公开(公告)号：US11820111B2

公开(公告)日：2023-11-21

申请号：US16758328

申请日：2018-10-23

Applicant: Dow Global Technologies LLC

Inventor： Susan G. Brown ,  Qichun Wan ,  Ronald J. Weeks ,  Mark T. Jablonka ,  Rennisha R. Wickham ,  Colin LiPiShan ,  Miguel Alberto de Jesus Prieto

IPC: B32B27/08 ,  B32B7/12 ,  B32B27/30 ,  B32B27/32 ,  B32B27/40 ,  C08F22/06 ,  C09D5/00 ,  C09D123/08 ,  C09D123/26 ,  C09D125/08 ,  C09D153/00 ,  C09J151/06 ,  C09J153/00

CPC classification number: B32B27/08 ,  B32B7/12 ,  B32B27/308 ,  B32B27/32 ,  B32B27/40 ,  C08F22/06 ,  C09D5/002 ,  C09D123/0815 ,  C09D123/26 ,  C09D125/08 ,  C09D153/005 ,  C09J151/06 ,  C09J153/005 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2310/0831 ,  B32B2323/04 ,  B32B2323/10 ,  B32B2325/00 ,  B32B2333/08 ,  B32B2375/00 ,  B32B2471/00

Abstract: A tile comprising the following components: A) a first film formed from a first composition comprising the following: i) a functionalized olefin-based polymer comprising one or more chemical groups selected from the following: a) a carboxylic acid, and/or b) an anhydride, and, optionally, c) an amino or an amine; and ii) a functionalized styrenic block copolymer, comprising, in polymerized form, styrene, and ethylene and/or at least one alpha-olefin, and comprising one or more chemical groups selected from the following: a) a carboxylic acid, and/or b) an anhydride; and B) a substrate comprising at least one layer formed from a second composition comprising a propylene-based polymer; and wherein the first film covers at least one surface of the substrate.

公开(公告)号：US20180346707A1

公开(公告)日：2018-12-06

申请号：US15777825

申请日：2016-11-23

Applicant: Dow Global Technologies LLC

Inventor： Yongchun Chen ,  Hang Wu ,  Haiyang Yu ,  Weiming Ma ,  Hong Yang ,  Xiao Yi Pang

IPC: C08L53/00 ,  C08L23/26 ,  C08F222/08 ,  C09J151/00 ,  C09J153/00 ,  B32B5/02 ,  B32B27/32

CPC classification number: C08L53/005 ,  B32B5/02 ,  B32B5/022 ,  B32B5/024 ,  B32B7/12 ,  B32B27/12 ,  B32B27/20 ,  B32B27/302 ,  B32B27/32 ,  B32B2250/02 ,  B32B2260/021 ,  B32B2262/0215 ,  B32B2262/0253 ,  B32B2262/0261 ,  B32B2262/0276 ,  B32B2262/0284 ,  B32B2262/0292 ,  B32B2262/062 ,  B32B2262/08 ,  B32B2262/14 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2307/748 ,  B32B2433/02 ,  B32B2439/46 ,  B32B2439/60 ,  B32B2439/70 ,  B32B2597/00 ,  C08F222/08 ,  C08K5/20 ,  C08L23/26 ,  C08L53/025 ,  C08L77/00 ,  C09J123/26 ,  C09J151/003 ,  C09J151/06 ,  C09J153/005 ,  C09J153/025

Abstract: Embodiments of this invention relate to a composition comprising of (A) an anhydride and/or carboxylic acid functionalized, chlorinated olefin-based polymer and/or (b) a styrene-based polymer and/or a functionalized styrene-based polymer, (B) a polyamide wax slurry, and (C) organic solvent, and which composition can be used as an adhesive to bond a fabric to a polyolefin elastomer (POE) thermoplastic sheet, articles made from the composition, and methods of producing the composition and articles.

公开(公告)号：US20180242448A1

公开(公告)日：2018-08-23

申请号：US15896166

申请日：2018-02-14

Applicant: ARISAWA MFG. CO., LTD.

