公开(公告)号：US07694718B2

公开(公告)日：2010-04-13

申请号：US11309811

申请日：2006-10-02

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Yi-San Liu

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Yi-San Liu

IPC分类号： F28D15/00 ,  H05K7/20

CPC分类号： F28D15/0275 ,  F28D15/0233 ,  F28F1/12 ,  F28F3/02 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink includes a first plate having a top portion and a bottom portion, a second plate projecting from the top portion of the first plate, and a plurality of fins thermally contacting the second plate. The second plate has a width larger than that of the first plate. The heat pipe includes a first portion embedded in the bottom portion of the first plate for directly contacting an electronic component to be cooled, and a second portion bent from one end of the first portion. The second portion is located at one side of the first plate, while the first portion of the heat pipe is located at a middle of the first plate.

摘要翻译： 散热器包括具有顶部和底部的第一板，从第一板的顶部突出的第二板和与第二板热接触的多个翅片。 第二板的宽度大于第一板的宽度。 热管包括嵌入在第一板的底部中的第一部分，用于直接接触待冷却的电子部件和从第一部分的一端弯曲的第二部分。 第二部分位于第一板的一侧，而热管的第一部分位于第一板的中间。

公开(公告)号：US20080150126A1

公开(公告)日：2008-06-26

申请号：US11615917

申请日：2006-12-22

申请人： ZHI-YONG ZHOU ,  Cheng-Tien Lai ,  Yi-San Liu

发明人： ZHI-YONG ZHOU ,  Cheng-Tien Lai ,  Yi-San Liu

IPC分类号： H01L23/34

CPC分类号： F21K9/00 ,  F21V29/51 ,  F21V29/763 ,  F21V29/83 ,  F21Y2105/10 ,  F21Y2115/10 ,  F28D15/0275

摘要： A light emitting diode (LED) module with a heat dissipation device includes a plurality of LEDs supported by the heat dissipation device. The heat dissipation device includes a plurality of heat spreaders each supporting at least one LED, a base supporting the heat spreaders, and a heat pipe sandwiched between the base and the heat spreaders. The heat spreaders are thermally connected together via the heat pipe.

摘要翻译： 具有散热装置的发光二极管（LED）模块包括由散热装置支撑的多个LED。 散热装置包括多个散热器，每个散热器支撑至少一个LED，支撑散热器的基座和夹在基座和散热器之间的热管。 散热器通过热管热连接在一起。

公开(公告)号：US20070217153A1

公开(公告)日：2007-09-20

申请号：US11308230

申请日：2006-03-14

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Yi-San Liu

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Yi-San Liu

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a heat conducting plate (100) for contacting with an electronic component (400), a heat sink (200) mounted on the heat conducting plate and a heat pipe (300). The heat conducting plate comprises a groove (110) defined in. The heat pipe comprises an evaporating portion (310) sandwiched between the heat conducting plate and the heat sink, and a condensing portion (320) thermally connecting with the heat sink. The evaporating portion comprises a middle portion (3104) having a circular cross section and accommodated in the groove of the heat conducting plate, and a pair of end portions (3102) formed on opposite sides of the middle portion. The end portions have flat bottom surfaces.

摘要翻译： 一种散热装置，包括用于与电子部件（400）接触的导热板（100），安装在导热板上的散热片（200）和热管（300）。 导热板包括限定在其中的凹槽（110）。热管包括夹在导热板和散热器之间的蒸发部分（310）和与散热器热连接的冷凝部分（320）。 蒸发部包括具有圆形横截面并容纳在导热板的槽中的中间部分（3104）和形成在中间部分的相对侧上的一对端部（3102）。 端部具有平坦的底面。

公开(公告)号：US07440279B2

公开(公告)日：2008-10-21

申请号：US11308230

申请日：2006-03-14

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Yi-San Liu

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Yi-San Liu

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a heat conducting plate (100) for contacting with an electronic component (400), a heat sink (200) mounted on the heat conducting plate and a heat pipe (300). The heat conducting plate comprises a groove (110) defined in. The heat pipe comprises an evaporating portion (310) sandwiched between the heat conducting plate and the heat sink, and a condensing portion (320) thermally connecting with the heat sink. The evaporating portion comprises a middle portion (3104) having a circular cross section and accommodated in the groove of the heat conducting plate, and a pair of end portions (3102) formed on opposite sides of the middle portion. The end portions have flat bottom surfaces.

