides a plasma processing apparatus comprising a vacuum processing chamber, a vacuum processing chamber lid sealing an upper portion of the vacuum processing chamber, an induction antenna, a Faraday shield disposed between the induction antenna and the vacuum processing chamber lid, and a high frequency power supply for supplying high frequency power to the induction antenna, wherein the induction antenna is divided into two or more parts, the Faraday shield is divided into a division number corresponding to the division number of the induction antenna, and high frequency voltages are applied thereto via a matching box from the one high frequency power supply.

    摘要翻译: 本发明旨在抑制在真空处理室的内壁表面产生的自偏压,从而抑制真空处理室的内壁表面的碎裂或真空处理室的内部部分的消耗。 本发明提供一种等离子体处理装置,其包括真空处理室,密封真空处理室的上部的真空处理室盖,感应天线,设置在感应天线和真空处理室盖之间的法拉第屏蔽,以及 用于向感应天线提供高频电力的高频电源,其中感应天线被分成两部分或更多部分,法拉第屏蔽被分成对应于感应天线的分割数的分频数,高频电压是 通过匹配盒从一个高频电源施加到其上。

    PLASMA PROCESSING APPARATUS
    3.
    发明申请
    PLASMA PROCESSING APPARATUS 审中-公开
    等离子体加工设备

    公开(公告)号:US20110132540A1

    公开(公告)日:2011-06-09

    申请号:US12712795

    申请日:2010-02-25

    IPC分类号: C23F1/08

    CPC分类号: H01L21/67069 H01J37/321

    摘要: A plasma processing apparatus is disclosed in which a wafer mounted on a sample stage arranged in a processing chamber in a vacuum vessel is processed using a plasma formed in the processing chamber. A dielectric bell jar makes up the upper part of the vacuum vessel and surrounds processing chamber. A coil-shaped antenna wound on the outer periphery of the bell jar is supplied with the high-frequency power to form the plasma. A Faraday shield of a conductive material is formed of double layers including inner and outer layers arranged in spaced relation to each other between the antenna and the bell jar, each layer having a plurality of slits and set at a predetermined potential. The slits of the inner and outer layers of the Faraday shield are arranged in staggered fashion.

    摘要翻译: 公开了一种等离子体处理装置,其中使用在处理室中形成的等离子体来处理安装在设置在真空容器中的处理室中的样品台上的晶片。 电介质钟罩组成真空容器的上部,并围绕处理室。 缠绕在钟罩外周的线圈状天线被供给高频电力以形成等离子体。 导电材料的法拉第屏蔽由双层形成,包括在天线和钟罩之间彼此间隔布置的内层和外层,每层具有多个狭缝并设定在预定电位。 法拉第屏蔽层的内层和外层的狭缝以交错的方式布置。

    APPARATUS AND METHOD FOR PLASMA ETCHING
    4.
    发明申请
    APPARATUS AND METHOD FOR PLASMA ETCHING 失效
    用于等离子体蚀刻的装置和方法

    公开(公告)号:US20070184563A1

    公开(公告)日:2007-08-09

    申请号:US11735657

    申请日:2007-04-16

    摘要: A plasma etching method for a plasma etching apparatus including: a processing chamber for performing plasma etching on an object to be processed; a first gas supply source; a second gas supply source; a first gas inlet for introducing a processing gas into the processing chamber; a second gas inlet for introducing a processing gas into the processing chamber; a flow rate regulator for regulating the flow rate of the processing gas; and a gas shunt for dividing the first processing gas into a plurality of portions, wherein the second processing gas is merged with at least one part between the gas shunt and the first gas inlet and between the gas shunt and the second gas inlet.

