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    METHODS AND APPARATUS FOR POLISHING A NOTCH OF A SUBSTRATE BY SUBSTRATE VIBRATION
    1.
    发明申请
    METHODS AND APPARATUS FOR POLISHING A NOTCH OF A SUBSTRATE BY SUBSTRATE VIBRATION 审中-公开
    用于通过基板振动抛光基板的方法和装置

    公开(公告)号：US20080293337A1

    公开(公告)日：2008-11-27

    申请号：US12124133

    申请日：2008-05-20

    申请人： Zhenhua Zhang ,  Sen-Hou Ko

    发明人： Zhenhua Zhang ,  Sen-Hou Ko

    IPC分类号： B24B1/00

    CPC分类号： B24B1/04 ,  B24B9/065

    摘要： Apparatus and methods are provided for polishing a notch on an edge of a substrate. An exemplary apparatus may include a substrate support adapted to support a substrate; a polishing head adapted to contact a notch in an edge of the substrate; and a controller adapted to oscillate the substrate between at least first and second oscillatory positions while the polishing head contacts the substrate notch. Numerous other aspects are provided.

    摘要翻译： 提供了用于抛光衬底边缘上的凹口的装置和方法。 示例性装置可以包括适于支撑衬底的衬底支撑件; 抛光头，其适于接触所述基板的边缘中的凹口; 以及控制器，其适于在所述抛光头接触所述基板凹口的同时在至少第一和第二振荡位置之间振荡所述基板。 提供了许多其他方面。

    METHODS AND APPARATUS FOR CONTROLLING THE SIZE OF AN EDGE EXCLUSION ZONE OF A SUBSTRATE
    3.
    发明申请
    METHODS AND APPARATUS FOR CONTROLLING THE SIZE OF AN EDGE EXCLUSION ZONE OF A SUBSTRATE 审中-公开
    用于控制基板边缘排除区尺寸的方法和装置

    公开(公告)号：US20080293333A1

    公开(公告)日：2008-11-27

    申请号：US12124132

    申请日：2008-05-20

    申请人： Zhenhua Zhang ,  Eashwer Kollata ,  Sen-Hou Ko

    发明人： Zhenhua Zhang ,  Eashwer Kollata ,  Sen-Hou Ko

    IPC分类号： B24B1/00

    CPC分类号： B24B49/02 ,  B24B37/042

    摘要： In some embodiments, a method of controlling a width of an edge exclusion zone of a substrate is provided. The method includes determining a range of angles over which to rotate a polishing head; rotating the polishing head over the determined range of angles to achieve a preset width for an edge exclusion zone of the substrate; and polishing an edge of the substrate with the polishing head. Numerous other aspects are provided.

    摘要翻译： 在一些实施例中，提供了控制衬底的边缘排除区的宽度的方法。 该方法包括确定旋转抛光头的角度范围; 在所确定的角度范围内旋转抛光头以实现衬底的边缘排除区的预设宽度; 并用抛光头抛光衬底的边缘。 提供了许多其他方面。

    METHODS AND APPARATUS FOR CLEANING A SUBSTRATE EDGE USING CHEMICAL AND MECHANICAL POLISHING
    4.
    发明申请
    METHODS AND APPARATUS FOR CLEANING A SUBSTRATE EDGE USING CHEMICAL AND MECHANICAL POLISHING 审中-公开
    清洗使用化学和机械抛光的基板边缘的方法和装置

    公开(公告)号：US20080207093A1

    公开(公告)日：2008-08-28

    申请号：US12039418

    申请日：2008-02-28

    申请人： Sen-Hou Ko ,  Zhenhua Zhang ,  Yufei Chen ,  Wei-Yung Hsu

    发明人： Sen-Hou Ko ,  Zhenhua Zhang ,  Yufei Chen ,  Wei-Yung Hsu

    IPC分类号： B24B9/02 ,  B24B57/02

    CPC分类号： B24B9/065 ,  B24B57/02

    摘要： Methods and apparatus are provided for concurrently chemically and mechanically polishing a substrate edge. The invention includes a substrate support adapted to rotate a substrate; a polishing head adapted to contact an edge of the substrate, the polishing head including a first channel adapted to apply a first fluid to the edge of the substrate; a second channel adapted to direct a second fluid onto a major surface of the rotating substrate; and a third channel adapted to direct a third fluid at the major surface of the substrate and to prevent the second fluid from diluting the first fluid. Numerous other aspects are provided.