摘要翻译： 一种散热装置，包括用于与电子部件（400）接触的导热板（100），安装在导热板上的散热片（200）和热管（300）。 导热板包括限定在其中的凹槽（110）。热管包括夹在导热板和散热器之间的蒸发部分（310）和与散热器热连接的冷凝部分（320）。 蒸发部包括具有圆形横截面并容纳在导热板的槽中的中间部分（3104）和形成在中间部分的相对侧上的一对端部（3102）。 端部具有平坦的底面。

公开(公告)号：US07694721B2

公开(公告)日：2010-04-13

申请号：US11309612

申请日：2006-08-31

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： F28F7/00 ,  H05K7/20

CPC分类号： H01L23/473 ,  H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

摘要： A miniature liquid cooling device includes a casing (10) having a base (16) attached on a heat-generating electronic component for absorbing heat generated by the electronic component. The casing includes an outer wall (12) mounted on the base and a top cover (15) mounted on the outer wall. A receiving space is enclosed by the casing. A heat-absorbing member (40) is attached on the base and received in the receiving space for exchanging heat with liquid in the casing. An impeller (21) is rotatably mounted in the receiving space and above the heat-absorbing member. When the impeller rotates the liquid is driven to flow into the liquid cooling device via a liquid inlet (122) and then flow through the heat-absorbing member and finally flow out of the liquid cooling device via a liquid outlet (124).

摘要翻译： 微型液体冷却装置包括壳体（10），其具有附接在发热电子部件上的基部（16），用于吸收由电子部件产生的热量。 壳体包括安装在基座上的外壁（12）和安装在外壁上的顶盖（15）。 收容空间由外壳封闭。 吸热构件（40）安装在基座上并被容纳在容纳空间中以与壳体内的液体进行热交换。 叶轮（21）可旋转地安装在容纳空间中并且在吸热构件上方。 当叶轮旋转时，驱动液体经由液体入口（122）流入液体冷却装置，然后流过吸热构件，并最终经由液体出口（124）从液体冷却装置流出。

公开(公告)号：US07584781B2

公开(公告)日：2009-09-08

申请号：US11309491

申请日：2006-08-11

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou

IPC分类号： F28F7/00 ,  F28F3/12 ,  H05K7/20

CPC分类号： F28F3/086 ,  F28F3/12 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A liquid cooling device includes a base, a housing and a heat exchanger. The base and the housing enclose a chamber which receives the heat exchanger therein. Inlet and outlet for liquid are provided at the housing. The heat exchanger includes stacked flakes. Each flake includes parallel and alternately arranged first and second strips each having a void defined therein. The flakes are stacked in a manner such that each first strip overlays and abuts against a corresponding second strip of an adjacent flake and that the void in each first strip and the void in the corresponding second strip of the adjacent flake are in fluid communication with each other to thereby form a channel between the inlet and the outlet.

摘要翻译： 液体冷却装置包括基座，壳体和热交换器。 基座和壳体包围容纳热交换器的腔室。 在壳体处设有用于液体的入口和出口。 热交换器包括堆积的薄片。 每个薄片包括平行且交替布置的第一和第二条带，每个带有限定在其中的空隙。 薄片以这样的方式堆叠，使得每个第一条覆盖并邻接相邻片状物的对应的第二条带，并且每个第一条带中的空隙和相邻片状物的相应第二条带中的空隙与每个 从而在入口和出口之间形成通道。

公开(公告)号：US07447029B2

公开(公告)日：2008-11-04

申请号：US11308231

申请日：2006-03-14

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A vapor chamber includes a base (100) for contacting a heat-generating component (500), a cover (200), a first porous capillary sheet (300) located in the base and a second porous capillary sheet (400) located in the cover and facing the first porous capillary sheet. The base comprises a block (130) extending from the base to thermally connect with the cover. The cover is mounted on the base and forms a hermetically sealed container together with the base. The first and second porous capillary sheets together form an enclosure and are contained in the container, and the block extends through the first and second porous capillary sheets and engage therewith.

