公开(公告)号：US20100220454A1

公开(公告)日：2010-09-02

申请号：US12714275

申请日：2010-02-26

Applicant: Yuuichi KOGA

Inventor： Yuuichi KOGA

IPC: H05K7/02

CPC classification number: H01L21/563 ,  G06F1/183 ,  H01L22/32 ,  H01L23/3114 ,  H01L2224/16225 ,  H01L2224/73203 ,  H05K1/0268 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/10659 ,  H05K2201/10734 ,  H05K2203/163 ,  Y10T29/4913

Abstract: A printed circuit board including: a semiconductor package; a board; first to fourth electrodes on a second face of the semiconductor package; fifth to eighth electrodes on a mount region of the board; a first conductor connecting the first electrode with the second electrode; a second conductor connecting the third electrode with the fourth electrode; a third conductor connecting the sixth electrode with the seventh electrode; fourth conductors respectively connecting to the fifth electrode and the eighth electrode; conductive bonding portions bonding each of the electrodes on the second face with corresponding one of the electrodes on the mount region; and a determination circuit connected to the fourth conductors and configured to determine a difference between a value of current supplied to one of the fourth conductors and a value of current received through the other fourth conductor.

Abstract translation: 一种印刷电路板，包括：半导体封装; 董事会 在半导体封装的第二面上的第一至第四电极; 在板的安装区域上的第五至第八电极; 连接第一电极和第二电极的第一导体; 连接所述第三电极和所述第四电极的第二导体; 连接第六电极和第七电极的第三导体; 分别连接到第五电极和第八电极的第四导体; 导电接合部分将第二面上的每个电极与安装区域上的电极中的相应一个接合; 以及确定电路，连接到第四导体并且被配置为确定提供给第四导体中的一个的电流的值与通过另一第四导体接收的电流的值之间的差。