    摘要翻译： 提供了用于同时化学和机械抛光衬底边缘的方法和装置。 本发明包括适于旋转衬底的衬底支撑件; 抛光头，其适于接触所述基底的边缘，所述抛光头包括适于将第一流体施加到所述基底的边缘的第一通道; 第二通道，其适于将第二流体引导到所述旋转基板的主表面上; 以及第三通道，其适于在基底的主表面处引导第三流体并防止第二流体稀释第一流体。 提供了许多其他方面。

    METHODS AND APPARATUS FOR LOW COST AND HIGH PERFORMANCE POLISHING TAPE FOR SUBSTRATE BEVEL AND EDGE POLISHING IN SEMINCONDUCTOR MANUFACTURING
    8.
    发明申请
    METHODS AND APPARATUS FOR LOW COST AND HIGH PERFORMANCE POLISHING TAPE FOR SUBSTRATE BEVEL AND EDGE POLISHING IN SEMINCONDUCTOR MANUFACTURING 审中-公开
    低成本和高性能抛光胶带的方法和装置，用于在晶体管制造中进行基板水平和边缘抛光

    公开(公告)号：US20080293331A1

    公开(公告)日：2008-11-27

    申请号：US12124153

    申请日：2008-05-21

    申请人： Yufei Chen ,  Zhenhua Zhang ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Makoto Matsuo

    发明人： Yufei Chen ,  Zhenhua Zhang ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Makoto Matsuo

    IPC分类号： B24B9/06 ,  C08J5/14

    CPC分类号： B24B9/065 ,  B24B21/002

    摘要： Apparatus and methods are provided relating to polishing a substrate using a polishing device, such as a polishing tape. The polishing device may be formed to include a base, a resin layer adhering to the base, and a plurality of embossed abrasive particles and/or abrasive beads affixed to the base by the resin layer. The plurality of abrasive particles and/or beads may be embossed in the resin layer. The plurality of abrasive beads may include a plurality of abrasive particles suspended in binder material. The plurality of abrasive particles and/or beads and the resin layer combine to form an abrasive side of the polishing device adapted to contact the substrate. Polishing of the substrate preferably includes polishing an edge of the substrate while the substrate is rotated by a holding device such that no apparatus other than the polishing tape contacts the edge while the substrate is rotating.

    摘要翻译： 提供的装置和方法涉及使用诸如抛光带的抛光装置来抛光衬底。 抛光装置可以形成为包括基底，粘附到基底的树脂层和由树脂层固定到基底的多个压花磨料颗粒和/或研磨珠。 多个研磨颗粒和/或珠可以在树脂层中压花。 多个研磨珠可以包括悬挂在粘合剂材料中的多个磨料颗粒。 多个研磨颗粒和/或珠粒和树脂层组合形成适于接触基底的抛光装置的研磨侧。 衬底的抛光优选包括在通过保持装置旋转衬底的同时抛光衬底的边缘，使得除了研磨带之外的其它装置在衬底旋转时不接触边缘。

    Apparatus for conditioning processing pads
    10.
    发明授权
    Apparatus for conditioning processing pads 有权
    用于调理加工垫的装置

    公开(公告)号：US07828626B2

    公开(公告)日：2010-11-09

    申请号：US12248302

    申请日：2008-10-09

    申请人： Paul D. Butterfield ,  Sen-Hou Ko

    发明人： Paul D. Butterfield ,  Sen-Hou Ko

    IPC分类号： B24B53/00

    CPC分类号： B24B53/017 ,  B24B53/12

    摘要： Embodiments of an apparatus for conditioning a processing pad are provided. In one embodiment, an apparatus for conditioning a processing pad includes a member having a bottom surface selectively maintained in a non-planar orientation and an abrasive disposed on the bottom surface of the member. The abrasive is configured for conditioning a processing pad. The member and abrasive have a profile that produces a non-planar processing pad surface.

    摘要翻译： 提供了一种用于调理处理垫的装置的实施例。 在一个实施例中，用于调理处理垫的装置包括具有选择性地保持在非平面取向的底表面和设置在构件的底表面上的研磨件的构件。 研磨剂配置用于调理加工垫。 构件和磨料具有产生非平面加工垫表面的轮廓。