摘要翻译： 蒸气室包括用于接触发热部件（500），盖（200），位于基座中的第一多孔毛细管板（300）和位于所述第二多孔毛细管板（400）中的基座（100） 覆盖并面向第一多孔毛细管片。 基座包括从基座延伸以与盖子热连接的块体（130）。 盖子安装在基座上，与基座一起形成一个密封的容器。 第一和第二多孔毛细管片一起形成外壳并容纳在容器中，并且块延伸穿过第一和第二多孔毛细管片并与其接合。

公开(公告)号：US20080053641A1

公开(公告)日：2008-03-06

申请号：US11309612

申请日：2006-08-31

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： B29C47/88 ,  F24H3/02

CPC分类号： H01L23/473 ,  H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

摘要： A miniature liquid cooling device includes a casing (10) having a base (16) attached on a heat-generating electronic component for absorbing heat generated by the electronic component. The casing includes an outer wall (12) mounted on the base and a top cover (15) mounted on the outer wall. A receiving space is enclosed by the casing. A heat-absorbing member (40) is attached on the base and received in the receiving space for exchanging heat with liquid in the casing. An impeller (21) is rotatably mounted in the receiving space and above the heat-absorbing member. When the impeller rotates the liquid is driven to flow into the liquid cooling device via a liquid inlet (122) and then flow through the heat-absorbing member and finally flow out of the liquid cooling device via a liquid outlet (124).

摘要翻译： 微型液体冷却装置包括壳体（10），其具有附接在发热电子部件上的基部（16），用于吸收由电子部件产生的热量。 壳体包括安装在基座上的外壁（12）和安装在外壁上的顶盖（15）。 收容空间由外壳封闭。 吸热构件（40）安装在基座上并被容纳在容纳空间中以与壳体内的液体进行热交换。 叶轮（21）可旋转地安装在容纳空间中并且在吸热构件上方。 当叶轮旋转时，驱动液体经由液体入口（122）流入液体冷却装置，然后流过吸热构件，并最终经由液体出口（124）从液体冷却装置流出。

公开(公告)号：US07301774B2

公开(公告)日：2007-11-27

申请号：US11210130

申请日：2005-08-23

申请人： Hsieh-Kun Lee ,  Cheng-Tien Lai ,  Shao-Long Zhai ,  Zhi-Yong Zhou

发明人： Hsieh-Kun Lee ,  Cheng-Tien Lai ,  Shao-Long Zhai ,  Zhi-Yong Zhou

IPC分类号： H05K7/20 ,  H01L23/34 ,  F28F7/00

CPC分类号： H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

摘要： A locking device for securing a heat sink to a heat generating component includes a locking plate, a plurality of locking feet each pivotably attached to the locking plate and a plurality of locking members attached to the locking feet. Adjacent two of the plurality of locking feet are capable of rotating towards each other from a first position at which the locking feet are located apart from each other with the locking members defining a first mounting position to a second position at which the locking feet are stacked together with the locking members defining a second mounting position.

摘要翻译： 用于将散热器固定到发热部件的锁定装置包括锁定板，多个锁定脚，每个锁定脚可枢转地附接到锁定板，以及多个锁定构件，其连接到锁定脚。 多个锁定脚中的相邻的两个能够从锁定脚彼此分开的第一位置朝向彼此旋转，锁定构件将第一安装位置限定到锁定脚堆叠的第二位置 以及限定第二安装位置的锁定构件。

公开(公告)号：US20070165380A1

公开(公告)日：2007-07-19

申请号：US11306896

申请日：2006-01-16

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A memory module assembly (1) includes a printed circuit board (30) having an electronic heat-generating component (40) thereon, a heat sink (20) and a clip (10) for securing the heat sink onto the heat-generating component mounted on the printed circuit board. The heat sink includes a base (22) and a plurality of fins (24) arranged on the base. A recess (28) is defined extending across the fins. The clip includes a retaining portion (12) resting against a face of the printed circuit board opposite the heat sink and an elastic pressing portion (16) spaced from the retaining portion. The pressing portion is received in the recess of the heat sink and resiliently presses the base of the heat sink toward the heat-generating component, whereby the clip clamps the heat sink and the printed circuit board therebetween.

摘要翻译： 存储模块组件（1）包括其上具有电子发热部件（40）的印刷电路板（30），散热器（20）和夹子（10），用于将散热器固定到发热部件 安装在印刷电路板上。 散热器包括基座（22）和布置在基座上的多个翅片（24）。 限定延伸穿过翅片的凹部（28）。 夹子包括一个保持部分（12），该保持部分靠在与散热器相对的印刷电路板的表面上，以及与保持部分间隔的弹性按压部分（16）。 按压部分被容纳在散热器的凹部中，并将散热片的基座弹性地压向发热部件，由此夹子将散热片和印刷电路板夹在其间。