公开(公告)号：US20150307758A1

公开(公告)日：2015-10-29

申请号：US14650470

申请日：2013-11-28

Applicant: ZEON CORPORATION

Inventor： Satoshi TAZAKI ,  Motofumi KASHIWAGI ,  Atsushi ISHIGURO ,  Yohei KOIDE

IPC: C09K3/10 ,  H01L51/52 ,  H01L51/00

CPC classification number: C09K3/10 ,  C08F297/04 ,  C08L53/025 ,  C09K2200/0645 ,  H01L51/0043 ,  H01L51/448 ,  H01L51/5237 ,  H01L51/5246 ,  H01L51/5256 ,  Y02E10/549

Abstract: An organic electronic device sealing resin composition including a block copolymer hydride obtained by hydrogenating 90% or more of all unsaturated bonds of a block copolymer, wherein the block copolymer includes: two or more polymer blocks [A] per one molecule of the copolymer, the block having an aromatic vinyl compound unit as a main component; and one or more polymer blocks [B] per one molecule of the copolymer, the block having a linear conjugated diene compound unit as a main component, and a ratio between a weight fraction wA of all the polymer blocks [A] in the entire block copolymer and a weight fraction wB of all the polymer blocks [B] in the entire block copolymer (wA:wB) is 20:80 to 60:40.

Abstract translation: 一种包含嵌段共聚物氢化物的有机电子器件密封树脂组合物，其通过使嵌段共聚物的所有不饱和键的90％以上的氢化而得到，其中所述嵌段共聚物包括：每一分子共聚物中含有两个或更多个聚合物嵌段[A] 具有芳族乙烯基化合物单元作为主要成分的嵌段; 和每一分子共聚物中的一种或多种聚合物嵌段[B]，具有线性共轭二烯化合物单元作为主要成分的嵌段和整个嵌段中所有聚合物嵌段[A]的重量分数w A之比 共聚物和整个嵌段共聚物（wA：wB）中的所有聚合物嵌段[B]的重量分数wB为20:80至60:40。

公开(公告)号：US20190139673A1

公开(公告)日：2019-05-09

申请号：US16306655

申请日：2017-06-23

Applicant: ZEON CORPORATION

Inventor： Kenichi HARAI ,  Satoshi TAZAKI ,  Kazuyuki OBUCHI

IPC: H01B5/14 ,  H01B3/44 ,  C08F297/04 ,  C08J5/18 ,  C08J7/04 ,  C09D5/24 ,  C09D165/00

Abstract: An electroconductive film including a resin layer and an electroconductive layer, wherein the resin layer has a storage elastic modulus at 25° C. of more than 10 MPa and less than 1,000 MPa, and the electroconductive layer has a surface resistance value of 1,000 Ω/sq. or less.

公开(公告)号：US20160343970A1

公开(公告)日：2016-11-24

申请号：US15108138

申请日：2014-12-25

Applicant: ZEON CORPORATION

Inventor： Satoshi TAZAKI ,  Hiroyasu INOUE ,  Atsushi ISHIGURO ,  Yohei KOIDE

IPC: H01L51/52 ,  B32B27/32 ,  B32B27/08 ,  B32B27/30 ,  B32B7/02 ,  B32B7/12

CPC classification number: H01L51/524 ,  B32B3/08 ,  B32B7/02 ,  B32B7/04 ,  B32B7/10 ,  B32B7/12 ,  B32B27/08 ,  B32B27/28 ,  B32B27/302 ,  B32B27/32 ,  B32B2250/03 ,  B32B2307/40 ,  B32B2307/416 ,  B32B2307/418 ,  B32B2307/42 ,  B32B2307/51 ,  B32B2307/54 ,  B32B2405/00 ,  B32B2457/20 ,  B32B2457/206 ,  B32B2581/00 ,  G02B5/3083 ,  H01L27/1248 ,  H01L29/786 ,  H01L51/5281

Abstract: A sealing film including a substrate film, a sealing layer, and an adhesive layer in this order, wherein the sealing film has a tensile elastic modulus of equal to or higher than 1,000 MPa, and retardation of a layer portion provided at the sealing layer side relative to the substrate film in the sealing film after sealing is equal to or smaller than 20 nm.

Abstract translation: 一种密封膜，其特征在于，上述密封膜的拉伸弹性模量为1000MPa以上，所述密封层侧设置的层部的相位差 相对于密封后的密封膜中的基板膜等于或小于20nm。