Inventor： Kazuo YOSHIKAWA ,  Makoto TAI ,  Nobuyuki IWANO ,  Takayuki MAYAMA

IPC: H05K1/03 ,  H05K3/00 ,  C08L53/00 ,  C08K3/36 ,  C09J153/00 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20

CPC classification number: H05K1/036 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B2250/02 ,  B32B2250/05 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2379/08 ,  B32B2457/08 ,  C08K3/36 ,  C08K2003/2227 ,  C08L53/005 ,  C09J7/10 ,  C09J7/387 ,  C09J153/005 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2453/00 ,  H05K1/024 ,  H05K1/0373 ,  H05K1/0393 ,  H05K1/09 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/022 ,  H05K3/386 ,  H05K2201/0112 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2201/2063 ,  H05K2203/107

Abstract: The present invention provides a resin composition comprising a specific styrene polymer, a specific inorganic filler, and a curing agent, wherein the styrene polymer is a specific acid-modified styrene polymer, and the resin composition satisfies specific conditions in the form of a film having a thickness of 25 μm.

公开(公告)号：US09796890B2

公开(公告)日：2017-10-24

申请号：US14915526

申请日：2014-08-29

Applicant: KURARAY CO., LTD.

Inventor： Masahiro Kawasaki ,  Isamu Okamoto ,  Eiji Nakamura

IPC: C08F293/00 ,  C09J153/00 ,  C08F8/32 ,  C09J133/24 ,  C09J133/26

CPC classification number: C09J153/005 ,  C08F8/32 ,  C08F293/00 ,  C09J133/24 ,  C09J133/26 ,  C08F293/005

Abstract: A modified acrylic block copolymer is obtained by a method comprising subjecting a block copolymer (C) to a reaction with an amine compound, wherein the block copolymer comprises a polymer block (A) comprising a (meth)acrylic acid ester unit (a) and a polymer block (B′) comprising a (meth)acrylic acid ester unit (b′), the (meth)acrylic acid ester unit (a) is structurally different from the (meth)acrylic acid ester unit (b′), thereby partly or entirely converting the (meth)acrylic acid ester unit (b′) into at least one selected from the group consisting of an N-substituted (meth)acrylamide unit (d), a (meth)acrylic acid unit (c), and an N-substituted bis((meth)acryl)amide unit (e).

公开(公告)号：US20160319169A1

公开(公告)日：2016-11-03

申请号：US15144050

申请日：2016-05-02

Applicant: Avery Dennison Corporation

Inventor： Mark D. GOWER ,  Eric L. BARTHOLOMEW ,  Qiang LUO ,  Charles R. WILLIAMS, JR.

IPC: C09J153/00 ,  C08F293/00

CPC classification number: C09J153/005 ,  C08F2/38 ,  C08F220/18 ,  C08F293/00 ,  C08F293/005 ,  C08F2438/03 ,  C09J153/00 ,  C08F2220/1825 ,  C08F220/06

Abstract: Methods of forming acrylate polymers using emulsion polymerization techniques are described. The resulting acrylate polymers exhibit characteristics enabling their use in adhesives and replacing acrylic polymers formed by solvent-based polymerization methods. Various polymers and adhesives utilizing such polymers are also described.

Abstract translation: 描述了使用乳液聚合技术形成丙烯酸酯聚合物的方法。 所得丙烯酸酯聚合物具有使其能够用于粘合剂和代替通过溶剂基聚合方法形成的丙烯酸聚合物的特性。 还描述了使用这种聚合物的各种聚合物和粘合剂。

公开(公告)号：US20160237329A1

公开(公告)日：2016-08-18

申请号：US15136062

申请日：2016-04-22

Applicant: Henkel AG & Co. KGaA

Inventor： Makoto Takenaka ,  Tadashi Hayakawa

IPC: C09J167/04 ,  C09J7/02 ,  B32B27/36 ,  B32B27/06 ,  B32B27/32 ,  C09J123/22 ,  B32B7/12

CPC classification number: C09J167/04 ,  B32B7/12 ,  B32B27/06 ,  B32B27/32 ,  B32B27/36 ,  B32B2250/02 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2605/003 ,  C08L23/08 ,  C08L23/12 ,  C08L67/04 ,  C08L91/00 ,  C08L2205/04 ,  C09J7/241 ,  C09J7/255 ,  C09J109/00 ,  C09J123/08 ,  C09J123/22 ,  C09J153/005 ,  C09J153/025 ,  C09J2423/00 ,  C09J2467/00 ,  C08L23/16 ,  C08L45/00 ,  C08L51/00 ,  C08L23/142 ,  C08L53/025 ,  C08L23/0815

Abstract: The present invention provides a hot melt adhesive which is excellent in environmental friendliness, thermal stability, adhesion to a polyolefin substrate and a polyester substrate, and heat resistance. The present invention relates to a hot melt adhesive comprising (A) a polar functional group-modified conjugated diene-based polymer, (B) an aliphatic polyester-based resin, (C) an amorphous olefin-based polymer, (D) a crystalline polypropylene resin, and (E) a tackifier resin.

