公开(公告)号：US20150307758A1

公开(公告)日：2015-10-29

申请号：US14650470

申请日：2013-11-28

Applicant: ZEON CORPORATION

Inventor： Satoshi TAZAKI ,  Motofumi KASHIWAGI ,  Atsushi ISHIGURO ,  Yohei KOIDE

IPC: C09K3/10 ,  H01L51/52 ,  H01L51/00

CPC classification number: C09K3/10 ,  C08F297/04 ,  C08L53/025 ,  C09K2200/0645 ,  H01L51/0043 ,  H01L51/448 ,  H01L51/5237 ,  H01L51/5246 ,  H01L51/5256 ,  Y02E10/549

Abstract: An organic electronic device sealing resin composition including a block copolymer hydride obtained by hydrogenating 90% or more of all unsaturated bonds of a block copolymer, wherein the block copolymer includes: two or more polymer blocks [A] per one molecule of the copolymer, the block having an aromatic vinyl compound unit as a main component; and one or more polymer blocks [B] per one molecule of the copolymer, the block having a linear conjugated diene compound unit as a main component, and a ratio between a weight fraction wA of all the polymer blocks [A] in the entire block copolymer and a weight fraction wB of all the polymer blocks [B] in the entire block copolymer (wA:wB) is 20:80 to 60:40.

Abstract translation: 一种包含嵌段共聚物氢化物的有机电子器件密封树脂组合物，其通过使嵌段共聚物的所有不饱和键的90％以上的氢化而得到，其中所述嵌段共聚物包括：每一分子共聚物中含有两个或更多个聚合物嵌段[A] 具有芳族乙烯基化合物单元作为主要成分的嵌段; 和每一分子共聚物中的一种或多种聚合物嵌段[B]，具有线性共轭二烯化合物单元作为主要成分的嵌段和整个嵌段中所有聚合物嵌段[A]的重量分数w A之比 共聚物和整个嵌段共聚物（wA：wB）中的所有聚合物嵌段[B]的重量分数wB为20:80至60:40。

公开(公告)号：US20170203471A1

公开(公告)日：2017-07-20

申请号：US15476446

申请日：2017-03-31

Applicant: TOYAMA PREFECTURE ,  KYORITSU CHEMICAL & CO., LTD. ,  ZEON CORPORATION

Inventor： Tsutomu OBATA ,  Yoshiyuki YOKOYAMA ,  Masaaki NASUNO ,  Mikiharu KUCHIKI ,  Tomoshi AONO ,  Motofumi KASHIWAGI

IPC: B29C33/42 ,  B29C59/00 ,  B29C33/38

CPC classification number: B29C33/424 ,  B29C33/38 ,  B29C33/3842 ,  B29C59/002 ,  B29C2033/426 ,  B29K2845/00 ,  B29K2995/0026 ,  G03F7/0002

Abstract: An imprint template is used for photocuring imprinting, and includes a support plate that is transparent with respect to an exposure wavelength used for photocuring imprinting, and has flexibility; a buffer resin layer that is formed on the support plate, and is formed of an elastic material that is transparent with respect to the exposure wavelength; and a resin film mold that is removably bonded to the buffer resin layer, and is transparent with respect to the exposure wavelength, wherein a concave-convex transfer pattern is formed on a surface of the resin film mold.