    摘要翻译: 一种用于等离子体蚀刻装置的等离子体蚀刻方法,包括:处理室,用于对被处理物体进行等离子体蚀刻; 第一气体供应源; 第二气体供应源; 用于将处理气体引入处理室的第一气体入口; 用于将处理气体引入所述处理室的第二气体入口; 用于调节处理气体的流量的流量调节器; 以及用于将所述第一处理气体分成多个部分的气体分流器,其中所述第二处理气体与所述气体分流器和所述第一气体入口之间以及所述气体分流器和所述第二气体入口之间的至少一部分合并。

    Wafer stage for wafer processing apparatus and wafer processing method
    5.
    发明授权
    Wafer stage for wafer processing apparatus and wafer processing method 失效
    晶圆处理装置的晶片台和晶圆加工方法

    公开(公告)号:US06646233B2

    公开(公告)日:2003-11-11

    申请号:US10087747

    申请日:2002-03-05

    IPC分类号: F27B514

    CPC分类号: H01L21/67109 H01L21/6831

    摘要: A wafer stage for use in wafer processing apparatus which comprises a liquid cooling jacket with a built-in coolant liquid circulation path and a ceramic plate that is attached onto the liquid cooling jacket and has therein a heater and an electrode for electrostatic chuck use, the wafer stage performing wafer processing while letting a wafer be mounted on the ceramic plate, wherein the liquid cooling jacket permits attachment of the ceramic plate through a coolant gas circulating gap as formed over the liquid cooling jacket while disposing between the liquid cooling jacket and the ceramic plate more than one heat resistant seal material containing therein an elastic body for sealing the coolant gas.

    摘要翻译: 用于晶片处理装置的晶片台,其包括具有内置冷却剂液体循环路径的液体冷却套和附接到液体冷却套上的陶瓷板,并且其中具有用于静电卡盘的加热器和电极, 在将晶片安装在陶瓷板上的同时进行晶片处理的晶片台,其中液体冷却套管允许通过在液体冷却套上形成的冷却剂气体循环间隙来连接陶瓷板,同时设置在液体冷却套和陶瓷之间 在其上容纳多个耐热密封材料,其中包含用于密封冷却剂气体的弹性体。

    Plasma treatment device
    6.
    发明授权
    Plasma treatment device 有权
    等离子体处理装置

    公开(公告)号:US06245202B1

    公开(公告)日:2001-06-12

    申请号:US09155906

    申请日:1998-10-08

    IPC分类号: C23C1434

    摘要: In a high-frequency inductive plasma etching apparatus, a space between an antenna to which a high-frequency power is fed and a processing chamber is insulated with an insulating material having a suitable thickness, while the antenna is protected from a plasma or a reactive gas for plasma processing and the surface of a side in contact with the plasma is covered by an insulating material such as alumina and quartz. The insulating material and the antenna are placed in a vacuum. Since the processing chamber which contains the insulating material and the antenna can take a pressure differential with atmospheric pressure, all that is required of the insulating material is its capacity to take the plasma atmosphere. Consequently, the insulating material can be made thin and the plasma is generated uniformly in high density. Heat generated at the antenna is dissipated to the outside either by making a gap between the antenna and its surroundings as small as possible or by bringing the pressure of the gap closer to the pressure in the processing chamber. Alternatively, several Torr of a non-reactive heat-transfer promoting gas such as He gas may be introduced into fine gaps formed around the antenna to dissipate heat generated at the antenna.

    摘要翻译: 在高频感应等离子体蚀刻装置中,馈送高频功率的天线与处理室之间的空间与具有适当厚度的绝缘材料绝缘,同时天线被保护免受等离子体或反应性 用于等离子体处理的气体和与等离子体接触的一侧的表面被绝缘材料如氧化铝和石英覆盖。 将绝缘材料和天线置于真空中。 由于包含绝缘材料和天线的处理室可以承受大气压力的压力差,所以绝缘材料所需要的就是其承受等离子体气氛的能力。 因此,可以使绝缘材料变薄,并且以高密度均匀地产生等离子体。 通过在天线及其周围环境之间尽可能小的间隙或通过使间隙的压力更接近处理室中的压力而将在天线处产生的热量散发到外部。 或者,可以将诸如He气体的非反应性热传递促进气体的几个Torr引入形成在天线周围的细小间隙中,以散发在天线处产生的热量。

    Plasma processing method
    8.
    发明授权
    Plasma processing method 有权
    等离子体处理方法

    公开(公告)号:US07833429B2

    公开(公告)日:2010-11-16

    申请号:US11778780

    申请日:2007-07-17

    IPC分类号: B44C1/22

    摘要: A plasma processing method for a plasma processing apparatus which includes, a gas ring, a bell jar, an antenna, a sample table, a Faraday shield, and an RF power source circuit for supplying a power source voltage to the antenna and the Faraday shield. The RF power source circuit includes an RF power source, an antenna connected with the RF power source, a resonance circuit connected in series with the antenna and supplying a resonance voltage, a detection circuit for detecting the resonance voltage of the resonance circuit, and a comparator circuit for comparing the resonance voltage detected by the detection circuit with a predetermined set value. A RF bias voltage is adjusted based on the result of comparison by the comparison circuit.