Abstract translation: 本发明提供一种环境友好性，热稳定性，对聚烯烃基材和聚酯基材的粘合性以及耐热性的热熔粘合剂。 本发明涉及一种热熔性粘合剂，其包含（A）极性官能团改性共轭二烯系聚合物，（B）脂肪族聚酯类树脂，（C）无定形烯烃系聚合物，（D）结晶性 聚丙烯树脂，（E）增粘树脂。

公开(公告)号：US20160222192A1

公开(公告)日：2016-08-04

申请号：US15022630

申请日：2014-09-08

Applicant: TOAGOSEI CO., LTD.

Inventor： Masaru TAKASHIMA ,  Yuya OKIMURA ,  Mesashi YAMADA

IPC: C08K5/5357 ,  H05K1/02 ,  H05K3/46 ,  C09J153/00 ,  C09J7/02

CPC classification number: C08K5/5357 ,  B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B27/34 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2405/00 ,  C08K5/0066 ,  C08K5/5317 ,  C09J7/22 ,  C09J7/25 ,  C09J7/30 ,  C09J109/02 ,  C09J109/06 ,  C09J153/005 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2453/00 ,  C09J2477/006 ,  C09J2479/086 ,  H05K1/02 ,  H05K1/0326 ,  H05K3/285 ,  H05K3/305 ,  H05K3/386 ,  H05K3/4611 ,  H05K2201/012

Abstract: The flame-retardant adhesive composition contains a styrene-based elastomer containing a carboxyl group, an epoxy resin, and a phosphorus-containing oligomer including a structural unit represented by general formula (1), and the epoxy resin content is 1-20 parts by mass and the phosphorus-containing oligomer content is 10-50 parts by mass with respect to 100 parts by mass of the styrene-based elastomer containing carboxyl groups. (wherein, R1 and R2 are each independently a hydrogen atom or a methyl group, n is an integer of 1-20.)

Abstract translation: 阻燃性粘合剂组合物含有含有羧基的苯乙烯系弹性体，环氧树脂和含有通式（1）表示的结构单元的含磷低聚物，环氧树脂含量为1-20份 相对于含有羧基的苯乙烯系弹性体100质量份，含磷低聚物含量为10〜50质量份。 （其中，R 1和R 2各自独立地为氢原子或甲基，n为1-20的整数。）

公开(公告)号：US20150337174A1

公开(公告)日：2015-11-26

申请号：US14653143

申请日：2013-12-05

Applicant: TESA SE

Inventor： Klaus Keite-Telgenbüscher ,  Jan Ellinger ,  Judith Grünauer ,  Anika Petersen

IPC: C09J7/02

CPC classification number: C09J7/22 ,  B32B27/14 ,  B32B27/32 ,  B32B2264/10 ,  B32B2405/00 ,  C08K3/08 ,  C08K3/22 ,  C08K3/34 ,  C09J7/29 ,  C09J153/005 ,  C09J153/025 ,  C09J171/00 ,  C09J177/02 ,  C09J177/06 ,  C09J2201/128 ,  C09J2201/20 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/106 ,  C09J2400/123 ,  C09J2400/243 ,  C09J2400/263 ,  C09J2423/006 ,  C09J2423/046 ,  C09J2433/00 ,  C09J2453/00 ,  C09J2463/00 ,  C09J2471/00 ,  H01L23/26 ,  H01L23/3164 ,  H01L51/524 ,  H01L2924/0002 ,  Y10T428/24331 ,  Y10T428/249983 ,  Y10T428/2848 ,  H01L2924/00

Abstract: The aim of the invention is to effectively protect a flat adhesive compound from permeates originating from the surroundings as well as from permeates trapped during lamination, winding, stacking or other processing steps. For this purpose, the adhesive tape comprises at least the following layers in the indicated order: a first outer adhesive compound layer A, a layer B, which contains at least one inorganic getter material, and a second outer adhesive compound layer C. The invention also relates to the use of said adhesive tape as an encapsulation material.

Abstract translation: 本发明的目的是有效地保护扁平的粘合剂化合物免受来自周围环境的渗透物以及在层压，缠绕，堆叠或其它加工步骤期间被捕获的渗透物。 为此目的，粘合带至少包括以下顺序的层：第一外部粘合剂化合物层A，含有至少一种无机吸气剂材料的层B和第二外部粘合剂化合物层C.本发明 还涉及使用所述胶带作为包封材料。

公开(公告)号：US20150329750A1

公开(公告)日：2015-11-19

申请号：US14443115

申请日：2013-11-13

Applicant: ZEON CORPORATION

Inventor： Atsushi Ishiguro ,  Ryuta Kurihara ,  Youhei Koide ,  Daido Chiba

IPC: C09J153/00 ,  C09J123/20

CPC classification number: C09J153/005 ,  C08F287/00 ,  C08L51/00 ,  C08L53/02 ,  C08L53/025 ,  C09J123/20 ,  C09J2423/003 ,  C09J2453/003 ,  H01L31/048 ,  H01L31/0481 ,  Y02E10/50 ,  C08L83/06

Abstract: A resin composition including an alkoxysilyl group-containing hydrogenated block copolymer [3], and a hydrocarbon-based polymer [4] having a number average molecular weight of 300 to 5000, the resin composition including the hydrocarbon-based polymer [4] in an amount of 1 to 50 parts by weight based on 100 parts by weight of the alkoxysilyl group-containing hydrogenated block copolymer [3], the alkoxysilyl group-containing hydrogenated block copolymer [3] being obtained by introducing an alkoxysilyl group into a hydrogenated block copolymer [2] that is obtained by hydrogenating 90% or more of unsaturated bonds of a block copolymer [1] that includes at least two polymer blocks [A] and at least one polymer block [B], and a ratio (wA:wB) of a weight fraction wA of the polymer block [A] in the block copolymer [1] to a weight fraction wB of the polymer block [B] in the block copolymer [1] being 30:70 to 65:35.

Abstract translation: 包含含烷氧基甲硅烷基的氢化嵌段共聚物[3]和数均分子量为300〜5000的烃系聚合物[4]的树脂组合物，包含烃系聚合物[4]的树脂组合物 相对于100重量份含烷氧基甲硅烷基的氢化嵌段共聚物[3]，含有烷氧基甲硅烷基的氢化嵌段共聚物[3]为1〜50重量份，通过将烷氧基甲硅烷基引入氢化嵌段共聚物 [2]是通过使包含至少两个聚合物嵌段[A]和至少一个聚合物嵌段[B]的嵌段共聚物[1]的90％以上的不饱和键氢化而得到的，[wA：wB] 嵌段共聚物[1]中的聚合物嵌段[A]的重量分数wA与嵌段共聚物[1]中的聚合物嵌段[B]的重量分数wB为30:70至65:35。

公开(公告)号：US20150175854A1

公开(公告)日：2015-06-25

申请号：US14380932

申请日：2012-02-29

Applicant: Sergio Corna Galvan ,  Diana Martinez Wichtel ,  Luis Serrano Aviles ,  Montserrat Fernandez Munoz ,  Roderic P. Quirk ,  Vijay Chavan ,  Jonathan Janoski

Inventor： Sergio Corna Galvan ,  Diana Martinez Wichtel ,  Luis Serrano Aviles ,  Montserrat Fernandez Munoz ,  Roderic P. Quirk ,  Vijay Chavan ,  Jonathan Janoski

IPC: C09J153/00 ,  C09D153/00

CPC classification number: C09J153/005 ,  C08C19/02 ,  C08C19/25 ,  C08C19/44 ,  C08F293/005 ,  C08F297/04 ,  C09D153/005

Abstract: The present invention relates primarily to polymers comprising at least one alkenyl aromatic monomer, at least one conjugated diene monomer, and at least one monomer containing silyl hydride moieties, characterized in that said polymers are hydrogenated and preferably functionalized by hydrosilylation reactions between the silyl hydride groups on the polymer chain and the multiple bonds of any alkene or alkyne compound. Besides the described products, this invention comprises their synthesis processes and their uses, especially as thermofusible adhesives, in plastics impact modification, and in chain-extension reactions to obtain new materials, among others.

Abstract translation: 本发明主要涉及包含至少一种烯基芳族单体，至少一种共轭二烯单体和至少一种含甲硅烷基氢化物部分的单体的聚合物，其特征在于所述聚合物被氢化并优选通过甲硅烷基氢化物基团之间的氢化硅烷化反应 在聚合物链和任何烯烃或炔化合物的多重键上。 除了所描述的产品外，本发明包括其合成方法及其用途，特别是作为热熔粘合剂，在塑料冲击改性中，以及在延伸反应中获得新材料等。