    摘要翻译: 一种等离子体处理装置的等离子体处理方法,包括气体环,钟罩,天线,样品台,法拉第屏蔽和用于向天线和法拉第屏蔽提供电源电压的RF电源电路 。 RF电源电路包括RF电源,与RF电源连接的天线,与天线串联连接并提供谐振电压的谐振电路,用于检测谐振电路的谐振电压的检测电路,以及 比较器电路,用于将由检测电路检测的谐振电压与预定设定值进行比较。 基于比较电路的比较结果来调整RF偏置电压。

    Plasma Processing Apparatus And Method
    9.
    发明申请
    Plasma Processing Apparatus And Method 有权
    等离子体处理装置及方法

    公开(公告)号:US20100018649A1

    公开(公告)日:2010-01-28

    申请号:US12575514

    申请日:2009-10-08

    IPC分类号: H01L21/3065

    摘要: A plasma processing apparatus includes a sample stage disposed at a lower part of a processing chamber, a bell jar made of an insulative material constituting an upper portion of a vacuum vessel, a coil antenna disposed outside and around the bell jar to which electric power is supplied so as to generate the plasma in a plasma generating space inside of the bell jar, and a Faraday shield mounted on the bell jar and disposed between an external surface of the bell jar and the coil antenna. A ring shaped member made of an electric conductive material is disposed inside of an inner surface of a ring portion of the processing chamber located below a skirt portion of the bell jar and constitutes a part of the processing chamber. The ring shaped member extends upwardly so as to cover a portion of an inner surface of the bell jar.

    摘要翻译: 等离子体处理装置包括设置在处理室的下部的样品台,由构成真空容器的上部的绝缘材料制成的钟罩,设置在电筒的外部和周围的线圈天线 被提供以在钟罩内部的等离子体产生空间中产生等离子体,以及安装在钟罩上并设置在钟罩的外表面和线圈天线之间的法拉第屏蔽。 由导电材料制成的环形构件设置在位于钟罩的裙部下方的处理室的环形部分的内表面的内侧,并构成处理室的一部分。 环形构件向上延伸以覆盖钟罩的内表面的一部分。

    Wafer stage for wafer processing apparatus
    10.
    发明授权
    Wafer stage for wafer processing apparatus 失效
    晶圆处理装置的晶圆台

    公开(公告)号:US06895179B2

    公开(公告)日:2005-05-17

    申请号:US10658280

    申请日:2003-09-10

    CPC分类号: H01L21/67109 H01L21/6831

    摘要: A wafer stage for use in a wafer processing apparatus having a liquid cooling jacket with a built-in coolant liquid circulation path and a ceramic plate as attached onto the liquid cooling jacket and having therein a heater and an electrode for an electrostatic chuck. The wafer stage enables performance of wafer processing while letting a wafer be mounted on the ceramic plate. The liquid cooling jacket enables attachment of the ceramic plate through a gap for circulation of a coolant gas as formed over the liquid cooling jacket, and a heat resistant seal material containing therein an elastic body for sealing the coolant gas between the liquid cooling jacket and the ceramic plate.

    摘要翻译: 一种用于晶片处理装置的晶片台,其具有附接到液体冷却套上的具有内置冷却剂液体循环路径的液体冷却套和陶瓷板,并且其中具有用于静电卡盘的加热器和电极。 晶片台可以在将晶片安装在陶瓷板上的同时实现晶片处理的性能。 液体冷却套管能够通过用于在液体冷却套上形成的冷却剂气体的循环的间隙来安装陶瓷板,以及耐热密封材料,其中容纳有用于将液体冷却套和第二组件之间的冷却剂气体密封的弹性体 陶瓷板。